DA70131-1/3E
VI-2
3. Precautions for mounting
3-1. Precautions about G9001A and G9002A
(1) Plastic packages absorb moisture easily. Even if they are stored indoors, they will absorb moisture as time
passes. Putting the packages in to a solder reflow furnace while they contain moisture may cause cracks in
plastic case or deteriorate the bonding between the plastic case and the frame.
The storage warranty period is one year as long as the moisture barrier bags are not opened.
(2) If you are worried about moisture absorption, dry the chip packages thoroughly before reflowing the solder.
Dry the packages for 20 to 36 hours at 125+/-5°C. The packages should not be dried more than two times.
(3) To heat the entire package for soldering, such as infrared or superheated air reflow, make sure to observe the
following conditions and do not reflow more than two times.
- Temperature profile
The temperature profile of an infrared reflow furnace must be within the range shown in the figure below.
(The temperatures shown are the temperature at the surface of the plastic package.)
- Maximum temperature
The maximum allowable temperature at the surface of the plastic package is 260°C peak [A profile]. The
temperature must not exceed 250°C [A profile] for more than 10 seconds. In order to decrease the heat
stress load on the packages, keep the temperature as low as possible and as short as possible, while
maintaining the proper conditions for soldering.
(4) Solder dipping causes rapid temperature changes in the packages and may damage the devices. Therefore,
do not use this method.
Less than 10 seconds at 250
o
C
Max. peak temperature 260
o
C
Package body temperature °C
Preliminary
heating
140 to 200
o
C
60 to 120 sec.
Main heating
220
o
C or higher
Less than 35 sec.
Time
[A profile (applied to lead-free soldering)]
Содержание Motionnet G9001A
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