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Quality and Reliability Requirements

Intel

®

Xeon

®

Processor C5500/C3500 Series and LGA1366 Socket

Thermal/Mechanical Design Guide

August 2010

67

Order Number: 323107-002US

8.2

Intel Reference Component Validation

Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.

While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess
performance for specific conditions.

Note:

The 1U thermal solution was tested but the ATCA solution was not fully tested.

8.2.1

Board Functional Test Sequence

Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/processor/memory test.

Table 8-2.

Server Use Conditions Environment (System Level)

Use Environment

Speculative Stress Condition

Example Use Condition

Shipping and Handling

Mechanical Shock

• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based on packaged weight

Total of 12 drops per

system:

• 2 drops per axis
• ± direction

Product weight (lbs)

Non-palletized product

velocity change (in/sec)

< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120

≥

120

250
225
205
175
145
125

Change in velocity is based upon a 0.5 coefficient of

restitution.

Shipping and Handling

Random Vibration

• System Level
• Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
• 5 Hz @ .001 g

2

/Hz to 20 Hz @ 0.01 g

2

/Hz

(slope up)

• 20 Hz to 500 Hz @ 0.01 g

2

/Hz (flat)

• Random control limit tolerance is ± 3 dB

Total per system:

• 10 minutes per axis
• 3 axes

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Содержание X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor

Страница 1: ...Order Number 323107 002US Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 ...

Страница 2: ...e or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel Xeon Processor C5500 C3500 Series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from ...

Страница 3: ...3 Contacts 22 3 3 4 Pick and Place Cover 22 3 4 Package Installation Removal 23 3 4 1 Socket Standoffs and Package Seating Plane 23 3 5 Durability 24 3 6 Markings 24 3 7 Component Insertion Forces 24 3 8 Socket Size 24 3 9 LGA1366 Socket NCTF Solder Joints 24 4 Independent Loading Mechanism ILM 26 4 1 Design Concept 26 4 1 1 ILM Cover Assembly Design Overview 26 4 1 2 ILM Back Plate Design Overvie...

Страница 4: ...rization Parameter 59 7 5 2 NEBS Thermal Profile 60 7 5 3 Power Thermal Utility 61 7 6 Thermal Features 61 7 6 1 Fan Speed Control 61 7 6 2 PECI Averaging and Catastrophic Thermal Management 62 7 6 3 Intel Turbo Boost Technology 62 7 6 4 Absolute Processor Temperature 63 7 6 5 Custom Heat Sinks For UP ATCA 63 8 Quality and Reliability Requirements 66 8 1 Use Conditions 66 8 2 Intel Reference Compo...

Страница 5: ...eron Processor P1053 Thermal Profile 43 6 6 Intel Xeon Processor LC3528 Thermal Profile 44 6 7 Intel Xeon Processor LC3518 Thermal Profile 46 6 8 TTV Case Temperature TCASE Measurement Location 47 6 9 Frequency and Voltage Ordering 49 7 1 1U Heatsink Performance Curves 55 7 2 ATCA Heatsink Performance Curves 56 7 3 TTV Die Size and Orientation 57 7 4 1U Reference Heatsink Assembly 57 7 5 Processor...

Страница 6: ...ecifications 38 6 4 Intel Xeon Processor EC3539 and EC5539 Thermal Profile 39 6 5 Intel Xeon Processor LC5528 Thermal Specifications 40 6 6 Intel Xeon Processor LC5528 Thermal Profile 41 6 7 Intel Xeon Processor LC5518 Thermal Specifications 41 6 8 Intel Xeon Processor LC5518 Thermal Profile 42 6 9 Intel Celeron Processor P1053 Thermal Specifications 43 6 10 Intel Celeron Processor P1053 Thermal P...

Страница 7: ...10 Thermal Mechanical Design Guide Order Number 323107 002US 7 Revision History Revision Number Description Revision Date 002 Modified Table 5 3 Socket and ILM Mechanical Specifications Modified Section 7 6 1 Fan Speed Control August 2010 001 First release February 2010 ...

Страница 8: ...his document include The processor thermal solution heatsink and associated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate The goals of this document are To assist board and system thermal mechanical designers To assist designers and suppliers of processor heatsinks Other processor specifications are provided in the Intel Xeon Processor C5500 C3500 S...

Страница 9: ...on temperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366 LGA land package onto the socket contacts IMON The current monitor input to the CPU The V...

Страница 10: ...perature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of a processor at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the h...

