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Datasheet

Thermal Specifications and Design Considerations

5.1

Monitoring Die Temperature

The processor incorporates three methods of monitoring die temperature:

• Thermal Diode
• Intel® Thermal Monitor
• Digital Thermal Sensor

5.1.1

Thermal Diode

Intel’s processors utilize an SMBus thermal sensor to read back the voltage/current

characteristics of a substrate PNP transistor. Since these characteristics are a function

of temperature, these parameters can be used to calculate silicon temperature values.

For older silicon process technologies, it is possible to simplify the voltage/current and

temperature relationships by treating the substrate transistor as though it were a

simple diffusion diode. In this case, the assumption is that the beta of the transistor

does not impact the calculated temperature values. The resultant “diode” model

essentially predicts a quasi linear relationship between the base/emitter voltage

differential of the PNP transistor and the applied temperature (one of the

proportionality constants in this relationship is processor specific, and is known as the

diode ideality factor). Realization of this relationship is accomplished with the SMBus

thermal sensor that is connected to the transistor.

The processor, however, is built on Intel’s advanced 45-nm processor technology. Due

to this new processor technology, it is no longer possible to model the substrate

transistor as a simple diode. To accurately calculate silicon temperature use a full bi-

polar junction transistor-type model. In this model, the voltage/current and

temperature characteristics include an additional process dependant parameter which

is known as the transistor “beta”. System designers should be aware that the current

thermal sensors may not be configured to account for “beta” and should work with their

SMB thermal sensor vendors to ensure they have a part capable of reading the thermal

diode in BJT model.

Offset between the thermal diode-based temperature reading and the Intel Thermal

Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic

mode activation of the thermal control circuit. This temperature offset must be

considered when using the processor thermal diode to implement power management

events. This offset is different than the diode Toffset value programmed into the

processor Model-Specific Register (MSR).

Table 14

and

Table 15

provide the diode interface and transistor model specifications.

Table 14.

Thermal Diode Interface

Signal Name

Pin/Ball Number

Signal Description

THERMDA

A24

Thermal diode anode

THERMDC

A25

Thermal diode cathode

Содержание BX80532PG3200D

Страница 1: ...Document Number 322875 001EN Intel Pentium Processor on 45 nm Process Datasheet For Platforms Based on Mobile Intel 4 Series Express Chipset Family October 2009...

Страница 2: ...ns Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order 64 bit comp...

Страница 3: ...FSB Frequency Select Signals BSEL 2 0 25 3 7 FSB Signal Groups 26 3 8 CMOS Signals 27 3 9 Maximum Ratings 27 3 10 Processor DC Specifications 28 4 Package Mechanical Specifications and Pin Informatio...

Страница 4: ...Ratings 27 6 Voltage and Current Specifications for the Pentium Processors 29 7 AGTL Signal Group DC Specifications 31 8 CMOS Signal Group DC Specifications 32 9 Open Drain Signal Group DC Specificat...

Страница 5: ...Datasheet 5 Revision History Document Number Revision Number Description Date 322875 001 Initial Draft October 2009...

Страница 6: ...6 Datasheet...

Страница 7: ...c Execution Supports L1 cache to cache C2C transfer On die primary 32 KB instruction cache and 32 KB write back data cache in each core The processor have an on die 1 MB second level shared cache with...

Страница 8: ...pon exposure to free air i e unsealed packaging or a device removed from packaging material the processor must be handled in accordance with moisture sensitivity labeling MSL as indicated on the packa...

Страница 9: ...Chipset Family Datasheet 320122 Mobile Intel 4 Series Express Chipset Family Specification Update 320123 Intel I O Controller Hub 9 ICH9 I O Controller Hub 9M ICH9M Datasheet 316972 Intel I O Controll...

Страница 10: ...Introduction 10 Datasheet...

Страница 11: ..._BLK register block mapped in the processor s I O address space The P_LVLx I O reads are converted to equivalent MWAIT C state requests inside the processor and do not directly result in I O reads on...

Страница 12: ...ak MWAIT C1 C1 Auto Halt Halt break HLT instruction STPCLK de asserted STPCLK asserted STPCLK de asserted STPCLK asserted STPCLK de asserted STPCLK asserted halt break A20M transition INIT INTR NMI PR...

Страница 13: ...erdown state See the Intel 64 and IA 32 Architectures Software Developer s Manuals Volume 3A 3B System Programmer s Guide for more information The system can generate a STPCLK while the processor is i...

Страница 14: ...the processor core flushes the contents of its L1 caches into the processor s L2 cache Except for the caches the processor core maintains all its architectural states in the C3 state The Monitor rema...

