Infineon PG-LQFP Скачать руководство пользователя страница 20

 

 

 

Trademarks  

All referenced product or service names and trademarks are the property of their respective owners. 

 

 

 

Edition 2020-11-12 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
  

 

 

 

 

 

 

 

 
Published by 
Infineon Technologies AG 
81726 Munich, Germany 
 
© 2020 Infineon Technologies AG. 
All Rights Reserved. 

 
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Document reference  

IMPORTANT NOTICE 

The information contained in this application note 

is  given  as  a  hint  for  the  implementation  of  the 

product only and shall in no event be regarded as a 

description  or  warranty  of  a  certain  functionality, 

condition  or  quality  of  the  product.  Before 

implementation of the product, the recipient of this 

application note must verify any function and other 

technical  information  given  herein  in  the  real 

application. 

Infineon 

Technologies 

hereby 

disclaims  any  and  all  warranties  and  liabilities  of 

any kind (including without limitation warranties of 

non-infringement  of  intellectual  property  rights  of 

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information given in this application note.  

 

The data contained in this document is exclusively 

intended  for  technically  trained  staff.  It  is  the 

responsibility of customer’s technical departments 

to  evaluate  the  suitability  of  the  product  for  the 

intended  application  and  the  completeness  of  the 

product  information  given  in  this  document  with 

respect to such application.     

 

 

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delivery  terms  and  conditions  and  prices  please 

contact  your  nearest  Infineon  Technologies  office 

(

www.infineon.com

). 

 
WARNINGS 

Due  to  technical  requirements  products  may 

contain  dangerous  substances.  For information  on 

the  types  in  question  please  contact  your  nearest 

Infineon Technologies office. 

 

Except as otherwise explicitly approved by Infineon 

Technologies  in  a  written  document  signed  by 

authorized 

representatives 

of 

Infineon 

Technologies, Infineon Technologies’ products may 

not  be  used  in  any  applications  where  a  failure  of 

the product or any consequences of the use thereof 

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Содержание PG-LQFP

Страница 1: ...al Information Please read the Important Notice and Warnings at the end of this document Revision 6 0 www infineon com page 1 of 20 2020 11 12 Recommendations for Board Assembly of Infineon Quad Flat...

Страница 2: ...1 1 QFP Package Type 4 1 2 Package Features and General Handling Guidelines 4 2 Printed Circuit Board 7 2 1 Routing 7 2 2 Pad Design 7 2 3 Via in Pad Design 9 3 PCB Assembly 11 3 1 Solder Paste Stenci...

Страница 3: ...ge IC Integrated Circuit I O Input Output LF Lead Frame LQFP Low profile Quad Flat Package MQFP Metric Quad Flat Packages MSL Moisture Sensitivity Level Ni Pd Au Nickel Palladium Gold NSMD Non Solder...

Страница 4: ...ches The typical pitch of Low profile Quad Flat Packages LQFP and Thin Quad Flat Packages TQFP is of 0 5 mm The latter also provides a pitch down to 0 4 mm Metric Quad Flat Packages MQFP have a typica...

Страница 5: ...hen soldered to the PCB The distance between the I O lead seating plane and the exposed pad landing area at the package bottom is defined as the package stand off On QFP it can vary around the nominal...

Страница 6: ...of Infineon Quad Flat Packages Package Description Figure 3 Soldered gullwing leads with post mold plated Sn left and with pre plated Ni Pd Au right For further information about the specific compone...

Страница 7: ...ed for QFP components The approach applies to the peripheral terminations as well as to the exposed pads Mixing different pad definition types in one footprint is not recommended The exposed pads of Q...

Страница 8: ...to the lead top plane is used to take into account the lower bend angle The PCB pad and therefore the solder paste print should have a distinct distance to the package mold in order to avoid an uncle...

Страница 9: ...One of the primary exposed pad design objectives besides the thermal management should be to avoid the penetration of the vias by solder Consequences of solder penetration can be a decreased stand of...

Страница 10: ...g voids during reflow soldering In case it is not necessary to provide a direct connection from the solder pad under the exposed die pad to the inner layers of the PCB the vias can be placed next to t...

Страница 11: ...l design adaptations to reach the optimum amount of solder the stencil thickness the PCB pad finish solder mask quality the via layout and the solder paste type should be considered In every case appl...

Страница 12: ...or quality engineer 3 4 Reflow Soldering For PCB assembly of QFP components the widely used method of reflow soldering in a forced convection oven is recommended Soldering in a nitrogen atmosphere ca...

Страница 13: ...urface This shape will be frozen during cooling and therefore will result in a higher stand off on the bottom side after the reflow process Heavy vibrations in a reflow oven may cause devices to drop...

Страница 14: ...lux is recommended whose residues usually do not have to be removed after the soldering process In case the solder joints have to be cleaned the cleaning method e g ultrasonic spray or vapor cleaning...

Страница 15: ...ause the plating does not melt together with the solder during reflow For engineering tasks cross sectioning can offer detailed information about the solder joint quality Due to its destructive charac...

Страница 16: ...t the solder paste and the reflow profile For thermal evaluations the entire thermal path must be considered as well as all boundary conditions such as the application environment or the electrical us...

Страница 17: ...ior to rework might be necessary A proper drying procedure for SMD packages is described in the international J STD 033 standard 5 Please also refer to the recommendations of your PCB manufacturer and...

Страница 18: ...D 3 Electronic Components Industry Association Assembly and Joining Processes and JEDEC Solid State Technology Association Committee EIA IPC JEDEC J STD 002 Solderability Tests for Component Leads Ter...

Страница 19: ...2 Recommendations for Board Assembly of Infineon Quad Flat Packages Revision History Revision History Page or reference Major changes since the last revision Section 6 Rework Update of sample conditio...

Страница 20: ...property rights of any third party with respect to any and all information given in this application note The data contained in this document is exclusively intended for technically trained staff It i...

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