CP3003-SA
Thermal Considerations
ID 1052-6929, Rev. 3.0
Page 6 - 5
D R A F T — F O R I N T E R N A L U S E O N L Y
6.3
Chipset Thermal Monitor Feature
The Intel® QM77 Chipset includes one on-die Thermal Diode Sensor to measure the chipset
die temperature.
The maximum Intel® QM77 Chipset junction temperature is 108°C
.
6.4
External Thermal Regulation
To ensure the best possible basis for operational stability and long-term reliability, the CP3003-
SA is equipped with a heat sink. Coupled together with system chassis, which provides variable
configurations for forced airflow, controlled active thermal energy dissipation is guaranteed.
The physical size, shape, and construction of the heat sink and ensures the lowest possible
thermal resistance. In addition, the CP3003-SA has been specifically designed to efficiently
support forced airflow
as found in modern CompactPCI systems.
Thermal Characteristic Graphs
The thermal characteristic graphs shown in the following sections illustrate the maximum am-
bient air temperature as a function of the volumetric airflow rate for the power consumption in-
dicated. The diagrams are intended to serve as guidance for reconciling board and system with
the required computing power considering the thermal aspect. One diagram per CPU version
is provided. There are up to two curves representing upper level working points based on dif-
ferent levels of average CPU utilization. When operating below the corresponding curve, the
CPU runs steadily without any intervention of thermal supervision. When operated above the
corresponding curve, various thermal protection mechanisms may take effect resulting in tem-
porarily reduced CPU performance or finally in an emergency stop in order to protect the CPU
and the chipset from thermal destruction. In real applications this means that the board can be
operated temporarily at a higher ambient temperature or at a reduced flow rate and still provide
some margin for temporarily requested peak performance before thermal protection will be ac-
tivated.
An airflow of 2.0 m/s to 3.0 m/s is a typical value for a standard
Kontron
ASM rack. For other
racks or housings the available airflow will differ. The maximum ambient operating temperature
must be recalculated and/or measured for such environments. For the calculation of the
maximum ambient operating temperature, the processor and chipset junction temperature
must never exceed the specified limit for the involved processor and chipset.
Thermal characteristic curves
• Thermal characteristic curve of the CP3003-SA with maximum processor workload
and basic graphics operation
This load complies with the values indicated in Chapter 5.2, “Power Consumption of
the CP3003-SA”, Table 5-6.
• Thermal characteristic curve of the CP3003-SA with maximum processor and graph-
ics controller workload
This load complies with the values indicated in Chapter 5.2, “Power Consumption of
the CP3003-SA”, Table 5-7.
Содержание CP3003-SA
Страница 14: ...Preface CP3003 SA Page xiv ID 1052 6929 Rev 3 0 D R A F T F O R I N T E R N A L U S E O N L Y...
Страница 18: ...Preface CP3003 SA Page xvi ID 1052 6929 Rev 3 0 D R A F T F O R I N T E R N A L U S E O N L Y...
Страница 121: ...CP3003 SA CP3003 HDD ID 1052 6929 Rev 3 0 Page A 1 CP3003 HDD Chapter 1 A D R A F T F O R I N T E R N A L U S E O N L Y...
Страница 135: ...CP3003 SA CP3003 XMC ID 1052 6929 Rev 3 0 Page B 1 CP3003 XMC Chapter 1 B D R A F T F O R I N T E R N A L U S E O N L Y...
Страница 167: ...CP3003 SA CP3003 V ID 1052 6929 Rev 3 0 Page F 1 CP3003 V Chapter 1 F D R A F T F O R I N T E R N A L U S E O N L Y...
