Sensor Based Thermal Specification Design Guidance
70
Thermal/Mechanical Specifications and Design Guidelines
An additional consideration in establishing the fan speed curves is to account for the
thermal interface material performance degradation over time.
8.4.1
Fan Speed Control Algorithm without T
AMBIENT
Data
In a system that does not provide the FSC algorithm with the T
AMBIENT
information, the
designer must make the following assumption:
• When the DTS value is greater than T
CONTROL
, the T
AMBIENT
is at boundary condition
This is consistent past FSC guidance from Intel, to accelerate the fan to full speed when
the DTS value is greater than T
CONTROL
. As will be shown below, the DTS thermal
specification at DTS = T
CONTROL
can reduce some of the over cooling of the processor
and provide an acoustic noise reduction from the processor thermal solution.
In this example the following assumptions are made:
• T
AMBIENT
= 40 °C
• Thermal Solution designed / validated to a 40 °C environment
• T
CONTROL
= -20
• Reference processor thermal solution (RCFH7-1156 (DHA-A))
• Below T
CONTROL
the fan speed is slowed down as in prior products
For a processor specification based on a T
CASE
thermal profile, when the DTS value is
equal to or greater than T
CONTROL
, the fan speed must be accelerated to full speed. For
the reference thermal solution, full speed is 3150 RPM (dashed line in
DTS thermal specification defines a required
CA
at T
CONTROL
and the fan speed is 2300
RPM. This is much less than full speed even when assuming the T
AMBIENT
= 40 °C (solid
). The shaded area displayed in
is where DTS values are
less than T
CONTROL
. For simplicity, the graph shows a linear acceleration of the fans
from
T
CONTROL
- 10 to T
CONTROL
as has been Intel’s guidance for simple fan speed control
algorithms.
As the processor workload continues to increase, the DTS value will increase and the
FSC algorithm will linearly increase the fan speed from the 2300 RPM at DTS = -20 to
full speed at DTS value = -1.
Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Страница 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Страница 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Страница 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Страница 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Страница 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...
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