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0142530-000 AB
KLA-Tencor Confidential
3-77
3/13/09
KLA-Tencor P-16+ / P-6 User’s Guide
Scan Recipes - CMP Analysis
CMP A
NALYSIS
3
Introduction
3
CMP (Chemical Mechanical Polishing) processes are used on a variety of
different surface compositions. In general, the analysis of CMP surface scans
centers around three structures: arrays, lines, and pads. The analysis can be
performed in 2D or 3D scans. Each basic structure is discussed in its own
section.
Figure 3.61
Histogram Depth
Содержание P-16+
Страница 4: ...KLA Tencor P 16 P 6 User s Guide KLA Tencor Confidential 0142530 000 AB 3 13 09...
Страница 24: ...KLA Tencor P 16 P 6 User s Guide LOT 4 KLA Tencor Confidential 0142530 000 AB Friday March 13 2009 Preliminary...
Страница 30: ...Introduction Safety Safety KLA Tencor P 16 P 6 User s Guide 1 6 KLA Tencor Confidential 0142530 000 AB 3 13 09...
Страница 180: ...XY View Screen Aligning the Sample KLA Tencor P 16 P 6 User s Guide 4 32 KLA Tencor Confidential 0142530 000 AB 3 13 09...
Страница 196: ...View Scan Window Aborting A Scan KLA Tencor P 16 P 6 User s Guide 5 16 KLA Tencor Confidential 0142530 000 AB 3 13 09...
Страница 434: ...Backup and Restore KLA Tencor P 16 P 6 User s Guide 16 8 KLA Tencor Confidential 0241110 000 AB 3 13 09...
Страница 444: ...KLA TENCOR P 16 P 6 USER S GUIDE REVISION HISTORY 2 KLA TENCOR CONFIDENTIAL 0142530 000 AB 3 13 09...