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www.naimaudio.com

 

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24

th

 April 2008 

Hard Disk Player Thermal Analysis 

 

Paul Neville 

Naim Audio 

Southampton Road, Salisbury, SP1 2LN, England 

 

 
 
 
Abstract 

When designing hi-fi components attention has to be 
paid to the thermal performance. Excessive heat would 
cause longer term reliability problems and short term 
problems in adhering to the various safety standards 
around the world.  Naim products are sold and used 
worldwide in many climates. 
 

1. Target Performance

 

The specification required the unit to run happily at 
ambient temperatures at or below 25 degrees C without 
the use of a fan to cool the components. At higher 
ambient temperatures the fan would be required to run 
to keep components inside the box cool. 

 

2. Modelling 

To optimise the thermal performance of the Naim Hard 
Disk player and server products a combination of 
computer analysis and verification testing was used.  
 
Using the mechanical CAD model of the product as a 
start point, a thermal model was created and analysed 
using FEA (Finite Element Analysis) and CFD 
(Computational Fluid Dynamics) to predict airflow 
patterns within the product and the temperatures of key 
components. This involved calculating heat output 
values for all the heat generating components such as 
processors, power supplies and both hard drives.   
 
The software uses these values and the thermal 
properties of the materials to predict the flow patterns 
and maximum temperatures reached from a meshed 
model. The software model predicted temperatures at 
different ambient temperatures and with the fan turned 
on or off. It was also possible to use the model to 
optimise the position of the fan and to confirm that the 
planned airflow was ideal.  
 
The Thermal model allowed predictions of what would 
happen when materials or the design changed and to 
fine tune the design for thermal performance. 
 
The product case is constructed from 5mm thick 
aluminium, which provides an in-built heat sink for the 
components and a path to remove heat from the 
product. Key components have been coupled to the 
case to provide a direct conductive heat path to the 
cover and hence, the outside world. For instance the 
hard drives are connected directly to the cover via thick 
machined aluminium blocks.  
 
The back-up drive is sent to sleep when not in use to 
limit the heat that is generated and the primary drive is 
located closest to the cover to shorten the distance of 
the heat path to the outside world. 

 

The best grades of material were selected to minimise 
thermal resistance to provide a product with optimum 
passive cooling. The final product was sent to the design 
and verification test centre of Seagate (the hard drive 
manufacturer) who confirmed our analysis and testing. 
The results indicated that “the drive will remain within 
specification limits up to ambient conditions over 40°C 
even with the fan off.”  
 
We have chosen to use the fan at ambient temperatures 
above 25 Degrees C to maintain the best reliability of the 
hard drives (the fan is controlled by monitoring the on 
board temperature sensor on the hard drives). The 
product also monitors the motherboard processor 
temperatures.

  

 
 
 
 
 
 
 
 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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