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CCS Technical Documentation

System Module

NKC-1X

Issue 1 02/03



Nokia Corporation

Page 25

EMC

General

The EMC/ESD performance of NKC-1X ’s baseband is improved by using a shield to cover
the main components of the BB, such as the UEM, UPP and Flash. The UEM has internal
protection against a

±

8kV ESD pulse in most sensitive pins and

±

2kV in other pins. The

BB-shield is soldered to the PWB and it also increases the rigidity of the PWB in the BB
area, thus improving the phone’s reliability. The shield also improves the thermal dissipa-
tion by spreading the heat more widely.

The BB and RF shield are connected together on the PWB and the protective metal deck
underneath the battery is grounded to RF shield.

BB Component and Control IO Line Protection

Keyboard lines

ESD protection for keyboard signals is implemented by using separate EMI filter compo-
nent located between keyboard and UPP. EMI component is a low-pass filter with

±

15kV

ESD protection. Also the distance from A-cover to PWB is made longer with the spikes in
the keymat together with C-cover metallization is protecting keyboard lines.

C-Cover

The C-cover on the UI-side is metallized on the inner surface (partly) and is grounded. All
areas in which the plated C-cover touches the PWB surface are grounded and the solder
masks are opened.

PWB

All edges are grounded on both sides of the PWB and the solder mask is opened in these
areas. The aim is that any ESD pulse faces the ground area first when entering the phone,
for example, between the mechanics covers.

LCD

ESD protection for LCD is implemented by connecting the metal frame of the LCD into
ground. The connection is only on one side, at the top of the LCD, which is not the best
solution. The software takes care of the LCD's crashing in case of an ESD pulse.

Microphone

The microphone’s metal cover is connected to the GND and there are spark gaps on the
PWB. The microphone is an asymmetrical circuit, which makes it well protected against
EMC.

EARP

The EARP is protected with C-cover metallization and with a plastic-fronted earpiece.

Buzzer

PWB openings with the C-cover metallization protect the buzzer from ESD.

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Содержание NKC-1X Series

Страница 1: ...CCS Technical Documentation NKC 1X Series Transceivers Issue 1 02 03 Nokia Corporation System Module ...

Страница 2: ... 10 Regulators 11 RF Interface 12 Charging Control 12 Digital Interface 12 Audio Codec 12 UI Drivers 13 AD Converters 13 UPP 13 Introduction 13 Blocks 13 Flash Memory 13 Introduction 13 User Interface Hardware 14 LCD 14 Introduction 14 Interface 14 Keyboard 14 Introduction 14 Power Key 15 Keys 15 Lights 15 Introduction 15 Interfaces 15 Technical Information 16 Audio HW 17 Earpiece 17 Introduction ...

Страница 3: ...r 24 PWB 24 LCD 24 Microphone 24 EARP 24 Buzzer 24 System Connector Lines 25 Battery Connector Lines 25 MBUS and FBUS 25 Transceiver Interfaces 26 BB RF Interface Connections 26 BB Internal Connections 29 29 UPP Block Signals 34 MEMORY Block Interfaces 39 IR Block Interfaces not used in NKC 1X 40 SIM Block Interfaces not used in NKC 1X 40 LPRF Interfaces not used in NKC 1X 40 Audio Interfaces 41 K...

Страница 4: ... IInterconnecting Diagram 7 Fig 2 System Block Diagram simple 10 Fig 3 Placement of keys 14 Fig 4 Battery Connection Diagram 18 Fig 5 BMC 3 Battery contacts BLC 2 has the same interface 19 Fig 6 System Connector 20 Fig 7 Accessory Detection External Audio 21 Fig 8 4 wire fully differential headset connector pin layout 22 Fig 9 Top View of Production Test Pattern 23 Fig 10 Test points Located Betwe...

