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Case Temperature Reference Metrology

98

Thermal and Mechanical Design Guidelines

25.

Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder
this will force out the excess solder.

Figure 7-30. Removing Excess Solder

26.

Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50 °C before moving it to the microscope for the final
steps.

D.5.4

Cleaning and Completion of Thermocouple

Installation

27.

Remove the device from the solder station and continue to monitor IHS
Temperature with a handheld meter. Place the device under the microscope and
remove the three pieces of Kapton* tape with Tweezers, keeping the longest for
re-use.

28.

Straighten the wire and work the wire in to the groove. Bend the thermocouple
over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS.

Note:

The wire needs to be straight so it doesn’t sit above the IHS surface at anytime
(Figure 7-31).

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Содержание AT80569PJ080N - Core 2 Quad 3 GHz Processor

Страница 1: ...318734 017 Intel Core 2 Duo Processor E8000 and E7000 Series Intel Pentium Dual Core Processor E6000 and E5000 Series and Intel Celeron Processor E3000 Series Thermal and Mechanical Design Guidelines...

Страница 2: ...dor remains solely responsible for the design sale and functionality of its product including any liability arising from product infringement or product warranty Intel provides this information for cu...

Страница 3: ...tsink Size 20 2 3 2 Heatsink Mass 20 2 3 3 Package IHS Flatness 21 2 3 4 Thermal Interface Material 21 2 4 System Thermal Solution Considerations 22 2 4 1 Chassis Thermal Design Capabilities 22 2 4 2...

Страница 4: ...ric Envelope for Intel Reference BTX Thermal Module Assembly 47 5 6 Preload and TMA Stiffness 48 5 6 1 Structural Design Strategy 48 5 6 2 TMA Preload verse Stiffness 48 6 ATX Thermal Mechanical Desig...

Страница 5: ...l Test Equipment 78 B 3 Test Procedure Examples 78 B 3 1 Time Zero Room Temperature Preload Measurement 79 B 3 2 Preload Degradation under Bake Conditions 79 Appendix C Thermal Interface Management 81...

Страница 6: ...erence Clip 62 Figure 6 8 Critical Core Dimension 62 Figure 7 1 Intel QST Overview 64 Figure 7 2 PID Controller Fundamentals 65 Figure 7 3 Intel QST Platform Requirements 66 Figure 7 4 Example Acousti...

Страница 7: ...etric Sheet 2 114 Figure 7 45 BTX Thermal Module Keep Out Volumetric Sheet 3 115 Figure 7 46 BTX Thermal Module Keep Out Volumetric Sheet 4 116 Figure 7 47 BTX Thermal Module Keep Out Volumetric Sheet...

Страница 8: ...ntium dual core processor E6300 May 2009 009 Added Intel Core 2 Duo processor E7600 June 2009 010 Added Intel Pentium dual core processor E6500 August 2009 011 Intel Celeron processor E3x00 series Aug...

Страница 9: ...al solution All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density more transistors As operating frequencies increase a...

Страница 10: ...ify the specific reference design will be listed In this document when a reference is made to the datasheet the reader should refer to the Intel Core 2 Duo Processor E8000 and E7000 Series Datasheet I...

Страница 11: ...http www formfactors org microATX Thermal Design Suggestions http www formfactors org Balanced Technology Extended BTX System Design Guide http www formfactors org Thermally Advantaged Chassis Design...

Страница 12: ...CPI Advanced Configuration and Power Interface Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away...

Страница 13: ...rough a land grid array LGA surface mount socket The socket contains 775 contacts arrayed about a cavity in the center of the socket with solder balls for surface mounting to the motherboard The socke...

Страница 14: ...on removal mechanical stress testing and standard shipping conditions When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink b...

Страница 15: ...LGA775 socket solder joints One of the strategies for mechanical protection of the socket is to use a preload and high stiffness clip This strategy is implemented by the reference design and describe...

Страница 16: ...tsink is assumed to be installed after the motherboard has been installed into the chassis Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the moth...

Страница 17: ...to the system For ATX platforms an active air cooled design assumed be used in ATX Chassis with a fan installed at the top of the heatsink equivalent to the reference design see Chapter 6 should be d...

Страница 18: ...ensor when the thermal solution fan speed is being controlled by the digital thermal sensor The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced Thi...

Страница 19: ...he conduction path from the heat source to the fins directly impact the thermal performance of the heatsink In particular the quality of the contact between the package IHS and the heatsink base has a...

