Copyright © 2021 NEXCOM International Co., Ltd. All Rights Reserved.
3
NDiS B560 User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪
8th and 9th generation Intel
®
Core™ i9/i7/i5/i3 LGA socket type processor,
up to 35W
– Core™ i9-9900T, 8 Core, 2.1GHz, 16M Cache (0~40°C)
– Core™ i7-9700TE, 8 Core, 1.8GHz, 12M Cache
– Core™ i5-9500TE, 6 Core, 2.2GHz, 9M Cache
– Core™ i3-9100TE, 4 Core, 2.2GHz, 6M Cache
– Core™ i7-8700T, 6 Core, 2.4GHz, 12M Cache
– Core™ i5-8500T, 6 Core, 2.1GHz, 9M Cache
– Core™ i3-8100T, 4 Core, 3.1GHz, 6M Cache
Chipset
▪
Intel
®
PCH Q370
▪
Intel
®
UHD graphics 630 series
Main Memory
▪
2x 260-pin SO-DIMM sockets, supports DDR4 2666MHz non-ECC, un-
buffered memory up to 32GB (single socket max. 16GB)
I/O Interface-Front
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1x Power status LED
▪
1x HDD status LED
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1x Power button with LED
▪
1x Reset switch
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2x USB 3.0
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4x DB9 for COM1~COM4
– COM1: RS232/422/485
– COM2~4: RS232
▪
2 x Antenna hole
I/O Interface-Rear
▪
+12V DC-in
▪
3x HDMI 2.0
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4x USB3.0
▪
2x RJ45 with LED for 10/100/1000Mbs Ethernet
▪
1x Mic-in/ 1x Line-out
▪
2x Antenna hole
I/O Interface-Internal
▪
8CH GPIO support 4x GPO and 4x GPI
▪
Onboard TPM 2.0 (by request)
▪
Support iAMT
Storage
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1x SATA 2.5” HDD/SSD
▪
1x M.2 2280 (SATA, PCIe x4)/2242 (by request) Key M socket
Expansion
▪
1x M.2 2230 Key E (PCIe x2), support optional Wi-Fi modules
▪
1x M.2 3042/3052 Key B (SATA, USB 3.0), support optional 3G, 4G or
5G modules
▪
1x SIM slot
Dimensions
▪
238 mm (W) x 192 mm (D) x 67.29 mm(H) (9.4” x 7.6” x 2.6”)