Страница 11: ...ttached to the package substrate and core and serves as the mating surface for processor component thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together See Section 3 and Section 4 The package components shown in Figure 2 1 include the following Integrated Heat Spreader IHS Thermal Interface Material TIM Processor cor...

Страница 12: ...e package mechanical drawings are shown in Figure 2 2 and Figure 2 3 The drawings include dimensions necessary to design a thermal solution for the processor These dimensions include 1 Package reference with tolerances total height length width etc 2 IHS parallelism and tilt 3 Land dimensions 4 Top side and back side component keep out dimensions 5 Reference datums 6 All drawing dimensions are in ...

Страница 13: ...MBER REV A1 D76126 7 SCALE 2 1 DO NOT SCALE DRAWING SHEET 1 OF 2 FINISH MATERIAL DATE APPROVED BY DATE CHECKED BY DATE DRAWN BY DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14 5M 1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS 0 ANGLES 0 5 THIRD ANGLE PROJECTION SEE DETAIL B SEE DETAIL B SEE DETAIL B SEE DETAIL B IHS...

Страница 14: ...ORPORATION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED REPRODUCED DISPLAYED OR MODIFIED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION D76126 2 7 DWG NO SHT REV DEPARTMENT 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 SIZE DRAWING NUMBER REV A1 D76126 7 SCALE 2 1 DO NOT SCALE DRAWING SHEET 2 OF 2 1 3 5 7 9 11 13 15 17 19 ...

Страница 15: ...reference or load bearing surface for thermal solutions Notes 1 These specifications apply to uniform compressive loading in a direction normal to the processor IHS 2 This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism ILM 3 These specifications are based on limited testing for design characterization Loading limits are for the package constrained...

Страница 16: ...e 2 4 shows the topside markings on the processor This diagram is to aid in the identification of the processor Table 2 3 Processor Materials Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 2 4 Processor Top Side Markings GRP1LINE1 GRP1LINE2 G2L1 G2L2 G3L1 G3L2 Legend Mark Text Engineering Mark GRP1LINE...

Страница 17: ...er Number 323107 002US 17 Package Mechanical Specifications 2 1 9 Processor Land Coordinates Figure 2 5 shows the bottom view of the processor land coordinates The coordinates are referred to throughout the document to identify processor lands Figure 2 5 Processor Land Coordinates and Quadrants Bottom View ...

Страница 18: ...nter of the socket with lead free solder balls for surface mounting on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43 x 41 grid array with 21 x 17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back p...

Страница 19: ...366 Socket Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 19 Order Number 323107 002US Figure 3 2 LGA1366 Socket Contact Numbering Top View of Socket ...

Страница 20: ...mmendations for pad definition on a per pad basis do not exist for the LGA1366 socket The 40 mil spacing results in a reduced drill keepout as compared to previous platforms Drill keepout is explained in section 3 2 1 of the Intel Xeon 5500 Platform Design Guide PDG Select PCB suppliers are capable of producing 40 mil spacing Figure 3 3 LGA1366 Socket Land Pattern Top View of Board A C E G J L N R...

Страница 21: ...g capable of withstanding 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in Section 8 The color of the housing will be dark as compared to the solder balls This provides the contrast needed for pick and place vision systems 3 3 2 Solder ...

Страница 22: ... manufacturing line The cover remains on the socket during reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in Section 6 without degrading As indicated in Figure 3 5 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the socket...

Страница 23: ...tation posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package 3 4 1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are ...

Страница 24: ...ded or laser marked on the side wall 3 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be designed so that it requires no force to insert the package into the socket 3 8 Socket Size Socket information needed for motherb...

Страница 25: ...igure 3 7 LGA1366 NCTF Solder Joints A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 16 12 15 13 14 17 18 24 20 19 23 21 22 25 26 32 28 27 31 29 30 33 34 40 36 35 39 37...

Страница 26: ...eference ILM Custom non Intel ILM designs do not benefit from Intel s detailed studies and may not incorporate critical design parameters 4 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back plate 4 1 1 ILM Cover Assembly Design Overview The ILM cover assembly consists of four major pieces...

Страница 27: ... heatsink attach The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket A clearance hole is located at the center of the plate to allow access to test points and backside capacitors An additional cut out on two sides provides clearance for backside voltage regulator components An insulator is p...

Страница 28: ... Holes in the motherboard provide alignment to the threaded studs In step 2 the ILM cover assembly is placed over the socket and threaded studs Using a T20 Torx driver fasten the ILM cover assembly to the back plate with the four captive fasteners Torque to 8 inch pounds The length of the threaded studs accommodate board thicknesses from 0 062 0 100 Figure 4 2 Back Plate Threaded studs Threaded nu...

