CYBLE-022001-00
Document Number: 001-95662 Rev. *N
Page 5 of 41
Module Description
The CYBLE-022001-00 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate Bluetooth LE device) from various vendors to achieve the
Bluetooth LE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained.
Designs should be held within the physical dimensions shown in the mechanical drawings in
. All dimensions are in millimeters
(mm).
Table 1. Module Design Dimensions
See
on page 6 for the mechanical reference drawing for CYBLE-022001-00.
Dimension Item
Specification
Module dimensions
Length (X)
10.00 ± 0.15 mm
Width (Y)
10.00 ± 0.15 mm
Antenna location dimensions
Length (X)
7.00 ± 0.15 mm
Width (Y)
5.00 ± 0.15 mm
PCB thickness
Height (H)
0.50 ± 0.10 mm
Shield height
Height (H)
1.10 ± 0.10 mm
Maximum component height
Height (H)
1.30-mm typical (chip antenna)
Total module thickness (bottom of module to highest component)
Height (H)
1.80-mm typical