Lucent Technologies DDM-2000 OC-3, Руководство пользователя и обслуживания

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363-206-285
Administration and Provisioning
8-48 Issue 3 June 2001
Provisioning Changes 8
The T1EXT circuit pack provisioning involves line coding, maintenance signal
processing, and performance monitoring. The provisioning parameters used for
provisioning these parameters is identical to that used for the BBF3/BBF3B DS1
circuit pack.
IMA LAN Cross Connection and Description 8
Starting with OC-3 Release 15.0, the Low Speed slots of the DDM-2000 OC-3
shelf will support the BBF9 and BBF10 LAN circuit pack 9 to be used to
interconnect a Local Area Network to a Wide Area Network (WAN) through the
IEEE standard 802.3 compliant interface.
The LAN circuit pack provides one 10/100BaseT (BBF9) on one 100BaseFX
(BBF10) 802.3 compliant interface. The pack occupies two adjacent low-speed
(DS1) slots and can use up to 8 DS1/VT1.5 channels on an OC-1/ OC-3 or OC-12
ring. Any available VT time slot can be assigned to the LAN interface. The 802.3
LAN interface performs a bridging (layer 2) function by which Protocol Data Units
(MAC packets) are forwarded for transmission through the SONET network. MAC
addresses are learned and aged automatically by the 802.3 device to prevent
locally destined packets from traversing the network. The selected MAC packets
are mapped into ATM cells using either the AAL5 IETF-RFC-1483 multi-protocol
encapsulation or VC multiplexed format (one format will be pre-configured for the
initial release). All user ATM cells have a single (default provisioned) VP/VC
address. The ATM cells are round robin distributed over 1 to 8 DS1 channels
using the ATM Forum specification for ATM inverse multiplexing (IMA) AF-PHY-
0086.00 version 1. Each DS1 channel is mapped into a SONET VT1.5 channel
for transmission through the SONET network. In the receive direction the circuit
pack performs the reverse process to recover MAC packets for forwarding to the
802.3 LAN.
Configurations Supported 8
Up to three LAN circuit packs can be installed in a DDM-2000 OC-3 Low Speed
group (a,b, and/or c), when the associated Function Unit is equipped with the
BBG2B or BBG2 MXRVO. The following lists the different Low Speed slot
combinations that this circuit pack can use:
ls-{a,b,c}-1&2, ls-{a,b,c}-2&3, ls-{a,b,c}-3&4, ls-{a,b,c}-5&6 and ls-{a,b,c}-6&7
Mixing of Low Speed Circuit Packs 8
Lucent will allow the mixing of LAN circuit packs with other Low Speed packs (i.e:
DS1, T1EXT). The following table summarizes some mixing possibilities in the
Low Speed slots (on a per Low Speed Group basis) Note that High Speed 22, 24