IEI Technology TANK -870-Q170 S eries, Руководство пользователя, Страница: 130 / 143

TANK -870-Q170 E mbedded S ys tem
Page 117
DMA
Direct Memory Access (DMA) enables some peripheral devices to
bypass the system processor and communicate directly with the system
memory.
DIMM
Dual Inline Memory Modules are a type of RAM that offer a 64-bit data
bus and have separate electrical contacts on each side of the module.
DIO
The digital inputs and digital outputs are general control signals that
control the on/off circuit of external devices or TTL devices. Data can be
read or written to the selected address to enable the DIO functions.
E HC I
The Enhanced Host Controller Interface (EHCI) specification is a
register-level interface description for USB 2.0 Host Controllers.
E IDE
Enhanced IDE (EIDE) is a newer IDE interface standard that has data
transfer rates between 4.0 MBps and 16.6 MBps.
E IS T
Enhanced Intel® SpeedStep Technology (EIST) allows users to modify
the power consumption levels and processor performance through
application software. The application software changes the bus-to-core
frequency ratio and the processor core voltage.
F S B
The Front Side Bus (FSB) is the bi-directional communication channel
between the processor and the Northbridge chipset.
G bE
Gigabit Ethernet (GbE) is an Ethernet version that transfers data at 1.0
Gbps and complies with theG P IO
General purpose input
HDD
Hard disk drive (HDD) is a type of magnetic, non-volatile computer
storage device that stores digitally encoded data.
IC H
The Input/Ouput Controll Hub (ICH) is an Intel® Southbridge chipset.
IrDA
Infrared Data Association (IrDA) specify infrared data transmission
protocols used to enable electronic devices to wirelessly communicate
with each other.
L 1 C ache
The Level 1 Cache (L1 Cache) is a small memory cache built into the
system processor.
L 2 C ache
The Level 2 Cache (L2 Cache) is an external processor memory cache.