Mechanical
Rev: 001
21
Figure 3-5: Tilt Profile and Field of View
Figure 3-6: System Tilt
3.5.1
Heat Sink
Although the peak power is up to 3W, the
Intel® RealSense™ ID Solution
F450
module is only expected to dissipate a total of 1.3W while the optical system is
activated during face authentication. This assumes a 30% duty cycle while the
illumination components are active.
If needed the system design will need to include a heat sink to maintain proper
operating temperatures for the
Intel® RealSense™ ID
Solution F450 components.
Unless multiple retries are required, a typical face authentication session can continue
for up to 2s.
Содержание RealSense ID Solution F450
Страница 7: ...Rev 001 7 Revision History Revision Description Date 001 Initial Public Release January 2021...
Страница 9: ...Overview Rev 001 9 Figure 1 2 Intel RealSense ID Solution F450 Module Host System Topology...
Страница 32: ...Regulatory Compliance 32 Rev 001 6 2 10 Customs Union Intel RealSense ID Solution F455 Intel Corporation...
Страница 35: ...Mechanical Drawings Rev 001 35 7 Mechanical Drawings Figure 7 1 Intel RealSense ID Solution F455...
Страница 37: ...Appendix A Interposer Reference Designs Rev 001 37 Figure 8 2 UART Interposer Reference Design...
