![Intel S1400SP Скачать руководство пользователя страница 32](http://html1.mh-extra.com/html/intel/s1400sp/s1400sp_hardware-specification_2072183032.webp)
Intel® I/O Expansion Modules for Intel® Platforms HWS
Dual Port FDR InfiniBand* ConnectX*-3 I/O Module
Revision 1.1
Intel order number: G30021-004
25
6.
Dual Port FDR InfiniBand* ConnectX*-3 I/O Module
(AXX2FDRIBIOM)
Figure 22. Dual Port FDR InfiniBand* ConnectX*-3 I/O Module
6.1
Feature Set
Following is the feature set:
Mellanox* Connect X-3* FDR/10GbE silicon
Dual QSFP+ external connectors, standard style QSFP+ cage (not PCI) with EMI spring
fingers and with custom heat sink and retention clip for IOM low profile form factor
SMB bus isolation and power control to the QSFP+ external connector
Link (green) and Activity (amber) LEDs for the QSFP+ connection
16Mbit SPI Flash
256Byte FRU EEPROM and TMP75 temp sensor (stuffed)
Stainless steel EMI shield
See
Mellanox* Connect X-3* Datasheet
for additional silicon and software level features
supported.