Страница 15: ...r returns to the Stop Grant state once the snoop has been serviced or the interrupt has been latched 2 1 2 4 Sleep State The Sleep state is a low power state in which the processor maintains its conte...

Страница 16: ...toggling BCLK within 10 BCLK periods To re enter the Sleep state the DPSLP pin must be deasserted BCLK can be re started after DPSLP deassertion as described above A period of 15 microseconds to allo...

Страница 17: ...ble MSR The processor waits for a fixed time period If the die temperature is down to acceptable levels an up transition to the previous frequency and voltage point occurs An interrupt is generated fo...

Страница 18: ...package low power states to enhanced package low power states Caution Extended Stop Grant must be enabled via the BIOS for the processor to remain within specification As processor technology changes...

Страница 19: ...I signal that is asserted when the processor is in a reduced power consumption state PSI can be used to improve intermediate and light load efficiency of the voltage regulator resulting in platform po...

Страница 20: ...Low Power Features 20 Datasheet...

Страница 21: ...ken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in the tables in Section 3 10 Failure to do so can result in timing violations or...

Страница 22: ...0 0 1 0 1 4750 0 0 0 0 0 1 1 1 4625 0 0 0 0 1 0 0 1 4500 0 0 0 0 1 0 1 1 4375 0 0 0 0 1 1 0 1 4250 0 0 0 0 1 1 1 1 4125 0 0 0 1 0 0 0 1 4000 0 0 0 1 0 0 1 1 3875 0 0 0 1 0 1 0 1 3750 0 0 0 1 0 1 1 1...

Страница 23: ...1 1 1 1 0 0 0 7500 0 1 1 1 1 0 1 0 7375 0 1 1 1 1 1 0 0 7250 0 1 1 1 1 1 1 0 7125 1 0 0 0 0 0 0 0 7000 1 0 0 0 0 0 1 0 6875 1 0 0 0 0 1 0 0 6750 1 0 0 0 0 1 1 0 6625 1 0 0 0 1 0 0 0 6500 1 0 0 0 1 0 1...

Страница 24: ...1 0 1 0 0 0 0 2000 1 1 0 1 0 0 1 0 1875 1 1 0 1 0 1 0 0 1750 1 1 0 1 0 1 1 0 1625 1 1 0 1 1 0 0 0 1500 1 1 0 1 1 0 1 0 1375 1 1 0 1 1 1 0 0 1250 1 1 0 1 1 1 1 0 1125 1 1 1 0 0 0 0 0 1000 1 1 1 0 0 0 1...

Страница 25: ...ted Connection of these pins to VCC VSS or to any other signal including each other can result in component malfunction or incompatibility with future processors See Section 4 2 for a pin listing of t...

Страница 26: ...als are common clock source synchronous and asynchronous NOTES See next page Table 4 FSB Pin Groups Signal Group Type Signals1 AGTL Common Clock Input Synchronous to BCLK 1 0 BPRI DEFER PREQ 5 RESET R...

Страница 27: ...ratings neither functionality nor long term reliability can be expected If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these...

Страница 28: ...rocessor 6 For Intel Pentium processors in 22x22 mm package 3 10 Processor DC Specifications The processor DC specifications in this section are defined at the processor core pads unless noted otherwi...

Страница 29: ...25 1 5 1 575 V ICCDES ICC for Processors Recommended Design Target 47 A 10 ICC ICC for Processors Processor Number Core Frequency Voltage T4500 T4400 T4300 T4200 2 3 GHz VCCHFM 2 2 GHz VCCHFM 2 1 GHz...

Страница 30: ...rboard 6 VCC BOOT tolerance shown in Figure 7 and Figure 8 7 Based on simulations and averaged over the duration of any change in current Specified by design characterization at nominal VCC Not 100 te...

Страница 31: ...ff Vin between 0 and VCCP 9 Cpad includes die capacitance only No package parasitics are included 10 This is the external resistor on the comp pins 11 On die termination resistance measured at 0 33 VC...

Страница 32: ...to VCCP 4 For Vin between 0 V and VOH 5 Cpad includes die capacitance only No package parasitics are included Table 8 CMOS Signal Group DC Specifications Symbol Parameter Min Typ Max Unit Notes1 VCCP...

Страница 33: ...nical package pressure specifications are in a direction normal to the surface of the processor This protects the processor die from fracture risk due to uneven die pressure distribution under tilt st...

Страница 34: ...Micro FCPGA Processor Package Drawing Sheet 1 of 2 TOP VIEW FRONT VIEW SIDE VIEW BOTTOM VIEW 0 1 0102 3 4 5 6 7 P 0 65 MAX 0 65 MAX 0 37 MAX 2 03 0 08 1 2 4 1 10 2 2 1 0 1 2 1 1 0 0 0 1 10 1 1 0 0 7 2...