Страница 20: ...aints defined in the ATX Specification V2 1 and the microATX Motherboard Interface Specification V1 1 found at http www formfactors org The resulting space available above the motherboard is generally...

Страница 21: ...d in the datasheet and can be used as a baseline to predict heatsink performance during the design phase Intel recommends testing and validating heatsink performance in full mechanical enabling config...

Страница 22: ...olutions for ATX assume the use of the thermally advantaged chassis refer to Thermally Advantaged Chassis TAC Design Guide for TAC thermal and mechanical requirements The TAC 2 0 Design Guide defines...

Страница 23: ...tions in heatsink design include The local ambient temperature TA at the heatsink which is a function of chassis design The thermal design power TDP of the processor and the corresponding maximum TC a...

Страница 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...

Страница 25: ...a single resistance parameter like The case to local ambient thermal characterization parameter value CA is used as a measure of the thermal performance of the overall thermal solution that is attach...

Страница 26: ...cket Processor IHS System Board TC Heatsink 3 1 1 Example The cooling performance CA is defined using the principle of thermal characterization parameter described above The case temperature TC MAX an...

Страница 27: ...ring process The TTV provides consistent power and power density for thermal solution characterization and results can be easily translated to real processor performance Accurate measurement of the po...

Страница 28: ...t heatsink If a barrier is used the thermocouple can be taped directly to the barrier with a clear tape at the horizontal location as previously described half way between the fan hub and the fan hous...

Страница 29: ...ical Design Guidelines 29 Figure 3 2 Locations for Measuring Local Ambient Temperature Active ATX Heatsink Note Drawing Not to Scale Figure 3 3 Locations for Measuring Local Ambient Temperature Passiv...

Страница 30: ...and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient...

Страница 31: ...e thermal management feature called Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance By...

Страница 32: ...al designs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and rely on bi directional PROCHOT signal only as a backup in case of s...

Страница 33: ...represents the normal operating condition for the processor The second operating point consists of both a lower operating frequency and voltage When the TCC is activated the processor automatically tr...

Страница 34: ...itor the processor thermal status The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR model specific register Enabling the Thermal Control Circuit allows the processor to attemp...

Страница 35: ...d to approximately 1 s on time 1 s total cycle time 3 1 s duty cycle Similarly for a duty cycle of 7 8 87 5 the clock on time would be extended to 21 s 21 21 3 7 8 duty cycle In a high temperature sit...

Страница 36: ...sor bus snooping ACPI timer and interrupts are active at all times 4 2 8 THERMTRIP Signal In the event of a catastrophic cooling failure the processor will automatically shut down when the silicon tem...

Страница 37: ...or fan speed control FSC The DTS is monitoring the same sensor that activates the TCC see Section 4 2 2 Readings from the DTS are relative to the activation of the TCC The DTS value where TCC activati...

Страница 38: ...Set Overview For additional information on the PECI see the datasheet The PECI bus is available on pin G5 of the LGA 775 socket Intel chipsets beginning with the ICH8 have included PECI host controlle...

Страница 39: ...bient temperature to the chassis of across the fan inlet resulting in a temperature rise TR of 0 5 C Meeting TA and CA targets can maximize processor performance refer to Sections 2 2 2 4 and Chapter...

Страница 40: ...is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 2 Acoustic testing will be for the TMA only when installed in a BTX S2 chassis for C...

Страница 41: ...r BTX platforms Because of the coupling between TMA thermal performance and system impedance the designer should understand the TMA effective fan curve This effective fan curve represents the performa...

Страница 42: ...r airflow to bypass the heatsink and flow over the VR region on both the primary and secondary sides of the board The following requirements apply to VR cooling Table 5 3 VR Airflow Requirements Item...

Страница 43: ...atsink will be validated within the specific boundary conditions based on the methodology described Section 5 2 and using a thermal test vehicle Testing is done in a BTX chassis at ambient lab tempera...

Страница 44: ...r a system Quantity 2 drops for and directions in each of 3 perpendicular axes that is total 12 drops Profile 25 G trapezoidal waveform 225 in sec minimum velocity change systems 20 lbm 250 in sec min...

Страница 45: ...sical damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom remains...

Страница 46: ...pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 5 3 Material and Recycling Requirements Material s...

Страница 47: ...access the moving parts of the fan consider adding safety feature so that there is no risk of personal injury 5 5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7 43 through...