Страница 29: ...Independent Loading Mechanism ILM Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 29 Order Number 323107 002US Figure 4 3 ILM Assembly ...

Страница 30: ...ng Mechanism ILM As indicated in Figure 4 4 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket The result is a specific Pin 1 orientation with respect to ILM lever See the Manufacturing Advantage Service for additional details on fixtures and assembly guidance Figure 4 4 Pin1 and ILM Lever ...

Страница 31: ...counting for its nominal variation and tolerances that are given in the corresponding processor Datasheet 2 This value is a RSS calculation 5 3 Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term reliability Intel defines socket maximum temperature using a via on the underside of...

Страница 32: ...dition the heatsink performance targets and boundary conditions of Table 6 1 must be met to limit power dissipation through the socket To measure via temperature 1 Drill a hole through the back plate at the specific via defined above 2 Thread a T type thermocouple 36 40 gauge through the hole and glue it into the specific via on the underside of the motherboard 3 Once the glue dries reinstall the ...

Страница 33: ... is validated to these limits 3 Loading limits are for the LGA1366 socket 4 This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550gm 1 21 lb with 50 g acceleration measured at heatsink ...

Страница 34: ...on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 mΩ The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each chain minus resistance of shortin...

Страница 35: ...ets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 2 A detailed description of this methodology is at ftp download intel com technology itj q32000 pdf reliability pdf Figure 5 2 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the ma...

Страница 36: ...es available Processors are listed here by TDP Multiple SKUs may have the same TDP and same spec The Intel Xeon processor C5500 C3500 series implements a methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control and to assure processor reliability Selection of the appropriate fan speed is based on the relative temperature data re...

Страница 37: ...VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC See the loadline specifications in the Datasheet 2 Thermal Design Power TDP should be used for processor thermal solution design targets TDP is not the maximum power that the processor can dissipate TDP is measured at maximum TCASE 3 These specifications are based on initial silicon characterization These specifications may be fu...

Страница 38: ...con characterization These specifications may be further updated as more characterization data becomes available 4 Power specifications are defined at all VIDs found in the Datasheet The Intel Xeon processor C5500 C3500 series Intel Xeon processor C5500 C3500 series may be shipped under multiple VIDs for each frequency 5 FMB Flexible Motherboard guidelines provide a design target for meeting all p...

Страница 39: ...titute the thermal profile 2 Implementation of Intel Xeon processor EC3539 and EC5539 Thermal Profile should result in virtually no TCC activation Figure 6 2 Intel Xeon Processor EC3539 and EC5539 Thermal Profile Thermal Profile 40 50 60 70 80 0 5 10 15 20 25 30 35 40 45 50 55 60 65 Power W Tcase C Thermal Profile Tc 0 302 P 55 Table 6 4 Intel Xeon Processor EC3539 and EC5539 Thermal Profile Power...

Страница 40: ...equirements Notes 1 Intel Xeon processor LC5528 Thermal Profile is representative of a volumetrically constrained platform See Table 6 7 for discrete points that constitute the thermal profile 2 Implementation of Intel Xeon processor LC5528 nominal and short term thermal profiles should result in virtually no TCC activation Furthermore utilization of thermal solutions that do not meet this Thermal...

Страница 41: ...ilicon characterization These specifications may be further updated as more characterization data becomes available 4 Power specifications are defined at all VIDs found in the Datasheet The Intel Xeon processor C5500 C3500 series may be shipped under multiple VIDs for each frequency 5 FMB Flexible Motherboard guidelines provide a design target for meeting all planned processor frequency requiremen...

Страница 42: ...surable performance loss 3 The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require NEBS Level 3 compliance 4 The Short Term Thermal Profile may only be used for short term excursions to higher ambient operating temperatures not to exceed 360 hours per year per year as compliant with NEBS Level 3 Operation at the Short Term Thermal Profile fo...

Страница 43: ...VIDs found in the Datasheet The Intel Xeon processor C5500 C3500 series may be shipped under multiple VIDs for each frequency 5 FMB Flexible Motherboard guidelines provide a design target for meeting all planned processor frequency requirements Notes 1 Intel Celeron processor P1053 Thermal Profile is representative of a volumetrically unconstrained platform See Table 6 12 for discrete points that ...