Страница 35: ...re 5 1 MB Die Micro FCPGA Processor Package Drawing Sheet 2 of 2 TOP VIEW SIDE VIEW BOTTOM VIEW CORNER KEEP OUT ZONE 4X EDGE KEEP OUT ZONE 4X 4X 7 00 4X 5 00 4X 7 00 13 97 6 985 13 97 6 985 1 625 1 5...

Страница 36: ...DPRSTP VSS VCC VSS VCC VCC VSS VCC VCC E F BR0 VSS RS 0 RS 1 VSS RSVD VCC VSS VCC VCC VSS VCC VSS F G VSS TRDY RS 2 VSS BPRI HIT G H ADS REQ 1 VSS LOCK DEFER VSS H J A 9 VSS REQ 3 A 3 VSS VCCP J K VSS...

Страница 37: ...10 VSS DSTBN 0 J K VCCP D 14 VSS D 8 D 17 VSS K L VSS D 22 D 20 VSS D 29 DSTBN 1 L M VCCP VSS D 23 D 21 VSS DSTBP 1 M N VCCP D 16 VSS DINV 1 D 31 VSS N P VSS D 26 D 25 VSS D 24 D 18 P R VCCP VSS D 19...

Страница 38: ...nput Output A 9 J1 Source Synch Input Output A 10 N3 Source Synch Input Output A 11 P5 Source Synch Input Output A 12 P2 Source Synch Input Output A 13 L2 Source Synch Input Output A 14 P4 Source Sync...

Страница 39: ...3 Source Synch Input Output A 33 AA4 Source Synch Input Output A 34 AB2 Source Synch Input Output A 35 AA3 Source Synch Input Output A20M A6 CMOS Input ADS H1 Common Clock Input Output ADSTB 0 M1 Sour...

Страница 40: ...E22 Source Synch Input Output D 1 F24 Source Synch Input Output D 2 E26 Source Synch Input Output D 3 G22 Source Synch Input Output D 4 F23 Source Synch Input Output D 5 G25 Source Synch Input Output...

Страница 41: ...22 Source Synch Input Output D 23 M23 Source Synch Input Output D 24 P25 Source Synch Input Output D 25 P23 Source Synch Input Output D 26 P22 Source Synch Input Output D 27 T24 Source Synch Input Out...

Страница 42: ...rce Synch Input Output D 45 AA23 Source Synch Input Output D 46 AA24 Source Synch Input Output D 47 AB25 Source Synch Input Output D 48 AE24 Source Synch Input Output D 49 AD24 Source Synch Input Outp...

Страница 43: ...E25 Source Synch Input Output DSTBP 0 H26 Source Synch Input Output DSTBP 1 M26 Source Synch Input Output Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction DSTBP 2 AA26 Source Synch...

Страница 44: ...Output THRMDA A24 Power Other THRMDC B25 Power Other TMS AB5 CMOS Input TRDY G2 Common Clock Input TRST AB6 CMOS Input VCC A7 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Dir...

Страница 45: ...Other VCC AD18 Power Other VCC AE9 Power Other VCC AE10 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VCC AE12 Power Other VCC AE13 Power Other VCC AE15 Power Other...

Страница 46: ...VCC E13 Power Other VCC E15 Power Other VCC E17 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VCC E18 Power Other VCC E20 Power Other VCC F7 Power Other VCC F9 Power...

Страница 47: ...er Other VSS A16 Power Other VSS A19 Power Other VSS A23 Power Other VSS A25 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VSS AA2 Power Other VSS AA5 Power Other VSS...

Страница 48: ...wer Other VSS AE16 Power Other VSS AE19 Power Other VSS AE23 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VSS AE26 Power Other VSS AF2 Power Other VSS AF6 Power Othe...

Страница 49: ...Other VSS E16 Power Other VSS E19 Power Other VSS E21 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VSS E24 Power Other VSS F2 Power Other VSS F5 Power Other VSS F8...

Страница 50: ...Other VSS P21 Power Other VSS P24 Power Other VSS R2 Power Other VSS R5 Power Other Table 10 Pin Name Listing Pin Name Pin Signal Buffer Type Direction VSS R22 Power Other VSS R25 Power Other VSS T1...

Страница 51: ...C Power Other A11 VSS Power Other A12 VCC Power Other A13 VCC Power Other A14 VSS Power Other A15 VCC Power Other A16 VSS Power Other A17 VCC Power Other A18 VCC Power Other A19 VSS Power Other A20 VC...