Страница 48: ...oint The allowable preload range for BTX platforms is provided in Table 5 4 but the specific target value is a function of the Thermal Module effective stiffness The solution space for the Thermal Mod...

Страница 49: ...thin this region The design tolerance for the preload and TMA stiffness should also reside within this boundary Note that the lower and upper horizontal boundaries represent the preload limits provide...

Страница 50: ...Pointes and Duct to SRM Interface Features NOTES 1 For clarity the motherboard is not shown in this figure In an actual assembly the captive 6x32 screws in the thermal module pass through the rear hol...

Страница 51: ...w of this reference design Note The part number E18764 001 provided in this document is for reference only The revision number 001 may be subject to change without notice The E18764 001 reference desi...

Страница 52: ...ection 6 6 remain the same for a thermal solution for the processor in the 775 Land LGA package Note If this fan design is used in your product and you will deliver it to end use customers you have th...

Страница 53: ...n at the processor fan heatsink inlet discussed Section 2 4 1 Table 6 1 E18764 001 Reference Heatsink Performance Processor Target Thermal Performance ca Mean 3 TA Assumption Notes Intel Core 2 Duo pr...

Страница 54: ...1 Acoustic performance is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 While the fan hub thermistor helps optimize acoustics at high...

Страница 55: ...ion factors Note The above 81 28 mm obstruction height that is used for testing complies with the recommended obstruction height of 88 9 mm for the ATX form factor However it would conflict with syste...

Страница 56: ...for and directions in each of 3 perpendicular axes that is total 18 drops Profile 50 G trapezoidal waveform 170 in sec minimum velocity change Setup Mount sample board on test fixture Figure 6 4 Shock...

Страница 57: ...cant physical damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom...

Страница 58: ...is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 6 4 Material and Recycling Requirements Material shall be resista...

Страница 59: ...nical Design Figure 7 40 Figure 7 41 and Figure 7 42 in Appendix G provides detailed reference ATX ATX motherboard keep out information for the reference thermal mechanical enabling design These drawi...

Страница 60: ...particular upward board deflection Figure 6 5 In addition a moderate preload provides initial downward deflection Figure 6 5 Upward Board Deflection during Shock The target metal clip nominal stiffne...

Страница 61: ...nsertion and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 6 6 Figure 6 6 Reference Clip Heatsink Assembly Core shoulder traps clip in place Core shoulder traps...

Страница 62: ...p Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Figure 6 8 Critical Core Dimension R 0 40 mm max R 0 40 mm max 36 14 0 10 mm G...

Страница 63: ...tel QST in particular rely on a thermal solution being compliant to the processor thermal profile It is unlikely that any fan speed control algorithm can compensate for a non compliant thermal solutio...

Страница 64: ...se to be determined based upon the difference between current temperature readings and specific temperature targets A major advantage of a PID Algorithm is the ability to control the fans to achieve s...

Страница 65: ...are used to control response of algorithm Kp proportional gain Ki Integral gain Kd derivative gain The Intel Quiet System Technology Intel QST Configuration and Tuning Manual provides initial values...

Страница 66: ...2 MB reserved for Intel QST FW execution SPI Flash with sufficient space for the Intel QST Firmware SST based thermal sensors to provide board thermal data for Intel QST algorithms Intel QST firmware...

Страница 67: ...ntel Core 2 Duo processor With the proper configuration information the ME can accommodate inputs from PECI or SST for the processor socket Additional SST sensors can be added to monitor system therma...

Страница 68: ...ntrol between Intel QST and the thermistor however they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed...

Страница 69: ...ated In addition solder joint shear stress is caused by coefficient of thermal expansion CTE mismatch induced shear loading The solder joint compressive axial force Faxial induced by the heatsink prel...

Страница 70: ...n metric provides guidance for mechanical designs that differ from the reference design for ATX ATX form factor A 3 1 Motherboard Deflection Metric Definition Motherboard deflection is measured along...

Страница 71: ...n Limits Deflection limits for the ATX ATX form factor are d_BOL d_ref 0 09 mm and d_EOL d_ref 0 15 mm And d _BOL d _ref 0 09 mm and d_EOL d_ref 0 15 mm NOTES 1 The heatsink preload must remain within...

Страница 72: ...creep phenomenon The example accounts for the creep expected to occur in the motherboard It assumes no creep to occur in the clip However there is a small amount of creep accounted for in the plastic...

Страница 73: ...eflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see...