Страница 5: ... Electronic Data Management System EFR Enhanced Full Rate codec FCC Federal Communications Commission IR Infrared IrDA Infrared Data Association IrMC Infrared Mobile Communications IrOBEX IrDA Object Exchange Protocol IS Interim Standard ISA Intelligent Software Architecture LCD Liquid Crystal Display LED Light Emitting Diode MCU Micro Control Unit Master Control Unit MO MT Mobile Originated Mobil...

Страница 6: ...Time Division Multiple Access Here US digital cellular system TIA Telecommunications Industry Association TTY Teletype UEM Universal Energy Management a Baseband ASIC UPP Universal Phone Processor a Baseband ASIC VCTCXO Voltage Controlled temperature Compensated Crystal Oscillator WAP Wireless Application Protocol Browser ...

Страница 7: ...of the engine module ST6 and the various assembly parts The transceiver has a full graphic display and the user interface is based on a jack style UI with two soft keys An internal antenna is used in the phone and there is no connec tion to an external antenna The transceiver also has a low leakage tolerant earpiece and an omnidirectional microphone that provides excellent audio quality Figure 1 I...

Страница 8: ...tal Traffic Channel Digital Data Channel DDCH Both the analog and digital modes have different states controlled by the Cellular SW Some examples are Idle State on ACCH Camping on DCCH Scanning Con versation NSPS No Service Power Save previously OOR Out of Range 3 Local mode both Cellular SW and UI SW non active 4 Test mode Cellular SW active but UI SW non active Environmental Specifications Norma...

Страница 9: ... Issue 1 02 03 Nokia Corporation Page 9 storage temperature range 40 to 85 C All of the EIA TIA 136 270A requirements are not exactly specified over the temperature range For example the RX sensitivity requirement is 3dB lower over the 30 60 C range ...

Страница 10: ... hand portable phones In addi tion to energy management it performs all the baseband s mixed signal functions Most UEM pins have 2kV ESD protection and those signals considered to be more easily exposed to ESD have 8kV protection within the UEM These kinds of signals are 1 all audio signals 2 headset signals 3 BSI 4 Btemp 5 Fbus and 6 Mbus signals UEM UPP EAR MIC BUZZER RF Supplies BATTERY PA supp...

Страница 11: ... the Sleep mode The Vflash1 regulator supplies the LCD the digital parts of the UEM and Safari asic It is enabled during startup and goes into the low Iq mode when in the Sleep mode The VIO regulator supplies both the external and internal logic circuitries It is used by the LCD flash and UPP The regulator goes into the low Iq mode when in the Sleep mode The VCORE regulator supplies the DSP and th...

Страница 12: ...100ppm external resistor is used to improve the accuracy of the output current The IPA1 is used by the lower PA band and IPA2 is used by the higher PA band RF Interface The interface between the baseband and the RF section is also handled by the UEM It provides A D and D A conversion of the in phase and quadrature receive and transmit signal paths It also provides A D and D A conversions of receiv...

Страница 13: ...2 are not used in NKC 1X The AD converters are calibrated in the production line UPP Introduction NKC 1X uses the UPPv4M ASIC The RAM size is 4M The processor architecture consists of both the DSP and the MCU processors Blocks The UPP is internally partitioned into two main parts 1 the Brain and 2 the Body 1 The Processor and Memory System that is the Processor cores Mega cells internal memories p...

Страница 14: ...ration Issue 1 02 03 operation can be obtained by supplying Vpp of 12 volt to the flash device The device has two read modes asynchronous and burst The Burst read mode is utilized in NKC 1X except for the start up when the asynchronous read mode is used for a short time ...

Страница 15: ...ightguide assembly module Interface The LCD is controlled by the UI SW and the control signals are from the UPP asic The VIO and Vflash1 regulators supply the LCD with power The LCD has an internal voltage booster and a booster capacitor is required between Vout and GND Pin 3 Vss9 is the LCD driver s ground and Pin 9 GND is used to ground the metal frame Keyboard Introduction The NKC 1X keyboard s...

