NSW-6
System Module SE2
PAMS Technical Documentation
Page 64
Issue 1 12/99
Nokia Mobile Phones Ltd.
C918
2320939 Ceramic cap.
16 V 0402
C919
2320921 Ceramic cap.
3.9 p
5 % 16 V 0402
C920
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C921
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C922
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C923
2320530 Ceramic cap.
5.6 p
0.25 % 50 V 0402
C931
2320520 Ceramic cap.
2.2 p
0.25 % 50 V 0402
C932
2320629 Ceramic cap.
50 V 0402
C934
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C937
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C938
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C939
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C941
2320544 Ceramic cap.
22 p
5 % 50 V 0402
C943
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C949
2320522 Ceramic cap.
2.7 p
0.25 % 50 V 0402
C950
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C951
2320584 Ceramic cap.
1.0 n
5 % 50 V 0402
C952
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C953
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C960
2312401 Ceramic cap.
1.0 u
10 % 10 V 0805
C961
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C962
2320544 Ceramic cap.
22 p
5 % 50 V 0402
C963
2320481 Ceramic cap.
5R 1 u
10 % 0603
C965
2320903 Ceramic cap.
2.7 p
5 % 16 V 0402
C966
2320903 Ceramic cap.
2.7 p
5 % 16 V 0402
C967
2320532 Ceramic cap.
6.8 p
0.25 % 50 V 0402
C968
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C969
2320805 Ceramic cap.
100 n
10 % 10 V 0402
C981
2320520 Ceramic cap.
2.2 p
0.25 % 50 V 0402
C982
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C983
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C984
2320536 Ceramic cap.
10 p
5 % 50 V 0402
L701
3645213 Chip coil
22 n
5 % Q=38/250 MHz
0603
L702
3643039 Chip coil
220 n
5 % Q=35/100 MHz
0805
L703
3645241 Chip coil
12 n
5 % Q=35/250 MHz
0603
L705
3641626 Chip coil
220 n
2 % Q=50/250 MHz
0805
L721
3645249 Chip coil
3 n
5 % Q=22/250 MHz
0603
L723
3645157 Chip coil
100 n
10 % Q=12/100 MHz
0603
L724
3640701 Chip coil
470 n
5 % Q=32/100 MHz
1008
L740
3645231 Chip coil
39 n
5 % Q=40/250 MHz
0603