Страница 74: ...to meet the board deflection recommendation refer to Section A 3 2 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may o...

Страница 75: ...distributed evenly as close as possible to the pocket walls Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place dur...

Страница 76: ...gn is Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base Then machine back the heatsink base by around 0 25 mm 0 01 so that...

Страница 77: ...eatsink Base Pocket Side View Figure 7 10 Preload Test Configuration Load Cells 3x Preload Fixture copper core with milled out pocket Wax to maintain load cell in position during heatsink installation...

Страница 78: ...ding and control with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to just a zeroing of the fo...

Страница 79: ...time to allow the load cell to settle is generally specified by the load vendors often of order of 3 minutes The time zero reading should be taken at the end of this settling time 5 Record the preload...

Страница 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...

Страница 81: ...a do not translate to a measurable improvement in thermal performance C 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heat...

Страница 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...

Страница 83: ...IHS followed by the reference procedure The supplier is listed the table below as a convenience to Intel s general customers and the list may be subject to change without notice Supplier Contact Phon...

Страница 84: ...ormation OSK2K1280 5SR TC TT T 36 72 Calibration and Control Ice Point Cell Omega stable 0 C temperature source for calibration and offset TRCIII Hot Point Cell Omega temperature source to control and...

Страница 85: ...ly impacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements NOTES 1 It is recommended to follow co...

Страница 86: ...Case Temperature Reference Metrology 86 Thermal and Mechanical Design Guidelines Figure 7 12 775 LAND LGA Package Reference Groove Drawing at 6 o clock Exit...

Страница 87: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 87 Figure 7 13 775 LAND LGA Package Reference Groove Drawing at 3 o clock Exit Old Drawing...

Страница 88: ...otch as shown Figure 7 15 Figure 7 15 IHS Groove at 6 o clock Exit Orientation Relative to the LGA775 Socket Select a machine shop that is capable of holding drawing specified tolerances IHS groove ge...

Страница 89: ...e Attach Using Solder Video CD ROM is available D 5 1 Thermocouple Conditioning and Preparation 1 Use a calibrated thermocouple as specified in Sections D 2 and D 3 2 Under a microscope verify the the...

Страница 90: ...groove and IHS with Isopropyl Alcohol IPA and a lint free cloth removing all residues prior to thermocouple attachment 7 Place the thermocouple wire inside the groove letting the exposed wire and bead...

Страница 91: ...hermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS Figure 7 19 A and B Figure 7 19 Thermocouple Bead Placement A B 10 Place the package under the...

Страница 92: ...using the tweezers or your finger Place a piece of Kapton tape to hold the wire inside the groove Figure 7 20 Refer to Figure 7 21 for detailed bead placement Figure 7 20 Position Bead on the Groove S...

Страница 93: ...22 This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process 13 Measure resistance from thermocouple end wires hold both wires to...

Страница 94: ...bead Be careful not to move the thermocouple bead during this step Figure 7 24 Ensure the flux remains in the bead area only Figure 7 24 Applying Flux to the Thermocouple Bead 15 Cut two small pieces...

Страница 95: ...1 step 2 to ensure the bead is still properly contacting the IHS D 5 3 Solder Process 18 Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block Connect...

Страница 96: ...te Do not touch the copper heater block at any time as this is very hot 22 Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt 23 L...

Страница 97: ...o move the solder back toward the groove as the IHS begins to heat Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up Figure 7 28 and Figure 7 29 Fig...

Страница 98: ...re with a handheld meter until it drops below 50 C before moving it to the microscope for the final steps D 5 4 Cleaning and Completion of Thermocouple Installation 27 Remove the device from the solde...

Страница 99: ...lade carefully shave the excess solder above the IHS surface Only shave in one direction until solder is flush with the groove surface Figure 7 32 Figure 7 32 Removing Excess Solder Note Take usual pr...

Страница 100: ...rify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove Figure 7 33 Figure 7 33 Filling Groove with Adhesive 32 To speed up the curing proce...

Страница 101: ...This will help to keep the adhesive surface flat and smooth with no pits or voids If there are voids in the adhesive refill the voids with adhesive and shave a second time 34 Clean IHS surface with I...

Страница 102: ...e wrong For example if there are any cuts into the wires insulation where the wires are pinched between the heatsink and the socket lid when installing the heatsink the thermocouple wires can get in c...

