Table 30 Testing and flashing interface electrical specifications
Pad
No
Name Dir
Parameter Min
Typ
Max
Unit
Notes
1
STI_T
x
->
Vo
0.22*VIO
V
Voh
0.8*VIO
V
2
VPP
To Phone
0 / 2.8 / 9 +/-3%
V
Prommer Select
3
FBusT
x
->
Vol
0
2.7
0.3*VFlash
1
V
Voh
0.7*VFlash1
2.7
VFlash1
V
4
MBUS
<->
Vol
0
0.2
0.3*VFlash
1
V
Vil (From
prommer)
0
0.2
0.3*VFlash
1
V
Voh
0.7*VFlash1
2.7
0.7*VFlash
1
V
Vih(From
prommer)
0.7*VFlash1
2.7
VFlash1
V
5
FBusR
x
<-
Vil (From
prommer)
0
2.7
0.3*VFlash
1
V
Vih(From
prommer)
1.89
2.7
VFlash1
V
Abs. Max.
Voltage to
Test Pad
Referenced
to GND
-0.3V
3.0
V
Absolute Max
Voltage limits to
MBUS/FBUS
6
GND
0
V
VBAT GROUND
7
BSI_P
ULS
Vol
0
2.7
0.3*VFlash
1
V
Supplied from the
flash programming
device
Voh
0.7*VFlash1
2.7
VFlash1
V
8
ZOCUS
Used for
manufacturing
Note:
VFlash1 = 2.78 +/-3%, VIO = 1.8 +/-4.5%
Pin
Name
Min
Typ
Max
Unit
Notes
VBAT
0
3.6
5.1
V
BSI_BATT
0
2.78
VFlash1
V
Internal
pullup
GND
0
V
RM-25
System module
Nokia Customer Care
9235618 (Issue 2)
Company Confidential
Page 9–15
Copyright ©2005 Nokia. All Rights Reserved.
