Additional information
18 of 31
Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Mounting of through-hole devices
Figure 10
Lead clamping, forming, and cutting tool (left) and examples of correct and incorrect lead
clamping and bending of THD packages (right).
Figure 11
Parameters for recommended minimum clamping distance and radius for lead bending.
Manual bending
Manual bending is generally not recommended. In case it is considered, the guidelines above must be followed.
For further information about TO THD pre-mounting processes, please refer to the individual product
Application Note
documents and contact your local sales, application, or quality engineer.
