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GQM22M5C2H560FB01_ (1111, C0G, 56pF, 500Vdc)

_: packaging code

Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Jan.30,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.

RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR

0.3 min.

56 pF

Temp. Range

(Ref.Temp.)

(8) Packaging

mark

(4)

DC Rated

Voltage

Packaging Unit

±1 %

-55 to 125 °C

0±30 ppm/°C

25 to 125 °C

(25 °C)

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

Specifications and Test

Methods

(Operationg

Temp. Range)

Temp. coeff

Cap. Change

(5) Nominal

Capacitance

(6)

Capacitance

Tolerance

500 Vdc

1.0 min.

(2) T

1.15±0.2

This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.

(1)-1 L

2.8±0.5

(1)-2 W

2.8±0.4

180mm Reel

EMBOSSED W8P4

1000 pcs./Reel

330mm Reel

EMBOSSED W8P4

4000 pcs./Reel

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)DC Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging

Code

(7)Murata’s

Control Code

GQM

560

B01

GQM22M5C2H560FB01-01

Содержание GQM22M5C2H4R3CB01L

Страница 1: ... 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capacitance Tolerance 500 Vdc 1 0 min 2 T 1 15 0 2 This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency Electronic equipment 1 1 L 2 8 0 5 1 2 W 2 8 ...

Страница 2: ...of the terminations or other defect Solder the capacitor on the test jig glass epoxy board shown Termination should occur in Fig 3 using an eutectic solder Then apply 10N force in parallel with the test jig for 10 1seconds The soldering should be done either with an iron or using the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat s...

Страница 3: ...asure Capacitance Within 5 or 0 5pF Change Whichever is larger Q 30pF and over Q 350 10pF and over 30pF and below Q 275 5C 2 C Nominal Capacitance pF I R More than 1 000MΩ 17 Humidity Load The measured and observed characteristics should Apply the rated voltage at 40 2 and 90 to 95 humidity satisfy the specifications in the following table for 500 12 hours Appearance No defects or abnormalities Re...

Страница 4: ... Copper foil thickness 0 035mm Copper foil thickness 0 035mm Gray colored part of Fig 1 Solder resist Coat with heat resistant resin for solde Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS 2 4 0 0 1 8 0 0 3 3 5 0 05 0 05以下 1 φ1 5 0 1 0 Ａ t 1 2 2 0 0 05 1 75 0 1 Ｂ 100 40 a c b Land f4 5 c a c b ﾗﾝﾄﾞ f4 5 c Glass epoxy board Solder resist Baked electrode or copper foil b R230 2...

Страница 5: ... GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKAGING GQM Type Type 4 0 0 1 4 0 0 1 2 0 0 05 φ1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 1 1 max ＡＢ 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1 ＡＢ 2 5 max 2 0 0 1 φ1 5 0 1 0 4 0 0 1 0 25 0 1 JEMCNP 01900 5 ...

Страница 6: ...ng Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence φ180 0 3 0 φ330 2 0 φ50 min φ13 0 5 2 0 0 5 Chip in mm Fig 1 Package Chips Fig 2 Dimensions of Reel Fig 3 Taping Diagram JEMCNP 01900 6 ...

Страница 7: ...9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is shown in Fig 1 There are possibly to change the material and dimension due to some impairment 1 12 Peeling off force 0 1N to 0 6N in the direction as shown below 1 13 Label that show the customer part...

Страница 8: ...light dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product within six months of receipt 2 Please confirm solderability before using after six months Store the capacitors without opening the original bag Even if the storage period is short do not exceed the spe...

Страница 9: ...intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measurement of Capacitance 1 Measure capacitance with the voltage and the frequency specified in the product specifications 1 1 The output voltage of the measuring equipment may decrease when capacitance is h...

Страница 10: ... Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers The time duration until breakdown depends on the applied voltage and the ambient temperature 4 Applied Voltage and Self heating Temperature 1 When the capacitor is used in a hi...

Страница 11: ...mperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit AC voltage characteristics 6 Capacitance Aging 1 The high ...

Страница 12: ...rinted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board 1 1 Choose a mounting position that minimizes the stress imposed on the chip dur...

Страница 13: ...essive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending damage or cracking Please take into account the following precautions and recommendations for use in your process 1 Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit...

Страница 14: ...and Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulated soldering time must be within the range shown above 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thick application of solder past...

Страница 15: ...d Time be sure to maintain the temperature difference ΔT between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 ΔT 150 In case of repeated soldering the accumulated soldering time must be within the range shown above Recommended Conditions Pb Sn Solder Lead Free Solder 90 110 100 120 240 250 250 260 Air N2 Pb Sn Sol...

Страница 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower than 2 3 s of the thickness of the component or 0 5mm whichever is smaller In case of 0805 and larger sizes GQM21 22 the top of the solder fillet should be lower than 2 3 s of the thickness in section ...

Страница 17: ...ormance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resulting in cracked chips or open solder joints Provide support pins on the back side of the PCB to prevent warping or flexing 1 2 Avoid vibration of the board by shock when a test pin contacts a printed...

Страница 18: ...jig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circuit board cropping machine is shown as follows Along the lines with the V grooves on printed circuit board the top and bottom blades are aligned to one another when cropping the board The misalignme...

Страница 19: ...Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsened by supplying continuous power 2 In this type of situation do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitors high temperature 2 2 Disposal of...

Страница 20: ... capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation 1 3 The deterioration of characteristics and insulation resistance due ...

Страница 21: ...ssibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient In case of chip below 0402 size there is also the same possibility of crack with a single layered glass epoxy board Pattern F...

Страница 22: ...rm the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L W a b c 0 8 1 1 GQM18 GQM21 1 6 0 8 0 6 1 0 1 9 2 3 Chip L W a b c 2 0 1 25 1 0 1 2 0 6 0 7 0 8 1 1 1 6 0 8 0 8 0 9 0 6 0 8 1 0 1 2 GQM18 GQM21 0 6 0 8 GQM22 2 0 1 25 2 8 2 8 0 9 1 0 2 2 2 5 0 8 1 0 ...

Страница 23: ... absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of Solderability So apply flux thinly and evenly throughout A foaming system is generally used for flow soldering 2 Flux containing too a high percentage of halide may cause corrosion of th...

Страница 24: ...sed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance of a capacitor An epoxy resin can be used as a less hygroscopic resin Others 1 Transportation 1 The performance of a capacitor may be affected by the conditions during transportation 1 1 The c...

Страница 25: ...ication 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your technical documents as above include such terms and conditions such as warranty clause product liability clause or intellectual property infringement liability clause they will be deemed to be inva...

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