11
462
S e c t i o n 1 . 3
M o u n t i n g t h e I B 4 6 2 H
S e c t i o n O v e r v i e w
This section covers the following:
Direct Mounting the IB462H to a PC board.
Mounting the IB462H to a PC Board using a receptacle.
D i r e c t M o u n t i n g t h e I B 4 6 2 H t o a P C B o a r d
The IB462H is designed to be soldered directly into a PC board. The follow-
ing diagram contains the hole pattern and recommended pad sizes for direct
mounting of the IM483H/IM805H.
Heatsinking and use of the included insulating thermal pad are absolutely
REQUIRED
for the IB462H at all power levels. See the
Thermal Specifica-
tions
subsection of Section 1.2 of this document for notes, warnings and
thermal specifications.
R e c o m m e n d e d S o l d e r i n g P r a c t i c e s
Max. Soldering Temp .................................................................... 300°C
Max. Soldering Time .................................................................... 10 sec.
Recommended Solder
Recommended Cleaning Solvent
Kester “245” No Clean
Tech Spray “Envirotech 1679”
Alpha Metals “Telecore Plus”
Chemtronics “Flux-off NR 2000”
Multicore “X39B” No Clean
Figure 1.3.1: PCB Hole/Pad Pattern
WARNING!
The IB462H rear plate MUST be kept to 70° or below or damage
may occur to the device! The use of both an external heat sink
AND
the
included thermal pad is required to maintain a rear plate temperature of 70°C
or below at
ALL
power levels!
PIN #1
1.580
0.079 TYP
(2.00 TYP)
0.064 PAD, 0.031 HOLE
(1.6 PAD, 0.78 HOLE)
(40.13)
1.560
(39.62)
0.219
(5.56)
Ø 0.166 +.003/-0
(Ø 4.22 +0.8/-0)
2 PLACES
0.78 (19.81)
Reference
0.79 (20.10)
Reference
CL