NOTES ON HANDLING AND REPLACEMENT OF THE LASER PICK-UP
Solder a part of the LD circuit to short-circuit. After connecting the circuit, remove the soldering form.
Precautions when handling the laser CD mechanism
• Be careful not to expose the laser pick-up to dust.
• Do not leave the laser pick-up bare. Be sure to cover it.
• If dust adheres on the laser pick-up lens, blow it off with a blower brush.
• Do not apply shock to the laser pick-up.
• Do not watch the light of the laser pick-up.
• Be sure that the bench, jig, head of soldering iron (with ceramic) and measuring instruments are well
grounded.
• Workers who handle the laser pick-up must be grounded.
• The finished mechanism (prior to anchoring in the set) should be protected against static electricity
and dust.
The mechanism must be stored where abnormal external force is not applied.
• When carrying the finished mechanism, hold it by the chassis body.
• Do not use or store the mechanism where corrosive gas such as H2S, SO2, NO2 and CI2 or toxic gas
may be generated, or where substances especially organosilicon, cyanide, formalin and phenolic materi-
als exist. In particular, make sure that these substances which generate toxic gas do not exist in the set.
This may cause the motor not rotating.
1. Protection of the LD
2. Precautions when handling the laser CD mechanism
3. Cautions on assembling and adjustment
d
• Measure the
q
RFEQO waveform of the MAIN PCB ASSY and check the amplitude level.
(See
MEASURING METHOD AND WAVEFORMS
• If the amplitude level of the measured RFEQO waveform is between 0.4 and 1.1Vp-p, the pickup laser is
OK.
• Check the Iop (Laser drive current).
Check lop in "
SPECIAL MODE
4.7. Displaying the laser current
")
• If the present Iop (current) value is "
50 mA
" or higher, replace the Traverse unit with a new one.
• No mechanical adjustment is necessary after the replacement.
4. Notes on Handling the Laser Pick-Up
Protective soldering place for laser diode.
35
Caution in
servicing
Electrical
Mechanical
Repair Information
Updating
