Intel PENTIUM P6000 MOBILE PROCESSOR -, Техническое описание

Страница: 52 / 181

Thermal Management
52 Datasheet
5 Thermal Management
A multi-chip package (MCP) processor requires a thermal solution to maintain
temperatures of the processor core and graphics/memory core within operating limits.
A complete thermal solution provides both the component-level and the system-level
thermal management. To allow for the optimal operation and long-term reliability of
Intel processor-based systems, the system/processor thermal solution should be
designed so that the processor:
•
Remains below the maximum junction temperature (T
j,Max
) specification at the
maximum thermal design power (TDP).
•
Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
5.1 Thermal Design Power and Junction Temperature
The TDP of an MCP processor is the expected maximum power from each of its
components (processor core and integrated graphics and memory controller) while
running realistic, worst case applications (TDP applications).TDP is not the absolute
worst case power of each component. It could, for example, be exceeded under a
synthetic worst case condition or under short power spikes. In production, a range of
power is to be expected from the components due to the natural variation in the
manufacturing process. The thermal solution, at a minimum, needs to ensure that the
junction temperatures of both components do not exceed the maximum junction
temperature (T
j,max
) limit while running TDP applications.
5.1.1 Intel Graphics Dynamic Frequency
Typical workloads are not intensive enough to push both the processor core and the
integrated graphics and memory controller towards their TDP limit simultaneously. As
such, the opportunity exists to share thermal power between the components and
boost the performance of either the processor core or integrated graphics and memory
controller on demand. This intelligent power sharing capability is implemented by Intel
Turbo Boost Technology Driver on these processors. When enabled, the integrated
graphics and memory controller can increase its thermal power consumption above its
own component TDP limit. However, the sum of component thermal powers adhere to
the specified MCP thermal power limit.
On this processor, Intel Graphics Dynamic Frequency is implemented via a combination
of Intel silicon capabilities, graphics driver and the Intel Turbo Boost Technology driver.
If Intel provides Intel Graphics Dynamic Frequency support for the target operating