Страница 44: ...e thermal profile 2 Implementation of Intel Xeon processor LC3528 nominal and short term thermal profiles should result in virtually no TCC activation Furthermore utilization of thermal solutions that do not meet this Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss 3 The Nominal Thermal Profile must be used for all normal operating c...

Страница 45: ...ications are based on initial silicon characterization These specifications may be further updated as more characterization data becomes available 4 Power specifications are defined at all VIDs found in the Datasheet The Intel Xeon processor C5500 C3500 series may be shipped under multiple VIDs for each frequency 5 FMB Flexible Motherboard guidelines provide a design target for meeting all planned...

Страница 46: ...NEBS Level 3 compliance 4 The Short Term Thermal Profile may only be used for short term excursions to higher ambient operating temperatures not to exceed 96 hours per instance 360 hours per year and a maximum of 15 instances per year as compliant with NEBS Level 3 Operation at the Short Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermal specifications an...

Страница 47: ...ve and are measured at the geometric top center of the TTV integrated heat spreader IHS Figure 6 8 illustrates the location where TCASE temperature measurements should be made Figure 6 8 TTV Case Temperature TCASE Measurement Location Notes 1 Figure is not to scale and is for reference only 2 B1 Max 45 07 mm Min 44 93 mm 3 B2 Max 42 57 mm Min 42 43 mm 4 C1 Max 39 1 mm Min 38 9 mm 5 C2 Max 36 6 mm ...

Страница 48: ...ck modulation reduces power consumption by modulating starting and stopping the internal processor core clocks The processor intelligently selects the appropriate TCC method to use on a dynamic basis BIOS is not required to select a specific method as with previous generation processors supporting TM1 or TM2 The Adaptive Thermal Monitor feature must be enabled for the processor to be operating wit...

Страница 49: ... the voltage regulator The voltage regulator must support dynamic VID steps to support this method During the voltage change it will be necessary to transition through multiple VID codes to reach the target operating voltage Each step will be one VID table entry see the Intel Xeon Processor C5500 C3500 Series Datsheet The processor continues to execute instructions during the voltage transition Op...

Страница 50: ...essor temperature When using On Demand mode the duty cycle of the clock modulation is programmable via bits 3 1 of the same IA32_CLOCK_MODULATION MSR In On Demand mode the duty cycle can be programmed from 12 5 on 87 5 off to 87 5 on 12 5 off in 12 5 increments On Demand mode may be used in conjunction with the Adaptive Thermal Monitor however if the system tries to enable On Demand mode at the sa...

Страница 51: ...s not user configurable and is not software visible 6 3 Platform Environment Control Interface PECI 6 3 1 Introduction The Platform Environment Control Interface PECI is a one wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices The processor implements a PECI interface to allow communication of processor thermal and oth...

Страница 52: ...rmines the time in milliseconds over which the DTS temperature values are averaged Short averaging times will make the averaged temperature values respond more quickly to DTS changes Long averaging times will result in better overall thermal smoothing but also incur a larger time lag between fast DST temperature changes and the value read via PECI Within the processor the DTS converts an analog si...

Страница 53: ...here are however certain scenarios in which the PECI is know to be unresponsive Before a power on RESET and during RESET assertion PECI is not ensured to provide reliable thermal data System designs should implement a default power on condition that ensures proper processor operation during the time frame when reliable data is not available via PECI To protect platforms from potential operational ...

Страница 54: ...inks and high airflow ATCA designs can cool higher power processors than typical ATCA Note 1 Local ambient temperature of the air entering the heatsink 2 Max target mean 3σ for thermal characterization parameter Section 7 5 1 3 Reference system configuration Processors are not limited to these form factors 4 Local Ambient Temperature written 45 60o C means 45o C under Nominal conditions but 60o C ...

Страница 55: ...e fins Figure 7 1 shows ΨCA and pressure drop for the 1U heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph Figure 7 1 1U Heatsink Performance Curves 0 15 0 20 0 25 0 30 0 35 0 40 0 45 0 50 0 10 20 30 40 50 CFM Through Fins Ψ ca C W 0 00 0 20 0 40 0 60 0 80 1 00 1 20 1 40 ΔP inch water Mean Ψca 0 1430 1 141 CFM 0 817 Ψca 0 1430 ...

Страница 56: ...ure drop for the ATCA heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph 7 2 Heat Pipe Considerations Figure 7 3 shows the orientation and position of the TTV die The TTV die is sized and positioned similar to the processor die Figure 7 2 ATCA Heatsink Performance Curves 0 0 5 1 1 5 2 2 5 0 5 10 15 20 25 30 35 CFM Through Fins Ψ...

