Section 4: Maintenance
S540 Power Semiconductor Test System Administrative Guide
4-2
S540-924-01 Rev. D / January 2019
Handling and cleaning precautions
Always grasp cards by the side edges and shields to avoid contamination that will degrade
the performance of the components. Do not touch the connectors, the board surfaces, or
components. On plugs and receptacles, do not touch areas adjacent to the electrical
contacts.
Take care when handling or servicing to prevent possible contamination in high-impedance areas,
which could degrade performance. Take the following precautions when servicing any system
component:
Do not store or operate the system in an environment where dust could settle on the components.
Use dry nitrogen gas to clean dust off the components, if necessary.
Handle cards only by the side edges and shields.
Do not touch any board surfaces, components, or connectors.
Do not touch areas adjacent to electrical contacts.
Wear clean-room approved gloves when servicing any component.
If necessary, make solder repairs on a circuit board using lead-free solder. Remove the solder
from the work areas when the repair is complete. Use pure water and clean cotton swabs or a
clean, soft brush to remove the solder. Take care not to spread the solder to other areas of the
components. Once the solder is removed, use a swab moistened with methanol or isopropyl
alcohol to wipe only the repaired area, and then blow-dry the board with dry nitrogen gas.
After cleaning, place the components in a 50 °C low-humidity environment for several minutes
before use.
