2
Content
1.
S
tructure of Neoden 4
.................................................................................................................. 6
1.1.Brief Introduction..................................................................................................................6
1.2.Structure of NeoDen 4.......................................................................................................... 7
2.
Operation Flow Chart
....................................................................................................................8
3.
Procedure for making a programming file
..................................................................................9
4.
Edit on the Operation Interface
..................................................................................................10
4.1Edit on the Interface............................................................................................................. 10
4.1.1.PCB Feeding Setting................................................................................................10
（
1
）
Tray fixed...................................................................................................... 10
（
2
）
Rail once....................................................................................................... 10
（
3
）
Rail multi.......................................................................................................11
（
4
）
Eject front......................................................................................................11
4.1.2.Setting Panelized PCB & first chip
( manual is the same as automatic download).............
11
（
1
）
Single PCB....................................................................................................12
（
2
）
Panelized PCB.............................................................................................. 12
（
3
）
PCB angle correction.................................................................................... 13
（
4
）
Bad PCB detection........................................................................................13
4.1.3.PCB mark point setting............................................................................................13
（
1
）
Single PCB....................................................................................................13
（
2
）
Panelized PCB.............................................................................................. 13
（
3
）
Maunal.......................................................................................................... 14
（
4
）
Add or delete mark point.............................................................................. 14
4.1.4.Chip list setting........................................................................................................ 15
（
1
）
Manual program............................................................................................15
（
2
）
Import PCB BOM File..................................................................................16
4.1.5.Feeder configuration................................................................................................ 17
（
1
）
Feed setting................................................................................................... 17
（
2
）
System setting............................................................................................... 17
4.2.File mounting...................................................................................................................... 21
4.3.Manual test.......................................................................................................................... 22
4.3.1.Placement head........................................................................................................ 22
4.3.2.Rails control............................................................................................................. 23
4.3.3.Host control..............................................................................................................23
4.3.4.Feeder test................................................................................................................ 24
4.4.Factory settings................................................................................................................... 24
4.4.1Feeder configuration................................................................................................. 26
4.4.2.Feed setting.......................................................................................................... …29
4.4.3.Peel Configuration ……………………………………………………………… 30
4.4.4.System setting.......................................................................................................... 31
4.5.First trial and testing........................................................................................................... 33
4.6Continuous SMT production................................................................................................34
