Laird DVK-BT900-S Series, Руководство по интеграции оборудования

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BT900 Development Kit
Version 0.3
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
21 Laird Technologies
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852-2268-6567 x026
6.2.5 I2C device
Figure 14: I2C device
The I2C device (U13) on the DVK-BT900-V01 can be connected to dedicated SIOs of the BT900 module via micro-DIP
switch CON15. Default the SPI device is disconnected (micro-DIP switch is open) from BT900. Physical micro-DIP
switch body has text ON on the closed side.
Refer to the following
smart
BASIC applications that make use of the I2C RTC chip to prove the BT900 I2C interface:

rtcc.lient.sb (Update RTC Client application)

rtcs.erver.sb (Update RTC server)
6.2.6 SPI device
Figure 15: SPI device
The SPI device (U12) on the DVK-BT900-V01 can be connected to dedicated SIO’s of the BT900 module via micro-DIP
switch CON15. Default the SPI device is disconnected (micro-DIP switch is open) from BT900. Physical micro-DIP
switch body has text “ON” on the closed side.
Refer to the following
smart
BASIC applications that make use of the SPI device (an EEprom chip) to prove the BT900
SPI interface:

spic.lient.sb (Update CMD application and Add SPI sample)

spis.erver.sb (Fix SPIserver)
SIO_10
SIO_11 RTC_SDA
RTC_SCL
SIO_12 Buzzer
CON15
DIP SW,SMD/180d
1
2
3
4 5
6
7
8
R63
2.2K
VCC_IO
GND
Y 1
32.768KHz,20ppm,7pF
1
2
R64
2.2K
GND
U13
I2C RTCC,1.8V~5.5V
X1
1
X2
2
VBAT
3
VSS
4
SDA
5
SCL
6
MFP
7
VCC
8
GND
C30
0.1uF,16V
C31
10pF,50V
GND
C32
10pF,50V
R70
0R
GND
RTC_ALARM
RTC_SDA
RTC_SCL
R61
10K
CON16
DIP SW,SMD/180d
1
2
3
4 5
6
7
8
EEprom_MISO SIO_6
SIO_8
SIO_9
SIO_7 EEprom_MOSI
EEprom_CS
EEprom_SCK
GND
U12
256Kb,20MHz
CSn
1
SO
2
WPn
3
GND
4
SI
5
SCK
6
HOLDn
7
VCC
8
C33
0.1uF,16V
EEprom_MOSI
EEprom_SCK
EEprom_MISO
EEprom_CS
VCC_IO
VCC_IO