5.
Specifications
Table 5-1. Module Parameters
Parameter
Value
Module size
3.5 inch
Overall dimensions
69.96 mm (H) x 94.44 mm (W) x 8.7 mm (T)
Overall weight
48.8 gm
Table 5-2. Absolute Maximum Specifications
Parameter
Value
Operating temp
0ºC to +70ºC
Storage temp
-30ºC to +80ºC
VDD
-0.5 to +6V
VDDIO
-0.5 to +3.6V
Maximum continuous pin current, any control or drive pin
±40 mA
Voltage forced onto any pin
-0.5V to (VDD + 0.5) Volts
CAUTION
Stresses beyond those listed in the above table may cause permanent damage to the device. This is a
stress rating only and the functional operation of the device at these or other conditions beyond those
indicated in the operational sections of this specification are not implied. Exposure to absolute maximum
specification conditions for extended periods may affect device reliability.
Table 5-3. Recommended Operating Conditions
Parameter
Value
VIN
3.3V
Supply noise
±20 mV
Table 5-4. DC Specifications
Parameter
Description
Min.
Typ
Max.
Units
Notes
VIL
Low-input logic level
-0.5
-
0.3 VDD
V
1.8V <VDD <3.3V
VHL
High- input logic level
0.7 VDD
-
V
1.8V <VDD <3.3V
VOL
Low- output voltage
-
0.2 VDD
V
VOH
High- output voltage
0.8 VDD
-
-
V
IIL
Input leakage current
-
1
μA
VIN = 3.3V, VDD = 2.8 VDC, TA = recommended range, unless otherwise noted.
Table 5-5. I
2
C Compatible Bus Specifications
Parameter
Operation
Touchscreen controller address
0x4A
Specifications
©
2020 Microchip Technology Inc.
DS70005414B-page 11
