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Mechanical Requirements

LGA 771 Socket Mechanical Design Guide

Notes:

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top

surface.

This is the minimum and maximum static force that can be applied by the heatsink and retention solution

to maintain the heatsink and processor interface.

Loading limits are for the LGA771 socket.

Dynamic compressive load applies to all board thickness.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load

requirement.

Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The

dynamic portion of this specification in the product application can have flexibility in specific values, but the

ultimate product of mass times acceleration should not exceed this dynamic load.

Transient bend is defined as the transient board deflection during manufacturing such as board assembly

and system integration. It is a relatively slow bending event compared to shock and vibration tests.

Refer to the processor

Thermal Mechanical Design Guide

for information on heatsink clip load metrology.

R is defined as the radial distance from the center of the LGA771 socket ball array to the center of the

heatsink load reaction point closest to the socket, as demonstrated in

Figure 3-2

10. Applies to populated sockets in fully populated and partially populated socket configurations.

11. Through life or product. Condition must be satisfied at the beginning of life and at the end of life.

12. Rigid backing is not allowed. The board should flex in the enabled configuration.

Table 3-2.

Socket Loading Specifications

Parameter

Board

Thickness

Min

Max

Unit

Notes

Static

Compressive Load

Apply for all

board

thickness

from

1.57 mm
( 0.062” )
to 2.54 mm
( 0.100” )

25 mm
< R <

45 mm

80
18

133
30

N
lbf

1,2,3,8,

9,10,

11,12

R >45 mm

80
18

311
70

N
lbf

Dynamic

Compressive Load

311 N (max static compressive

load) + 222 N dynamic loading
70 lbf (max static compressive

load) + 50 lbf dynamic loading

lbf

1,3,4,

5,6

Transient Bend

Limits

1.57 mm
0.062”

750

με

1,3,7

2.16 mm
0.085”

700

2.54 mm
0.100”

650

Содержание LGA771

Страница 1: ...Reference Number 313871 002 LGA771 Socket Mechanical Design Guide November 2006 ...

Страница 2: ... changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The LGA 771 socket may contain design defect...

Страница 3: ...escription 9 3 Mechanical Requirements 11 3 1 Attachment 11 3 2 Socket Components 11 3 2 1 Socket Body 11 3 2 2 Socket Actuation Mechanism 13 3 2 3 Pick and Place Cover 14 3 2 4 Socket Insertion Actuation Forces 14 3 3 Socket Size 14 3 4 Socket Weight 14 3 5 Package Socket Stackup Height 15 3 6 Socket Loading Specifications 15 4 Electrical Requirements 19 5 Environmental Requirements 21 5 1 Solven...

Страница 4: ...t Sheet 1 of 7 30 A 6 LGA771 Socket Motherboard Footprint Sheet 2 of 7 31 A 7 LGA771 Socket Motherboard Footprint Sheet 3 of 7 32 A 8 LGA771 Socket Motherboard Footprint Sheet 4 of 7 33 A 9 LGA771 Socket Motherboard Footprint Sheet 5 of 7 34 A 10 LGA771 Socket Motherboard Footprint Sheet 6 of 7 35 A 11 LGA 771 Socket Motherboard Footprint Sheet 7 of 7 36 A 12 LGA 771 Socket Footprint Sheet 1 of 2 ...

Страница 5: ...on History Revision Description Date 001 Initial release of the document June 2006 002 Updated Dual Core 5000 5100 Series stackup heights Added Quad Core 5300 Series stackup height Added Figure 3 1 Removed Appendix B Vendor Information November 2006 ...

Страница 6: ...6 LGA 771 Socket Mechanical Design Guide ...

Страница 7: ...17 mm pitch X by Y in a 33x30 grid array with 15x14 grid depopulation in the center of the array and selective depopulation for keying features A matching LGA package will be mated with the socket For board layout the land pattern for the LGA771 socket is 43 mils X 46 mils X by Y and the pad size is 18 mils The component dimensions are defined in metric so there is a slight round off error when co...

Страница 8: ...kage used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface Lead free Pb free Lead has not been intentionally added but lead may still exist as an impurity below 1000 ppm RoHS compliant Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an app...

Страница 9: ...essors using Flip Chip Land Grid Array package technology are targeted to be used with the LGA771 socket The assembled component may consist of a cooling solution heatsink fan clips and retention mechanism and processor package The processor Thermal Mechanical Design Guidelines TMDG provides information for designing components compliant with the Intel reference design Relevant processor 771 Land ...

Страница 10: ...Assembled Component and Package Description 10 LGA 771 Socket Mechanical Design Guide ...

Страница 11: ...t shear stress is caused by coefficient of thermal expansion CTE mismatch induced shear loading The solder joint compressive axial force induced by the heatsink static compressive load helps to reduce the combined joint tensile and shear stress Overall the heatsink required static compressive load is the minimum static compressive load needed to meet all of the above requirements Mechanical shock ...

Страница 12: ... Appendix A 3 2 1 3 Socket Standoffs Standoffs will be provided on the bottom of the socket base in order to ensure the minimum socket height after solder reflow The standoff locations and surface area located as specified in Appendix A A minimum gap between the solder ball seating plane and the standoff prior to reflow is required to prevent solder ball to motherboard land open joints 3 2 1 4 Mar...

Страница 13: ... 0 5 Sn Socket marking will be LGA771 for sockets comprised of eutectic solder Lead free Solder Composition must be lead free and have a melting point temperature in the range of 217 220 C for example Sn Ag 3 0 Cu 0 5 Socket marking will be LF LGA771 for sockets comprised of lead free solder The co planarity profile requirement for all solder balls on the underside of the socket is defined in Appe...

