Lenze E70AC Series, Руководство по оборудованию

Страница: 71 / 162

Mechanical installation
Dimensions
Mounting in "cold plate" technique
5
l
71
EDS700ACBA EN 5.1
5.3.4 Mounting in "cold plate" technique
The E70ACxxCxxx4x... devices are designed for assembly on coolers (e.g. collective coolers)
in "cold−plate" technique.
Requirements for collective coolers
A good thermal connection to the cooler is important for the trouble−free operation of
the controller:
ƒ
The contact area between the collective cooler and the controller
– must be at least as big as the cooling plate of the controller.
– must be smooth, the maximum deviation must not exceed 0.05 mm.
ƒ
The controller has to be connected to the collective cooler with all required screwed
joints.
ƒ
The thermal resistance R
th
must be observed, see table.
The values in the table apply to the operation of the controllers under rated
conditions.
The values already include the heat transmission between the cooler and the device
with a standard heat conducting paste at a film thickness of approx. 50
m
m.
Power loss Thermal resistance T
max
Power loss
(control cabinet)
Type P
V1
[W] R
th
[K/W] [°C] P
V2
[W]
E70ACPSC0304x 45
£
1.11 85 15
E70ACMxC0054xx1xxx 25
£
2.00 85 25
E70ACMxC0104xx1xxx 50
£
1.00 85 30
E70ACMxC0204xx1xxx 95
£
0.53 85 35
E70ACMxC0054xx2xxx 50
£
1.00 85 40
E70ACMxC0104xx2xxx 95
£
0.53 85 55
E70ACPSC0604x 85
£
0.41 70 25
E70ACMxC0324xx1xxx 140
£
0.29 75 70
E70ACMxC0484xx1xxx 215
£
0.19 75 85
E70ACMxC0644xx1xxx 290
£
0.14 75 100
E70ACMxC0204xx2xxx 185
£
0.22 75 75
E70ACMxC0324xx2xxx 275
£
0.15 75 105
Tab. 5−1 Cold plate
P
V1
separated power loss, to be dissipated via heatsink
P
V2
Power loss remaining in the control cabinet
Ambient conditions
ƒ
The rated data and the derating factors at increased temperature also apply to the
ambient temperature of the drive controllers.
)
Note!
Apply standard heat−conducting paste or heat−conducting foil onto cooler and
cooling plate before you bolt the controller onto the cooler.