Страница 16: ... all where NC Not Connected Lights Introduction NKC 1X has 10 LEDs for lighting purposes Six of them are for the keyboard and four for the display The LED type is Osram LGM470 green light emitting and SMD through hole mounted Interfaces The display lights are controlled by a Dlight signal from the UEM The Dlight output is the PWM signal which is used to control the average current going through th...

Страница 17: ...ole in the PWB in which the body of the LED locates in hole and terminals are soldered on the component side of the module PWB The LEDs have a white plastic body around the diode and this directs the emitted light better to the UI side The current for the LCD and keyboard lights is limited by the resistor between the Vbatt and LEDs ...

Страница 18: ...anges across the capacitor Because the capacitance is typically 2 pF a FET buffer is needed inside the microphone capsule for the signal generated by the capacitor Because of the FET the microphone needs a bias voltage The microphone manufacturers for the NKC 1X transceiver are Matsushita and Hosiden Buzzer Introduction The operating principle of the buzzer is magnetic The diaphragm of the buzzer ...

Страница 19: ...up resistors for these lines so that they can be read by A D inputs in the phone see the figure below Serial resistors in the BSI and BTEMP lines are for ESD protection Both lines also have spark caps to prevent ESD There is also a varistor in the BTEMP line for ESD protection Figure 4 Battery Connection Diagram The batteries have a specific red line which indicates if the battery has been subject...

Страница 20: ...etween the battery and the PWB is more reliable The battery connector is manufactured by Molex Table 3 Battery Connector Interface Signal name Connected from to Batt I O Signal properties A D levels freq timing Description Notes 1 VBAT batt VBAT I O Vbat 3 0 5 1V Battery voltage 2 BSI BSI batt UEM Out Ana Battery size indicator 3 BTEMP BTEMP batt UEM Out Ana 40mA Switch 400mA Battery temperature i...

Страница 21: ...etected by the HeadInt line which is connected to the XEARP inside the system connector When an accessory is connected it disconnects XEARP from HEADINT and the UEM detects it and generates an interrupt UEMINT to the MCU After that the HOOKINT line is used to determine which accessory is connected This is done by the voltage divider which consists of the phone s internal pull up and accessory spe ...

Страница 22: ...on The PPH 1 handsfree device provides the charging and handsfree functionality has a built in speaker and uses a phone microphone but also has a connector for the HFM 8 optional external microphone using HFM 8 mutes phone microphone Interface A 4 wire interface is implemented with 2 5mm diameter round plug jack which is other wise like a so called standard stereo plug but the innermost contact is...

Страница 23: ... 3 wire chargers is connected directly to the GND in the PWB module so the NKC 1X engine does not provide any PWM control for chargers Charging controlling is done inside the UEM by switching the UEM s internal charger switch on and off Interface The fuse F100 protects the phone from too high currents for example when broken or pirate chargers are used L100 protects the engine from RF noises which...

Страница 24: ...components the visibility of BB signals is very poor This makes the measuring of most of the BB signals impossible In order to debug the BB at least to some level the most important signals can be accessed from the 0 6mm test points The figure below shows the test points located between the UEM and the UPP There is an opening in the baseband shield to provide access to these pads Figure 10 Test po...

Страница 25: ...nce from A cover to PWB is made longer with the spikes in the keymat together with C cover metallization is protecting keyboard lines C Cover The C cover on the UI side is metallized on the inner surface partly and is grounded All areas in which the plated C cover touches the PWB surface are grounded and the solder masks are opened PWB All edges are grounded on both sides of the PWB and the solder...

Страница 26: ...BUS The opening in the protective metal deck underneath the battery is so small that ESD does not get into the MBUS and FBUS lines in the production test pattern Table 4 System Connector lines System Connector signals that have EMC protection Protection type VIN XMIXP XMICN XEARP XEARN HEADINT MICP ferrite bead 600 199MHz X X X X X ferrite bead 420 100MHz X spark gaps X X X X X X PWB capacitors X ...

