Microchip Technology MCP39F521, Руководство пользователя

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MCP39F521 POWER MONITOR
DEMONSTRATION BOARD USER’S GUIDE

2015 Microchip Technology Inc. DS50002413A-page 29
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
Qty. Designator Description Manufacturer Part Number
1 C1 Cap. film 0.01 µF 330V 20% RAD
P10L13W4H9 EPCOS AG B32911A3103M
4 C2, C3, C4, C5 Cap. ceramic 33 nF 50V 10% X7R SMD
0603
TDK Corporation C1608X7R1H333K
1 C6 Cap. aluminum 100 µF 16V 20% SMD D Nichicon Corporation UWX1C101MCL1GB
12 C7, C9, C12,
C13, C14, C17,
C23, C26, C27,
C28, C29, C31 Cap. ceramic 0.1 µF 25V 10% X7R
SMD 0603 Murata Electronics
®
GRM188R71E104KA01D
3 C8, C22, C25 Cap. ceramic 10 µF 10V 10% X7R SMD
0805 TDK Corporation C2012X7R1A106K125AC
2 C10, C11 Cap. aluminum 4.7 µF 400V 20%
RAD_P3.5D8H13 Nichicon Corporation 'UVC2G4R7MPD1TD
1 C18 Cap. ceramic 4.7 µF 25V 10% X7R
SMD 0805 TDK Corporation C2012X7R1E475K125AB
1 C24 Cap. ceramic 10 µF 25V 10% X7R SMD
1206 Taiyo Yuden Co., Ltd. MK316B7106KL-TD
1 C30 Cap. ceramic 4.7 µF 10V 10% X5R
SMD 0805 Taiyo Yuden Co., Ltd. LMK212BJ475KD-T
1 C32 Cap. ceramic 0.47 µF 6.3V 10% X5R
SMD 0603 Murata Electronics GRM188R60J474KA01D
1 D1 Diode rec. ES1G 1.25V 1A 400V SMD
DO-214AC_SMA Diodes
®
Incorporated ES1G-13-F
3 D2, D3, D4 Diode rec. MRA4005 1.1V 1A 600V
DO-214AC_SMA ON Semiconductor
®
MRA4005T3G
2 FB1, FB2 Ferrite 800 mA 0.15R SMD 0805 Laird Technologies
®
LI0805H151R-10
2 FB3, FB4 Ferrite 7A 0.01R RAD P5L5.3D3.8 Panasonic
®
- ECG EXC-ELSR35S
1 J1 Conn. IEC 250V 15A Inlet C14 TH R/A SCHURTER Inc. GSP1.9103.1
1 J2 Conn. IEC 250V 15A Outlet C13 TH R/A SCHURTER Inc. 6182.0033
1 J3 Conn. Power 2.5 mm 5.5 mm Switch TH
R/A CUI Inc. PJ-002B
1 J5 Conn. Header-2.54 Male 1x4 Tin
5.84 MH TH Vert. FCI 68002-404HLF
2 J6, J8 Conn. Header-2.54 Male 1x2 Tin
6.10 MH TH Vert. Molex
®
0022284020
1 J10 Conn. Header-2.54 Male 1x2 Tin
6.10 MH TH Vert. Molex 500075-1517
1 JP2 Conn. Header-2.54 Male 1x3 Gold
5.84 MH TH Vert. FCI 68000-103HLF
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.