Страница 103: ...nents For instance it may be useful to monitor the temperature near the PSU airflow inlet near the graphics add in card or near memory The final system integrator is typically responsible for ensuring...

Страница 104: ...rmal sensor The following thermal sensor or its equivalent can be used for this function Part Number C83274 002 BizLink USA Technology Inc 44911 Industrial Drive Fremont CA 94538 USA 510 252 0786 phon...

Страница 105: ...Balanced Technology Extended BTX System Thermal Considerations Thermal and Mechanical Design Guidelines 105 Figure 7 39 Thermal sensor Location Illustration TMA Airflow Thermal Sensor MCH Heatsink...

Страница 106: ...Balanced Technology Extended BTX System Thermal Considerations 106 Thermal and Mechanical Design Guidelines...

Страница 107: ...oltage for logic low VIL 0 8 V PWM compliant function RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements Sections 5 1 1 and 6 2 and the general en...

Страница 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...

Страница 109: ...TX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 111 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Componen...

Страница 110: ...5 0MMMAXCOMPONENTHEIGHT 1 8MMMAXCOMPONENTHEIGHT BOARDROUTINGKEEP OUT SHEET 1 OF 3 DONOTSCALEDRAWING SCALE NONE 3 C40819 D REV DRAWINGNUMBER CAGE CODE SIZE LGA775microATX COMPONENTKEEP INS TITLE 2200MI...

Страница 111: ...NTS MAYNOTBEDISCLOSED REPRODUCED DI SPLAYEDORMODIFIED WITHOUTTHEPRI ORWRITTENCONSENTOFINTEL CORPORAT ION 4X 6 00 4X 10 00 LEGEND COMPONENTKEEP OUT ROUTINGKEEP OUT SHEET 2 OF 3 DONOTSCALEDRAWING SCALE...

Страница 112: ...ARA CA95052 8119 CORP R TMD 3 C40819 D REV DRAWINGNUMBER CAGECODE SIZE DEPARTMENT C40819 3 3 DWG NO SHT REV LEVERMOTIONSPACE REQUIREDTORELEASE SOCKETLOADPLATE NOTES 1 SOCKETCENTERPLANESAREREFERENCEDFR...

Страница 113: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 113 Figure 7 43 BTX Thermal Module Keep Out Volumetric Sheet 1...

Страница 114: ...Mechanical Drawings 114 Thermal and Mechanical Design Guidelines Figure 7 44 BTX Thermal Module Keep Out Volumetric Sheet 2...

Страница 115: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 115 Figure 7 45 BTX Thermal Module Keep Out Volumetric Sheet 3...

Страница 116: ...Mechanical Drawings 116 Thermal and Mechanical Design Guidelines Figure 7 46 BTX Thermal Module Keep Out Volumetric Sheet 4...

Страница 117: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 7 47 BTX Thermal Module Keep Out Volumetric Sheet 5...

Страница 118: ...INGTOBEUSEDINCONJUNTIONWITHSUPPLIED3D DATABASEFILE ALLDIMENSIONSANDTOLERANCESONTHIS DRAWINGTAKEPRECEDENCEOVERSUPPLIEDFILEANDARE APPLICABLEATPARTFREE UNCONSTRAINEDSTATEUNLESS INDICATEDOTHERWISE 2 MATER...

Страница 119: ...4 055 R3 1 122 45 X 8 0 45 0 05 018 001 45 X 8 0 25 0 05 010 001 C85609 2 0 DWG NO SHT REV DEPARTMENT R CORP 2200MISSIONCOLLEGEBLVD P O BOX58119 SANTACLARA CA95052 8119 TMD SIZE DRAWINGNUMBER REV A1 C...

Страница 120: ...Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 7 50 Reference Fastener Sheet 1...

Страница 121: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 7 51 Reference Fastener Sheet 2...

Страница 122: ...Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7 52 Reference Fastener Sheet 3...

Страница 123: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7 53 Reference Fastener Sheet 4...

Страница 124: ...Mechanical Drawings 124 Thermal and Mechanical Design Guidelines Figure 7 54 Intel E18764 001 Reference Solution Assembly...

Страница 125: ...isted below identifies these reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier OEMs and System Integrators are responsible...

Страница 126: ...usion TBD Harry Lin Monica Chih 714 739 5797 886 2 29952666 Extension 131 AVC ASIA Vital Components Co Ltd Fan and Duct TBD David Chao 886 2 22996930 Extension 619 NOTES 1 Part numbers were not availa...

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