Страница 27: ... blocks BB RF Interface Connections The BB and RF parts are connected together without a physical connector All the signal descriptions and properties in the following tables are valid only for active signals and the signals are not necessarily present all the time Note In the following tables the nominal signal level of 2 78V is sometimes referred to as 2 7V Table 5 BB RF Interface Signal Descrip...

Страница 28: ...NKC 1X System Module CCS Technical Documentation Page 28 Nokia Corporation Issue 1 02 03 ...

Страница 29: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 29 70mAmax ...

Страница 30: ...NKC 1X System Module CCS Technical Documentation Page 30 Nokia Corporation Issue 1 02 03 BB Internal Connections Table 6 UEM Block Signal Description ...

Страница 31: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 31 Table 7 UEM Block Signals to UPP Cont Table 8 UEM Block Signals to BB and RF ...

Страница 32: ...NKC 1X System Module CCS Technical Documentation Page 32 Nokia Corporation Issue 1 02 03 ...

Страница 33: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 33 ...

Страница 34: ...NKC 1X System Module CCS Technical Documentation Page 34 Nokia Corporation Issue 1 02 03 ...

Страница 35: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 35 UPP Block Signals Table 9 UPP to UEM Interfaces Table 10 UPP RF Interfaces Table 11 UPP Globals ...

Страница 36: ...NKC 1X System Module CCS Technical Documentation Page 36 Nokia Corporation Issue 1 02 03 Table 12 UPP to Memory Interfaces ...

Страница 37: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 37 Table 13 UPP Genios collected although may be described in other tables too ...

Страница 38: ...NKC 1X System Module CCS Technical Documentation Page 38 Nokia Corporation Issue 1 02 03 Table 14 UPP to Key Display Interfaces ...

Страница 39: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 39 Table 15 UPP Test Interfaces for R D Use ...

Страница 40: ...NKC 1X System Module CCS Technical Documentation Page 40 Nokia Corporation Issue 1 02 03 MEMORY Block Interfaces Table 16 MEMORY Block Interfaces ...

Страница 41: ...entation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 41 IR Block Interfaces not used in NKC 1X Table 17 IR Block Signal Description SIM Block Interfaces not used in NKC 1X LPRF Interfaces not used in NKC 1X ...

Страница 42: ...NKC 1X System Module CCS Technical Documentation Page 42 Nokia Corporation Issue 1 02 03 Audio Interfaces Table 18 Internal Audio ...

Страница 43: ...CCS Technical Documentation System Module NKC 1X Issue 1 02 03 Nokia Corporation Page 43 Table 19 External Audio ...

Страница 44: ...dule CCS Technical Documentation Page 44 Nokia Corporation Issue 1 02 03 Key Display blocks Keyboard Interface Table 20 KEY Block Interface Signal Description Display Interface Table 21 Display Block Signal Description ...

Страница 45: ... TX upconverter and all PLL s lowband LNA TX VHF VCO active part and loopfilter RF filtering power amplifier and TX power detection circuitry are left outside TACO The phone comprises of one single sided 6 layer PWB A single multiwall RF shield is used and this sets the maximum component height to 2 0mm An internal antenna is located on the top of the phone Software Compensations The following sof...

Страница 46: ...requency 120k UEM VR1a VR2 VR3 VR4 VR5 IPA1 VR7 VFLASH1 VREFRF01 TACO UHF phasedet TX VHF VCO 2 mA 2G TX mixer TX IF 38 36 mA VCC_CP VCC_TXMIX VCC_TX Pwr Det 1G TX mixer 60 mA 1 mA REF_in REF_out VCC_REF 0 9 mA VCTCXO 1 mA biasing VCC_RX RX 1st mixer VCC_RX RX IF VCC_RX 0 5 mA 6 0 mA 12 mA LNA LNA_bias VCC_LNA 4 3 5 6 mA PA 800 5 mA 5 mA RX 1st mixer VCC_PLL UHF PLL VCC_PLL VCC_PLL 4 1 4 7 mA 6 7 ...

