Application Note
26
<Revision 2.4>
<<2019-06-17>>
Assembly Instructions for the Easy-PressFIT Modules
Figure 22
Press-in of the power modules (drawing not true to scale)
12.2
Modules and PCB mounting on the heat sink
After the power module is pressed into the PCB (see Figure 23a), the PCB with the module has to be mounted to
the cooling system. Please see Chapter 7 and 8 for more information on heat sink and thermal grease
requirements, and how the grease should be applied to the system. Figure 23b-d show the mounting process
with an example of three power modules pressed into the PCB. However, the illustrated concept can also be
applied with a different number of modules or a single-module application. Figure 23b shows the process
where the PCB with the pre-assembled modules is placed on the cooling system and the modules are fixed with
screws via the spring clamp of the Easy module. Please refer to Chapter 9 for detailed information on assembly
of the modules on the heat sink. It is important to mount the modules before the PCB is fixed to the cooler!
Figure 23c shows fixing of the PCB to the heatsink. As the height tolerance of the module is quasi compensated
in the press process, the fixing points for the PCB can be close to the power modules. This is an advantage
compared to the concept in section 10.1 where >=5 cm distances have to be maintained between module and
distance keepers.
The position of the distance keepers should be designed symmetrically around the power module(s).
Figure 23d shows the final system assembly.
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