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SCHEMATIC DIAGRAMS
UX-GD7
Contents
Block diagram
Standard schematic diagrams
Printed circuit boards
2-1
2-2
2-8 to 11
CD-ROM No.SML200508
MICRO COMPONENT SYSTEM
No.MB422SCH
2005/8
COPYRIGHT 2005 Victor Company of Japan, Limited.
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
CA-UXGD7
SP-UXGD7
SP-UXGD7
Area suffix
B ------------------------------ U.K.
E ---------- Continental Europe
EN ----------- Northern Europe
EV ------------- Eastern Europe
EE -------- Russian Federation
Содержание UX-GD7
Страница 1: ......
Страница 35: ...2 1 Block diagram ...
Страница 37: ...2 3 Amp section ...
Страница 38: ...2 4 Function section ...
Страница 39: ...2 5 Video section ...
Страница 40: ...2 6 Micon section ...
Страница 41: ...2 7 Front section ...
Страница 43: ...2 9 Main board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade Reverse side ...
Страница 45: ...2 11 Trans board Lead free solder used in the board material Sn Ag Cu melting point 219 Centigrade ...