Technical Description
miriac MPX-LX2160A User Manual
V1.4
56/73
© MicroSys Electronics GmbH 2020
4.20.13
XSPI
The following table shows the internal connections:
SoC
Module Connector
Ball
Signal
Pin
Signal
I/O
Range
Signal
conditioning
C23
VB_XSPI_EMU#
→
ST1-D16
1,8V
F25
XSPI_A_DATA0
↔
ST1-C13
1,8V
E24
XSPI_A_DATA1
↔
ST1-C12
1,8V
E26
XSPI_A_DATA2
↔
ST1-C11
1,8V
E27
XSPI_A_DATA3
↔
ST1-C10
1,8V
F27
XSPI_A_DATA4
↔
ST1-C9
1,8V
D26
XSPI_A_DATA5
↔
ST1-D15
1,8V
E25
XSPI_A_DATA6
↔
ST1-D14
1,8V
D24
XSPI_A_DATA7
↔
ST1-D13
1,8V
E23
XSPI_A_DQS
→
ST1-C16
1,8V
D22
XSPI_A_SCK
→
ST1-C15
1,8V
Table 4-35 XSPI interface: pin assignments
This interface offers the ability to connect to an external eMMC on the carrier. If
externally used, the on-board eMMC cannot be used at same time.
4.20.14
SPI
The following table shows the internal connections:
SoC
Module Connector
Ball
Signal
Pin
Signal
I/O
Range
Signal
conditioning
A3
SPI3_PCS0
→
ST1-G49
OVDD
(1.8V)
SR: 0R
A4
SPI3_PCS1
→
ST1-A48
OVDD
(1.8V)
PU: 4k7 SR: 0R
B3
SPI3_PCS2
→
ST1-C49
OVDD
(1.8V)
PD: 47k SR:0R
C3
SPI3_PCS3
→
ST1-A47
OVDD
(1.8V)
B2
SPI3_SCK
→
ST1-E49
OVDD
(1.8V)
D3
SPI3_SIN
←
ST1-E47
OVDD
(1.8V)
C4
SPI3_SOUT
→
ST1-F47
OVDD
(1.8V)
Table 4-36 SPI interface: pin assignments