Страница 47: ...ch other RXIF is 135 54 MHz and TXIF 180 54MHz The RXIF frequency is set so that it is not a multiple of either of VHF s comparison fre quency 120k Rx IF BaseBand Rx IF F 2 PLL PLL F 2 PLL F 2 UHF TDMA800 2009 16 MHz 2059 02 MHz Rx Channel Centre Frencies TDMA800 869 04 893 97MHz Tx channel centre frequencies TDMA800 824 01 848 97 MHz Tx VHF TDMA800 361 08 MHz Tx IF 180 54 MHz 0 MHz RX IQ TX IQ VC...

Страница 48: ...chnologies used and component sizes LNA gain is set up to 16dB which is close to the maximum available stable gain from a single stage amplifier LNAs are not exactly noise matched in order to keep passband gain ripple in minimum Filters have relative tight stopband requirements which are not all set by the system requirements but the interference free operation in the field In this receiver struct...

Страница 49: ...6 IF 1 3dB roll off min frequency f 13 2nd IF min 3dB bandwidth 16 IQ branch Max total group delay at 3dB bandwidth C N for sensitivity digital analog 7 3 5 C I for selectivity digital analog 8 4 Sensitivity digital mode static ch BER 3 ANALOG MODE sinad 12dB 110 min 116 min Adjacent channel selectivity digital analog 13 16 Alternate channel selectivity digital analog 45 65 IMD attentuation select...

Страница 50: ...input loss 2 5 3 4 1 dB LNA gain High gain mode Low gain mode 16 4 5 16 5 4 17 3 3 8 dB dB LNA noise figure 1 4 1 7 2 3 dB LNA 3rd order intercept IIP3 4 3 1 5 dBm Bandfilter input loss 1 5 2 2 5 dB Mixer gain 6 7 5 8 dB Mixer NF 8 9 10 5 dB Mixer IIP3 4 4 5 5 dBm Total Gain 18 2 18 6 20 dB Noise Figure 4 6 5 5 7 dB 3rd order intercept IIP3 8 9 7 5 6 8 dBm see Safari spec measurements Parameter Mi...

Страница 51: ...AGC min 6 dB Gain charge Mixer 2nd IF 1 4 0 9 dB temp 30 85 C IQ mixers AMP2 RF input impedance differential 1 2 kohm pF RF input frequency range 135 54 MHz Conversion gain RI 1kohm 23 5 24 24 5 dB IF AGC gain range 5x6 dB 30 dB IF AGC gain step 5 steps 6 dB IF AGC gain error relative to max gain 0 5 0 5 dB AMP2 gain 18 dB 3dB frequency 21 25 29 kHz LPF 4th order Chebysev LPF gain 0 dB Corner freq...

Страница 52: ...uplex sensitivity IF signal is filtered in SAW filter before up conversion The upconverter mixer is actually a mixer with LO and output driver being able to deliver about 6dBm linear output power Ther mixer is inside TAC RF IF Note that in this point term linear means 33dB ACP The required LO power is about 6dBm The LO signal is fed from TACO Before power amplifier RF signal is filter in band filt...

Страница 53: ...lters and thru diplexer The cellular band duplex filter is band pass type SAW filter with typical insertion loss about 2 0dB Typical insertion loss of thru diplexer is about 0 1dB IRF Performance The output power tuning target for power level 2 after diplexer or after switch for exter nal RF is 27 3dB for digital modes and 24 5 for analog mode See table below Modu lation accuracy and ACP will be w...

Страница 54: ...NKC 1X System Module CCS Technical Documentation Page 54 Nokia Corporation Issue 1 02 03 ...

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