Microchip Technology RN1810, Руководство пользователя

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2016-2021 Microchip Technology Inc. DS50002460C-page 11
RN1810/RN1810E
FIGURE 1-7: RN1810/RN1810E HOST PCB EXAMPLE LAYOUT
1.3 Soldering Recommendations
The RN1810/RN1810E wireless module is assembled
using the IPC/JEDEC J-STD-020 Standard lead-free
reflow profile. The RN1810/RN1810E module can be
soldered to the host PCB using standard leaded and
lead-free solder reflow profiles.
To avoid damaging the module, adhere to the following
recommendations:
• Solder reflow recommendations are provided in
the Microchip Application Note, AN233 “ Solder
Reflow Recommendation” (DS00233)
• Do not exceed a peak temperature (T
P
) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations from the vendor
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Best
Good
Good
Good
No Copper
in these Areas