IBASE Technology MB875, Руководство пользователя, Страница: 35 / 67

BIOS SETUP
MB875 User’s Manual 31
Advanced Chipset Features
This Setup menu controls the configuration of the chipset.
Phoenix - AwardBIOS CMOS Setup Utility
Advanced Chipset Features
DRAM Timing Selectable By SPD ITEM HELP
CAS Latency Time 2.5 Menu Level >
Active to Precharge Delay 6
DRAM RAS# to CAS# Delay 3
DRAM RAS# Precharge 3
DRAM Data Integrity Mode Non ECC
MGM Core Frequency Auto Max 266MHz
System BIOS Cacheable Enabled
Video BIOS Cacheable Disabled
Memory Hole at 15M-16M Disabled
Delayed Transaction Enabled
Delay Prior to Thermal 16 Min
AGP Aperture Size (MB) 128
** On-Chip VGA Setting **
On-Chip VGA Enabled
On-Chip Frame Buffer Size 8MB
Boot Display CRT
DRAM Timing Selectable
This option refers to the method by which the DRAM timing is selected.
The default is
By SPD .
CAS Latency Time
You can configure CAS latency time in HCLKs as 2 or 2.5 or 3. The
system board designer should set the values in this field, depending on
the DRAM installed. Do not change the values in this field unless you
change specifications of the installed DRAM or the installed CPU.
Active to Precharge Delay
The default setting for the Active to Precharge Delay is 7 .
DRAM RAS# to CAS# Delay
This option allows you to insert a delay between the RAS (Row Address
Strobe) and CAS (Column Address Strobe) signals. This delay occurs
when the SDRAM is written to, read from or refreshed. Reducing the
delay improves the performance of the SDRAM.