41
www.lairdtech.com
Laird Technologies
BTM510/511
Bluetooth
®
Multimedia Module
MECHANICAL dETAILS
rECOMMENdEd PCB FOOTPrINT
(all dimensions in mm)
1
12
13
27
28
54
40
39
34
RF OUT (See Note 1)
15.2
21.2
1x11
1x14
pin pitch
pin pitch
Pad Width 0.7 Typ
Pad Length 1.65 Typ
5.5
7
10.6
7.6
MODULE OUTLINE
(See note 2)
1
12
13
27
28
54
40
39
1
12
13
27
28
54
40
39
TOP VIEW
BOTTOM VIEW
(COMPONENT SIDE)
(SMT PADS)
E
D
34
34
RF
OUT
RF
OUT
SIDE
VIEW
Description
54 pin BT Voice Module (8X6 Flash)
Size
20.0 x 14.0 x 2.4mm
Pitch
1.0mm
Dimension
Minimum
Typical
Maximum
Notes
D1
E1
e
G
H
A1
A2
A
b
A
2.4
2.7
A1
0.8
0.9
1.0
A2
1.5
1.7
b
0.60
D
13.87
14.0
14.13
E
19.87
20.0
20.13
e
1.0
D1
11.0
E1
14.0
F
1.50
G
3.00
PCB Thickness
RF Shield Height
Global pad width
Global pitch
2.3
H
0.85
Global length of pad to edge of board
Units
mm
Pin Outs
RF Shield
U1
U3
Orientation mark
on PCB and RF Shield
denotes pin 1
F
H
1.3
0.65
0.55
Pad Centre to Board edge
Pad Centre to Board edge
1
12
13
27
28
54
40
39
1
12
13
27
28
54
40
39
TOP VIEW
BOTTOM VIEW
(COMPONENT SIDE)
(SMT PADS)
E
D
34
34
RF
OUT
RF
OUT
SIDE
VIEW
Description
54 pin BT Voice Module (8X6 Flash)
Size
20.0 x 14.0 x 2.4mm
Pitch
1.0mm
Dimension
Minimum
Typical
Maximum
Notes
D1
E1
e
G
H
A1
A2
A
b
A
2.4
2.7
A1
0.8
0.9
1.0
A2
1.5
1.7
b
0.60
D
13.87
14.0
14.13
E
19.87
20.0
20.13
e
1.0
D1
11.0
E1
14.0
F
1.50
G
3.00
PCB Thickness
RF Shield Height
Global pad width
Global pitch
2.3
H
0.85
Global length of pad to edge of board
Units
mm
Pin Outs
RF Shield
U1
U3
Orientation mark
on PCB and RF Shield
denotes pin 1
F
H
1.3
0.65
0.55
Pad Centre to Board edge
Pad Centre to Board edge
1
12
13
27
28
54
40
39
1
12
13
27
28
54
40
39
TOP VIEW
BOTTOM VIEW
(COMPONENT SIDE)
(SMT PADS)
E
D
34
34
RF
OUT
RF
OUT
SIDE
VIEW
Description
54 pin BT Voice Module (8X6 Flash)
Size
20.0 x 14.0 x 2.4mm
Pitch
1.0mm
Dimension
Minimum
Typical
Maximum
Notes
D1
E1
e
G
H
A1
A2
A
b
A
2.4
2.7
A1
0.8
0.9
1.0
A2
1.5
1.7
b
0.60
D
13.87
14.0
14.13
E
19.87
20.0
20.13
e
1.0
D1
11.0
E1
14.0
F
1.50
G
3.00
PCB Thickness
RF Shield Height
Global pad width
Global pitch
2.3
H
0.85
Global length of pad to edge of board
Units
mm
Pin Outs
RF Shield
U1
U3
Orientation mark
on PCB and RF Shield
denotes pin 1
F
H
1.3
0.65
0.55
Pad Centre to Board edge
Pad Centre to Board edge
1
12
13
27
28
54
40
39
1
12
13
27
28
54
40
39
TOP VIEW
BOTTOM VIEW
(COMPONENT SIDE)
(SMT PADS)
E
D
34
34
RF
OUT
RF
OUT
SIDE
VIEW
Description
54 pin BT Voice Module (8X6 Flash)
Size
20.0 x 14.0 x 2.4mm
Pitch
1.0mm
Dimension
Minimum
Typical
Maximum
Notes
D1
E1
e
G
H
A1
A2
A
b
A
2.4
2.7
A1
0.8
0.9
1.0
A2
1.5
1.7
b
0.60
D
13.87
14.0
14.13
E
19.87
20.0
20.13
e
1.0
D1
11.0
E1
14.0
F
1.50
G
3.00
PCB Thickness
RF Shield Height
Global pad width
Global pitch
2.3
H
0.85
Global length of pad to edge of board
Units
mm
Pin Outs
RF Shield
U1
U3
Orientation mark
on PCB and RF Shield
denotes pin 1
F
H
1.3
0.65
0.55
Pad Centre to Board edge
Pad Centre to Board edge
MECHANICAL
drAWINgS