IBM System x iDataPlex dx360 M2, Руководство по диагностике и обслуживанию

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touch points on hot-swap components.) See the instructions for removing or
installing a specific hot-swap component for any additional procedures that you
might have to perform before you remove or install the component.
System reliability guidelines
To help ensure proper cooling and system reliability, make sure that the following
requirements are met:
v
Each of the drive bays has a drive or a filler panel and electromagnetic
compatibility (EMC) shield installed in it.
v You have followed the cabling instructions that come with optional adapters.
v
You have replaced a hot-swap drive within 2 minutes of removal.
v The system-board tray battery is operational. If the battery becomes defective,
replace it immediately.
v
Microprocessor socket 2 always contains either a microprocessor baffle or a
microprocessor and heat sink.
v
You have replaced one or both system-board trays within 2 minutes of removal.
v
For a 2U compute server, do not operate the upper system-board tray with the
lower system-board tray removed or powered off, except for servicing.
Handling static-sensitive devices
Attention: Static electricity can damage electronic devices. To avoid damage,
keep static-sensitive devices in their static-protective packages until you are ready
to install them.
To reduce the possibility of damage from electrostatic discharge, observe the
following precautions:
v
Limit your movement. Movement can cause static electricity to build up around
you.
v
The use of a grounding system is recommended. For example, wear an
electrostatic-discharge wrist strap, if one is available.
v Handle the device carefully, holding it by its edges or its frame.
v
Do not touch solder joints, pins, or exposed circuitry.
v Do not leave the device where others can handle and damage it.
v
While the device is still in its static-protective package, touch it to an unpainted
metal surface on the outside of the rack, chassis, or system-board tray for at
least 2 seconds. This drains static electricity from the package and from your
body.
v
Remove the device from its package and install it directly into the system-board
tray or enclosure without setting down the device. If it is necessary to set down
the device, put it back into its static-protective package. Do not place the device
on the system-board tray cover or on a metal surface.
v Take additional care when handling devices during cold weather. Heating reduces
indoor humidity and increases static electricity.
Returning a device or component
If you are instructed to return a device or component, follow all packaging
instructions, and use any packaging materials for shipping that are supplied to you.
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System x iDataPlex dx360 M2: Problem Determination and Service Guide