Страница 57: ... 57 Order Number 323107 002US 7 3 Assembly Figure 7 3 TTV Die Size and Orientation Figure 7 4 1U Reference Heatsink Assembly Figure 1 Side Views of Package with IHS not to scale Core 1 Core 2 Core 3 Core 4 Cache Cache Cache Cache Uncore Core Cache 42 5 45 19 3 13 2 1 0 Package CL Die CL NOT TO SCALE All Dimensions in mm ...

Страница 58: ...cification is met Compliance to board keepout zones in Appendix B is assumed for this assembly process 7 3 1 Thermal Interface Material TIM TIM should be verified to be within its recommended shelf life before use Surfaces should be free of foreign materials prior to application of TIM Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM 7 4 Structural Consideratio...

Страница 59: ...e integrated heat spreader This inexact assumption is convenient for heatsink design TTVs are often used to dissipate TDP Correction offsets account for differences in temperature distribution between processor and TTV Equation 7 2 ΨCA ΨCS ΨSA Where ΨCS Thermal characterization parameter of the TIM C W is dependent on the thermal conductivity and thickness of the TIM ΨSA Thermal characterization p...

Страница 60: ...lower temperatures is not considered a risk to reliability Note 1 The thermal specifications shown in this graph are for reference only See the Intel Xeon Processor C5500 C3500 Series Datasheet for the Thermal Profile specifications In case of conflict the data information in the Datasheet supersedes any data in this figure 2 The Nominal Thermal Profile must be used for all normal operating condit...

Страница 61: ...ion regarding processor thermal features is contained in the appropriate Datasheet 7 6 1 Fan Speed Control There are many ways to implement fan speed control Using processor ambient temperature in addition to Digital Thermal Sensor to scale fan speed with ambient temperature can improve acoustics when DTS TCONTROL 7 6 1 1 TCONTROL Guidance Factory configured TCONTROL values are available in the ap...

Страница 62: ...arios differ above guidance should be tested in the customer s system to prevent loss of data during shutdown 7 6 3 Intel Turbo Boost Technology Intel Turbo Boost Technology Intel TBT is a new feature available on certain processor SKUs that opportunistically and automatically allows the processor to run faster than the marked frequency if the part is operating below its power temperature and curr...

Страница 63: ...E_TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT will be asserted 7 6 5 Custom Heat Sinks For UP ATCA The embedded specific 60W SKU was targeted for NEBS compliant 1U systems and UP ATCA configurations with custom thermal solutions In order to cool this part in a single wide ATCA slot a custom thermal solution will be required Unique so...

Страница 64: ... Thermal Mechanical Design Guide Order Number 323107 002US 64 Thermal Solutions Note Thermal sample only retention not production ready Note Heatsink should be optimized for the layout Figure 7 7 UP ATCA Thermal Solution Figure 7 8 UP ATCA System Layout Airflow direction ...

Страница 65: ...Thermal Solutions Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 65 Order Number 323107 002US Figure 7 9 UP ATCA Heat Sink Drawing ...

Страница 66: ...nment System Level Use Environment Speculative Stress Condition Example Use Condition Example 7 Yr Stress Equiv Example 10 Yr Stress Equiv Slow small internal gradient changes due to external ambient temperature cycle or externally heated Fast large gradient on off to max operating temp power cycle or internally heated including power save features Temperature Cycle ΔT 35 44 C solder joint 550 930...

Страница 67: ...ith components baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly and BIOS Processor memory test The stress test should be then followed by a visual inspection and then BIOS processor memory test Table 8 2 Server Use Conditions Environment System Level Use Environment...

Страница 68: ...d Test setup should include the following components properly assembled and or connected Appropriate system baseboard Processor and memory All enabling components including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Intel PC Diags is an example of softwar...

Страница 69: ...cal Design Guide August 2010 69 Order Number 323107 002US RoHS compliant Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies Note RoHS implementation details are not fully defined and may change ...

Страница 70: ...ded in Appendix B Mechanical models are listed in Table 1 1 Heatsinks assemble to server back plate Table A 2 Table A 1 Heatsinks and Thermal Interface Material Component Description Supplier PN Supplier Contact Info 1U Reference Heatsink p n E32409 001 1U Aluminum Fin Copper Base Fujikura HSA 8078 Rev A Fujikura America Yuji Yasuda yuji fujikura com 408 988 7478 Fujikura Taiwan Branch Yao Hsien H...