Страница 52: ...er AB20 VCC Power Other AB21 D 52 Source Synch Input Output Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction AB22 D 51 Source Synch Input Output AB23 VSS Power Other AB24 D 33 Source Syn...

Страница 53: ...VSS Power Other AE9 VCC Power Other AE10 VCC Power Other AE11 VSS Power Other AE12 VCC Power Other Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction AE13 VCC Power Other AE14 VSS Power O...

Страница 54: ...GNNE CMOS Input C5 VSS Power Other C6 LINT0 CMOS Input C7 THERMTRI P Open Drain Output Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction C8 VSS Power Other C9 VCC Power Other C10 VCC Powe...

Страница 55: ...Synch Input Output F1 BR0 Common Clock Input Output Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction F2 VSS Power Other F3 RS 0 Common Clock Input F4 RS 1 Common Clock Input F5 VSS Powe...

Страница 56: ...Input Output K1 VSS Power Other K2 REQ 2 Source Synch Input Output Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction K3 REQ 0 Source Synch Input Output K4 VSS Power Other K5 A 6 Source S...

Страница 57: ...Output P24 VSS Power Other P25 D 24 Source Synch Input Output Table 11 Pin Listing Pin Pin Name Signal Buffer Type Direction P26 D 18 Source Synch Input Output R1 A 16 Source Synch Input Output R2 VS...

Страница 58: ...SS Power Other W2 A 27 Source Synch Input Output W3 A 32 Source Synch Input Output W4 VSS Power Other W5 A 28 Source Synch Input Output W6 A 20 Source Synch Input Output W21 VCCP Power Other W22 D 41...

Страница 59: ...ion ADS Input Output ADS Address Strobe is asserted to indicate the validity of the transaction address on the A 35 3 and REQ 4 0 pins All bus agents observe the ADS activation to begin parity checkin...

Страница 60: ...ust connect the appropriate pins on both agents The data driver asserts DRDY to indicate a valid data transfer D 63 0 are quad pumped signals and will thus be driven four times in a common clock perio...

Страница 61: ...PRSTP must be deasserted DPRSTP is driven by the ICH9M DPSLP Input DPSLP when asserted on the platform causes the processor to transition from the Sleep State to the Deep Sleep state To return to the...

Страница 62: ...GTLREF should be set at 2 3 VCCP GTLREF is used by the AGTL receivers to determine if a signal is a logical 0 or logical 1 HIT HITM Input Output Input Output HIT Snoop Hit and HITM Hit Modified conve...

Страница 63: ...onfiguration LOCK Input Output LOCK indicates to the system that a transaction must occur atomically This signal must connect the appropriate pins of both FSB agents For a locked sequence of transacti...

Страница 64: ...die pull up resistor on this signal RS 2 0 Input RS 2 0 Response Status are driven by the response agent the agent responsible for completion of the current transaction and must connect the appropria...

Страница 65: ...Input Refer to the appropriate platform design guide for further TEST1 TEST2 TEST3 TEST4 TEST5 TEST6 and TEST7 termination requirements and implementation details THRMDA Other Thermal Diode Anode THRM...

Страница 66: ...processor The voltage supply for these pins must be valid before the VR can supply VCC to the processor Conversely the VR output must be disabled until the voltage supply for the VID pins becomes val...

Страница 67: ...nd long term reliability of Intel processor based systems the system processor thermal solution should be designed so the processor remains within the minimum and maximum junction temperature TJ speci...

Страница 68: ...ndicate that the maximum TJ has been reached 4 The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications 5 At Tj of 105 o C 6 At Tj of 50 o C 7 At Tj...

Страница 69: ...t is connected to the transistor The processor however is built on Intel s advanced 45 nm processor technology Due to this new processor technology it is no longer possible to model the substrate tran...

Страница 70: ...ambient environment may cause a noticeable performance loss and may affect the long term reliability of the processor In addition a thermal solution that is significantly under designed may not be cap...

Страница 71: ...within the processor If both TM1 and TM2 bits are enabled in the auto throttle MSR TM2 takes precedence over TM1 However if Force TM1 over TM2 is enabled in MSRs via BIOS and TM2 is not sufficient to...

Страница 72: ...tion 5 1 3 Digital Thermal Sensor The processor also contains an on die Digital Thermal Sensor DTS that can be read via an MSR no I O interface Each core of the processor will have a unique digital th...

Страница 73: ...e PROCHOT pin exists at a package level of the processor When either core s thermal sensor trips PROCHOT signal will be driven by the processor package If only TM1 is enabled PROCHOT will be asserted...

Страница 74: ...s 74 Datasheet of time when running the most power intensive applications An under designed thermal solution that is not able to prevent excessive assertion of PROCHOT in the anticipated ambient envir...

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