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Product description
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Lenze · I/O system 1000 · Reference Manual · DMS 5.0 EN · 09/2016 · TD17
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Product description
Features of the I/O system 1000
The I/O system 1000 is suitable for the implementation of complex automation applications
consisting of the following components: bus coupler module, I/O compound modules, and
backplane bus.
• Modular system
• Dimensions
• I/O compound module 109 × 76.5 × 12.5 mm
• Bus coupler module 109 × 76.5 × 48.5 mm
• Mounting on standard DIN rail (35 mm)
• Shield connection to standard metal rail (10 × 3 mm)
• The two-piece structure (separation of electronics and process integration) enables a quick
exchange of modules in the event of service
• Wiring level via spring terminal (max. 1.5 mm²)
• Operation at DC 24 V (DC 20.4 … DC 28.8 V)
• Supply voltage of electronics and process level are separated
• Number of I/O compound modules
• A bus coupler can contain up to 64 modules
• Individual labelling by insertable labels (item designation)
• Electrical wiring diagrams are directly printed on the module
• Electrical isolation to the fieldbus and the process level
• Creation of electrical isolations by power supply modules