System Description
miriac MPX-LX2160A User Manual
V1.4
11/73
© MicroSys Electronics GmbH 2020
Linux Stress: stressapptest (
https://github.com/stressapptest/stressapptest
) (start
parameters: -M 8192 -s 120, all cores)
Linux idle: without power optimization
–
based on LSDK 20.12 (U-Boot + AFT),
LSDK 20.04 (Linux) without modifications.
3.5
Cooling
The cooling solution needs to be designed with the final use case in mind. If
desired, MicroSys Electronics GmbH can support you with your cooling concept.
Please ask your sales representative or send an email inquiry to
[email protected].
The following maximum component temperatures should not be exceeded.
Commercial temperature grade (0/+70° C) variants:
Component
Temperature
(max.)
Description
SoC
105° C
Junction Temperature
SoC
70° C
Junction Temperature during secure fuse programming
DDR
85° C
Case Temperature
Core Regulator
150° C
Junction Temperature
Table 3-2 Commercial grade variants: maximum temperature
Industrial temperature grade (-40/+85° C) variants:
Component
Temperature
(max.)
Description
SoC
105° C
Junction Temperature
SoC
70° C
Junction Temperature during secure fuse programming
DDR
95° C
Case Temperature
Core Regulator
150° C
Junction Temperature
Table 3-3 Industrial grade variants: maximum temperature
3.6
Ordering Information
Ordering information can be found on the following website
or contact your local sales representative.