Страница 14: ...be compatible with volumetric keep ins as defined in the processor Thermal Mechanical Design Guidelines The cover should not have features that protrude below the Load Plate inner profile and into the socket cavity Also there should be no features that protrude above the pick and place surface Further any vent holes added to the Pick and Place Cover to aid in air circulation during reflow should b...

Страница 15: ...nd static load specifications for the LGA771 socket These mechanical load limits should not be exceeded during heatsink assembly mechanical stress testing or standard drop and shipping conditions The heatsink attach solutions must not include continuous stress onto the socket with the exception of a uniform load to maintain the heatsink to processor thermal interface Also any mechanical system or ...

Страница 16: ...on It is a relatively slow bending event compared to shock and vibration tests 8 Refer to the processor Thermal Mechanical Design Guide for information on heatsink clip load metrology 9 R is defined as the radial distance from the center of the LGA771 socket ball array to the center of the heatsink load reaction point closest to the socket as demonstrated in Figure 3 2 10 Applies to populated sock...

Страница 17: ...LGA 771 Socket Mechanical Design Guide 17 Mechanical Requirements Figure 3 2 Definition of R ...

Страница 18: ...Mechanical Requirements 18 LGA 771 Socket Mechanical Design Guide ...

Страница 19: ...ct Resistance EOL 15 2 mΩ This value has to be satisfied at all times The specification listed is at room temperature The socket average resistance target is derived from average of every chain contact resistance with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain Socket Contact Resistance The resis...

Страница 20: ...Electrical Requirements 20 LGA 771 Socket Mechanical Design Guide ...

Страница 21: ...low of this methodology can be seen in Figure 5 1 A detailed description of this methodology can be found at http developer intel com design packtech 245162 htm The use condition environment definitions provided in Table 5 1 are based on speculative use condition assumptions and are provided as examples only Figure 5 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the ...

Страница 22: ...ring low power state operating voltage THB HAST T 25 30 C 85 RH ambient 110 220 hrs at 110 C 85 RH 145 240 hrs at 110 C 85 RH High Operating temperature and short duration high temperature exposures Bake T 95 105 C contact 700 2500 hrs at 125 C 800 3300 hrs at 125 C Shipping and Handling Mechanical Shock System level Unpackaged Trapezoidal 25 g velocity change is based on packaged weight Total of ...

Страница 23: ...plicable EIA 364 11A 5 2 Durability Use per EIA 364 test procedure 09 Measure contact resistance when mated in 1st and 30th cycles The package should be removed at the end of each de actuation cycle and reinserted into the socket The socket s pick and place cover must be able to be inserted and removed from the socket at least 30 times ...

Страница 24: ...Environmental Requirements 24 LGA 771 Socket Mechanical Design Guide ...

Страница 25: ...cluded in this section These drawings refer to the LGA771 socket Note Intel reserves the right to make changes and modifications to the design as necessary See figures beginning on following page Drawing Description Page Number LGA771 Socket Assembly Drawing 27 30 LGA771 Socket Motherboard Footprint 1 31 37 LGA771 Socket Footprint 38 39 ...

Страница 26: ...Mechanical Drawings 26 LGA 771 Socket Mechanical Design Guide Figure A 1 LGA Socket Assembly Drawing Sheet 1 of 4 ...

Страница 27: ...LGA 771 Socket Mechanical Design Guide 27 Mechanical Drawings Figure A 2 LGA Socket Assembly Drawing Sheet 2 of 4 ...

Страница 28: ...Mechanical Drawings 28 LGA 771 Socket Mechanical Design Guide Figure A 3 LGA Socket Assembly Drawing Sheet 3 of 4 ...

Страница 29: ...LGA 771 Socket Mechanical Design Guide 29 Mechanical Drawings Figure A 4 LGA Socket Assembly Drawing Sheet 4 of 4 ...

Страница 30: ...Mechanical Drawings 30 LGA 771 Socket Mechanical Design Guide Figure A 5 LGA771 Socket Motherboard Footprint Sheet 1 of 7 ...

Страница 31: ...LGA 771 Socket Mechanical Design Guide 31 Mechanical Drawings Figure A 6 LGA771 Socket Motherboard Footprint Sheet 2 of 7 ...

Страница 32: ...Mechanical Drawings 32 LGA 771 Socket Mechanical Design Guide Figure A 7 LGA771 Socket Motherboard Footprint Sheet 3 of 7 ...

Страница 33: ...LGA 771 Socket Mechanical Design Guide 33 Mechanical Drawings Figure A 8 LGA771 Socket Motherboard Footprint Sheet 4 of 7 ...

Страница 34: ...Mechanical Drawings 34 LGA 771 Socket Mechanical Design Guide Figure A 9 LGA771 Socket Motherboard Footprint Sheet 5 of 7 ...

Страница 35: ...LGA 771 Socket Mechanical Design Guide 35 Mechanical Drawings Figure A 10 LGA771 Socket Motherboard Footprint Sheet 6 of 7 ...

Страница 36: ...Mechanical Drawings 36 LGA 771 Socket Mechanical Design Guide Figure A 11 LGA 771 Socket Motherboard Footprint Sheet 7 of 7 ...

Страница 37: ...LGA 771 Socket Mechanical Design Guide 37 Mechanical Drawings Figure A 12 LGA 771 Socket Footprint Sheet 1 of 2 ...

Страница 38: ...Mechanical Drawings 38 LGA 771 Socket Mechanical Design Guide Figure A 13 LGA 771 Socket Footprint Sheet 2 of 2 ...

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