Murata GRM0335C1HR60WD01 Series Скачать руководство пользователя страница 1

CHIP MONOLITHIC CERAMIC CAPACITOR 

GRM0335C1HR60WD01_ (0201, C0G, 0.6pF, 50Vdc)

_: packaging code

Reference Sheet

1.Scope

  

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Aug.3,2011,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.

0.2 min.

(8) Packaging

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

±0.05 pF

-55 to 125 °C

0±30 ppm/°C

25 to 125 °C

(25 °C)

(3) Temperature Characteristics

(Public STD Code):F(EIA)

e

Specifications and Test

Methods

(Operationg

Temp. Range)

g

Temp. coeff

or

 

Cap. Change

(5) Nominal

Capacitance

(6)

Capacitance

Tolerance

50 Vdc

0.6 pF

Temp. Range

(Ref.Temp.)

mark

0.3±0.03

(4)

DC Rated

Voltage

0.1 to 0.2

(1)-2 W

0.3±0.03

(2) T

Packaging Unit

(1)-1 L

0.6±0.03

D

f

180mm Reel

PAPER

15000 pcs./Reel

J

f

330mm Reel

PAPER

50000 pcs./Reel

B

Bulk Bag

1000 pcs./Bag

C

Bulk Case

50000 pcs./Case

(1)L/W

Dimensions

(2)T 

Dimensions

(3)Temperature 

Characteristics

(4)DC Rated 

Voltage

(5)Nominal 

Capacitance

(6)Capacitance 

Tolerance    

(8)Packaging 

Code 

(7)Murata’s 

Control Code  

T

L

W

e

e

g

GRM

03

3

5C

1H

R60

W

D01

D

1

GRM0335C1HR60WD01-01

Содержание GRM0335C1HR60WD01 Series

Страница 1: ...c equipment 0 05 pF 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code F EIA e Specifications and Test Methods Operationg Temp Range g Temp coeff or Cap Change 5 Nom...

Страница 2: ...When cycling the temperature sequentially from step1 through 5 C 25 C to 125 C other temp coeffs 25 C to 85 C the capacitance should be within the specified tolerance for the temperature coefficient a...

Страница 3: ...in a solution of ethanol JIS K 8101 and rosin JIS K 5902 25 rosin in weight propotion Preheat at 80 to 120 C for 10 to 30 seconds After preheating immerse in an eutectic solder solution for 2 0 5 seco...

Страница 4: ...ger R6 R7 C8 L8 R9 Within 12 5 E4 F5 Within 30 Q D F 30pF and over Q 350 10pF and over 30pF and below Q 275 C 10pF and below Q 200 10C C Nominal Capacitance pF R6 R7 C8 L8 W V 100V 0 05max C 0 068 F 0...

Страница 5: ...5 Within 30 40 Cap 1 0 F Q D F 30pF and over Q 350 10pF and over 30pF and below Q 275 C 10pF and below Q 200 10C C Nominal Capacitance pF R6 R7 C8 L8 W V 100V 0 05max C 0 068 F 0 075max C 0 068 F W V...

Страница 6: ...Code L Code J F Code K GR 02 40000 GR 03 15000 50000 GR 15 10000 50000 GR 18 4000 10000 GR 21 5 6 9 4000 10000 A B 3000 10000 GR 31 6 9 4000 10000 M X 3000 10000 C 2000 6000 GR 32 5 6 9 4000 10000 A...

Страница 7: ...2 0 0 2 2 8 0 2 B 1 85 0 1 2 3 0 15 3 6 0 2 3 6 0 2 Code GR 03 GR 15 A 3 0 37 0 65 3 Nominal value B 3 0 67 1 15 t 0 5 max 0 8 max in mm 1 75 0 1 2 2 1 0 8 0 04 4 0 0 1 8 0 0 3 3 5 0 05 1 2 1 0 0 02 0...

Страница 8: ...GR 43 55 1 2 5 max T 1 8mm 3 7 max T 2 0 2 5mm 4 7 max T 2 8mm Code GR 43 GR 55 A 2 3 6 5 2 B 2 4 9 6 1 2Nominal value 1 0 3 0 1 0 1 0 0 1 0 f1 5 0 0 0 1 0 0 1 0 8 0 0 1 4 0 0 1 2 0 0 1 12 0 0 3 5 5...

Страница 9: ...agram Top Tape Thickness 0 06 Feeding Hole As specified in 2 2 Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Bottom Tape Thickness 0 05 Only a bottom tape existence f 180 0 3 0 f 330...

Страница 10: ...r top tape and bottom tape 2 9 There are no fuzz in the cavity 2 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 2 11 Reel is made by resin a...

Страница 11: ...2 Case is made by resin of transparence or semitransparency and appeaser and dimension is shown in Fig 4 There are possibility to change the material and dimension due to some impairment 3 3 Case mus...

Страница 12: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Страница 13: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...

Страница 14: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Страница 15: ...rs such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high d...

Страница 16: ...inted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting positio...

Страница 17: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Страница 18: ...nditions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accum...

Страница 19: ...be sure to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 Temperatur...

Страница 20: ...Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GR 03 15 18 the top of the solder fillet should be lower than 2 3...

Страница 21: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Страница 22: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Страница 23: ...hat can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplug...

Страница 24: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Страница 25: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Страница 26: ...nsions Part Number GR 02 0 4 0 2 0 16 0 2 0 12 0 18 0 2 0 23 GR 31 3 2 1 6 2 2 2 4 0 8 0 9 1 0 1 4 GR 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 GR 43 4 5 3 2 3 0 3 5 1 2 1 4 2 3 3 0 GR 55 5 7 5 0 4 0 4 6 1 4...

Страница 27: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Страница 28: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Страница 29: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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