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Keysight W6600A-series LPDDR4 BGA Interposers Installation Guide
75
Characteristics, Regulatory, Safety and Storage Information
9
Storage, Inspection, Baking, and Cleaning Guidelines
The following are some of the guidelines for storing, shelf life, and cleaning of the
W6600A-series
interposers.
Guidelines for Shelf Life and Solder-ability of W6600A-series Interposers
If your Interposer exceeds shelf life (1 year) before solder into application, use the following
inspection and baking method.
• Inspect the humidity indicator within moisture proof vacuum sealed bag(s).
• If the humidity indicator shows moisture then bake the board at 120 degrees C for 4 hours and
perform the solder-ability test.
• If the test passes, proceed with the assembly (reflow) of interposer.
• If delamination occurs, the interposer cannot be used.
Cleaning of W6601A Interposer Gold Fingers
• Use Isopropyl alcohol to clean W6601A interposer contacts.
• Never use abrasive cleaning materials.
WARNING
When using alcohol to clean interposer contacts, ensure that the interposer is disconnected.
Perform this activity in a well-ventilated area.
Allow all residual alcohol moisture to evaporate, and the fumes to dissipate before
reconnecting the interposer for use.
Dispose off the cleaning materials in a responsible manner.
Содержание LPDDR4
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