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7: Mounting
GNSS Receiver Module A5135-H User Guide
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2. If proposal 1 is not allowed. Placed a round Copper keep out region (diameter
≥
3mm) on the application PCB underneath the RF feed-point to alleviate the inter-
ference from RF signal to other part of circuitries. Besides, ground vias (says, 8)
should be placed surrounding the through hole for further shielding purpose.
Figure 13: Proposal (2) of the PCB design
7.3 Recommended Profile for Reflow Soldering
Typical values for reflow soldering of the module in convection or IR/convection ov-
ens are as follows (according to IPC/JEDEC J-STD-020D):
Parameter
Value
Peak temperature (RoHS compliant process)
245°C
Average ramp up rate to peak (217°C to Peak)
3°C / second max.
Preheat temperature
min=150°C; max=200°C
Ramp up time from min. to max. preheat temperature 60 … 120 seconds
Temperature maintained above 217°C
60 … 150 seconds
Time within 5°C of actual peak temperature
30 seconds
Ramp down rate
6°C / second max.
Time 25°C to peak temperature
8 minutes max.
Table 8: Reflow soldering profile A5135-H
As results of soldering may vary among different soldering systems and types of sol-
der and depend on additional factors like density and types of components on board,
the values above should be considered as a starting point for further optimization.