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Murata Electronics Oy
SCC2000 series
Doc. No. 2845
www.murata.com
Rev. 2
ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES
Technical Note
Страница 1: ...1 17 Murata Electronics Oy SCC2000 series Doc No 2845 www murata com Rev 2 ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES Technical Note ...
Страница 2: ... paste 7 5 3 Stencil 8 5 4 Paste printing 8 5 5 Component picking and placement 8 5 6 Reflow soldering 9 5 7 Moisture sensitivity level MSL classification 10 5 8 Inspection 11 5 9 Precautions 12 5 9 1 Mechanical shocks 12 5 9 2 Vibration 12 5 9 3 Chemicals 13 5 9 4 Coatings 13 5 9 5 Vacuum level 13 5 9 6 Air blowing 13 5 9 7 ESD 14 5 9 8 Moisture 14 5 9 9 Mechanical stress 14 5 10 Cleaning 14 6 Re...
Страница 3: ...s of varying end use applications 2 Murata s 24 lead Dual In line Package DIL 24 The SCC2000 series products are SMD DIL 24 components pick and place mountable and reflow solderable These components are completely lead free and designed to meet the demanding lead free soldering processes The package consists of a pre molded plastic housing with a copper based lead frame having gull wing type of le...
Страница 4: ...v 2 3 DIL 24 Package Outline and Dimensions The outline and dimensions for the DIL 24 package are presented in Figure 2 Figure 2 Outline and dimensions for DIL 24 package Dimensions are in millimeters mm All tolerances are according to ISO 2768 f unless otherwise specified ...
Страница 5: ...cations Packing tape dimensions are presented in figure 3 The unreeling direction and component polarity on tape are presented in figure 4 Figure 3 Packing tape dimensions for the DIL 24 Package Dimensions are in millimeters mm Figure 4 Package orientation on the tape and unreeling direction on tape ...
Страница 6: ...urata com Rev 2 The reel dimensions are presented in figure 5 and table 1 below Dimensions are in millimeters mm Figure 5 Reel dimensions All dimensions are in millimeters mm Table 1 Packing reel dimensions mm A N W1 W2max M 330 100 1 32 4 0 2 0 38 4 13 0 2 0 5 ...
Страница 7: ...oless Ag and Electroless Sn For the vibration sensitivity it is recommended that PCB or Unit resonance modes are analyzed to verify that there are no critical modes close to sensor operating frequencies or excessive amplifications of hundreds of Gs 5 2 Solder paste The DIL package can be soldered with lead free SAC tin silver copper solder The SAC solder paste composition should be near eutectic T...
Страница 8: ...size This reduction of aperture size can reduce bridging between solder joints 5 4 Paste printing The paste printing speed should be adjusted according to the solder paste specifications It is recommended that proper care of printing speed is taken during the paste printing in order to ensure correct paste amount shape position and other printing characteristics Neglecting any of these can cause o...
Страница 9: ... convection reflow solder profile and it also shows the typical phases of a reflow process The reflow profile used for soldering the DIL package should always follow the solder paste manufacturer s specifications and recommended profile If washing process is done after the soldering process it must be noted that ultrasonic agitation wash after reflow is not allowed for Murata s DIL packaged MEMS c...
Страница 10: ...ses 5 7 Moisture sensitivity level MSL classification The Moisture Sensitivity Level of the DIL component is Level 3 according to the IPC JEDEC J STD 020D The part is delivered in a dry pack The manufacturing floor time out of bag at the customer s end is 168 hours Maximum soldering peak temperature for the DIL package is 245 C 40sec measured from the package body Following instruction shall be fo...
Страница 11: ... X ray inspection can be used Cross sectional analysis is also an approved method to inspect how well solder has wetted the pads of component Cross sectional analysis is not used for production inspection but if required it can be used to establish and optimize the component assembly process parameters Cross sectioning is a destructive inspection method An example of a DIL solder joint cross secti...
Страница 12: ... evaluated case by case As a general guideline the lighter assembly or part the higher shock levels will be generated on sensor component Dropped components shall not be used and shall be scrapped Reference tests 1 Mechanical Shock JEDEC JESD22 B104 Y1 plane 5 pulses 0 5 msec duration 1500 g peak acceleration 2 Package Drop AEC Q100 Rev G device drop on each of 6 axes once from a height of 1 2m on...
Страница 13: ... number of factors including the total volume of such halogen material stability of halogen within material hermeticity level of application and temperature among others Life time reliability tests should always be performed at application level to validate the end product against life time requirements mission profile as corrosion effects heavily depend on the final construction of application te...
Страница 14: ...l be avoided 5 10 Cleaning Items listed in section 5 9 Precautions are applied to cleaning also Examples of cleaning procedures which may have a negative effect on the sensor component performance or functionality are Wet cleaning with solvent Ultrasonic Heavy air blowing Plasma cleaning with vacuum 6 Rework Guidelines If it becomes necessary to rework a SCC2000 series component the preferred way ...
Страница 15: ...r 280ºC If the pins are heated too long the plastic around pin will be softened and if there at the same time is some stress on the pin there is a risk that pin might move and cause increased reliability or wirebond break inside housing In order to melt all pins simultaneously tweezers are recommended for de soldering of the component Also with tweezers special care must be taken if failure analys...
Страница 16: ...iately after solder melting component is lifted Remove the solder from the PCB using either a solder vacuum or solder braid making sure to clean the area of solder thoroughly Figure 14 Soldering iron and solder braid used for solder removal Note that the performance and the reliability of the reworked component may have decreased due to the rework operation Murata does not recommend rework ...
Страница 17: ... should be soldered with lead free solders in order to guarantee full RoHS compatibility 8 References JEDEC Electronic Industries Alliance Inc Moisture Reflow Sensitivity Classification for Non Hermetic Solid State Surface Mount Devices J STD 020D Handling Packing Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices IPC JEDEC J STD 033 Murata Electronics Oy reserves all rights to mo...