Страница 71: ... mechanical drawings are provided in Appendix B Mechanical models are listed in Table 1 1 Table A 2 LGA1366 Socket and ILM Components Item Intel PN Foxconn Tyco ILM Cover Assembly D92428 002 PT44L12 4101 1939738 1 Server Back Plate D92433 002 PT44P12 4101 1981467 1 LGA1366 Socket D86205 002 PE136627 4371 01F 1939737 1 or 1981837 1 Supplier Contact Info Julia Jiang juliaj foxconn com 408 919 6178 B...

Страница 72: ...k Assembly Sheet 1 of 2 Figure B 5 1U Reference Heatsink Assembly Sheet 2 of 2 Figure B 6 1U Reference Heatsink Fin and Base Sheet 1 of 2 Figure B 7 1U Reference Heatsink Fin and Base Sheet 2 of 2 Figure B 8 Heatsink Shoulder Screw 1U 2U and Tower Figure B 9 Heatsink Compression Spring 1U 2U and Tower Figure B 10 Heatsink Retaining Ring 1U 2U and Tower Figure B 11 Heatsink Load Cup 1U 2U and Tower...

Страница 73: ...PPLIED 3D DATA BASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE 2 PRIMARY DIMENSIONS STATED IN MILLIMETERS BRACKATED DIMENSIONS STATED IN INCHES 3 SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY PLEASE REFER TO THE SOCKET B KEEPOUT KEEPIN DRAWING FOR EXACT DIMENSIONS 4 BALL 1 LOCATION WITH RESPECT TO SOCKET BALL ARRAY IS FORMED BY INTERSECTION OF ROW A ...

Страница 74: ...0 8661 58 000 2 2835 2X 7 50 0 295 2X 72 50 2 854 85 00 3 346 5 00 0 197 5 00 0 197 85 00 3 346 2X 80 00 3 150 3X 80 00 3 150 D77712 2 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 4 DO NOT S...

Страница 75: ... 60 1 205 49 40 1 945 90 00 3 543 90 00 3 543 72 20 2 843 47 00 1 850 D77712 3 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 3 OF 4 DO NOT SCALE DRAWING SCALE 3 000 EASD PTMI 02 D77712 D REV DRAWI...

Страница 76: ...E 62 43 62 39 ARRAY POSITION 19 17 19 67 ARRAY POSITION ADDED TOPSIDE CU PAD CALLOUT FOR ILM HOLES SEE DETAIL A SHEET 2 01 19 07 1C6 2D6 I REVERTED SOCKET SOLDERBALL ARRAY X DIRECTION SIZE AND POSITION TO REV G 40 64 41 66 ARRAY WIDTH 19 67 19 17 ARRAY POSITION SOLDERBALL ARRAY OUTLINE REPRESENTS THE CENTERLINE OF THE OUTER BALL ROWS COLS 01 22 07 SHT 4 SHT 4 SHT 3 SHT 1 J ADDED ISO VIEW OF SECOND...

Страница 77: ...awings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 77 Order Number 323107 002US Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ASSEMBLY HEAT SINK 1U ...

Страница 78: ...tel Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 78 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 79: ...anical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 79 Order Number 323107 002US Figure B 7 1U Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 80: ...l Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 80 Mechanical Drawings Figure B 8 1U Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 81: ...Mechanical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 81 Order Number 323107 002US Figure B 9 Heatsink Shoulder Screw 1U 2U and Tower ...

Страница 82: ...el Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 82 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...

Страница 83: ...echanical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 83 Order Number 323107 002US Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...

Страница 84: ...Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 84 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...

Страница 85: ...anical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 85 Order Number 323107 002US Figure B 13 ATCA Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 86: ...l Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 86 Mechanical Drawings Figure B 14 ATCA Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 87: ...ical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 87 Order Number 323107 002US Figure B 15 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 88: ...Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 88 Mechanical Drawings Figure B 16 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 89: ... Socket Mechanical Drawings Table C 1 lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 ...

Страница 90: ...ket Mechanical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 90 Order Number 323107 002US Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 ...

Страница 91: ...el Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 91 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 ...

Страница 92: ...ket Mechanical Drawings Intel Xeon Processor C5500 C3500 Series and LGA1366 Socket Thermal Mechanical Design Guide August 2010 92 Order Number 323107 002US Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 ...

Страница 93: ...el Xeon Processor C5500 C3500 Series and LGA1366 Socket August 2010 Thermal Mechanical Design Guide Order Number 323107 002US 93 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 ...

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