A.1.2 Humidity, Temperature, and Cleanness
This section describes the requirements for the humidity, temperature, and
cleanness of the equipment room. To ensure the stability and life cycle of the USG
and its components, check that the equipment room meets the requirements.
Ensure that there is no explosive, conductive, magnetic, or corrosive dust or debris
in the equipment room. Dust that settle on the device may cause electrostatic
adsorption, resulting in poor contact of the metal socket connectors and metal
contacts. This shortens the life cycle of the device and causes faults.
In addition to dust and debris, toxic gases, such as SO
2
, H
2
S, and NH
3
must be
cleaned out of the equipment room.
Table A-2 Requirements for humidity, temperature, and cleanness in the
equipment room
Item
Description
Cleanne
ss
Dust
particl
e
Maximum
diameter
(μm)
0.05
1
3
5
Maximum
density
(number
of dust
particles
per cubic
meter)
1.4 x 10
7
7 x 10
5
2.4 x 10
5
1.3 x 10
5
Noxio
us gas
densit
y
Gas
SO
2
H
2
S
CI
2
HCl
HF
NH
3
O
3
NO
2
Average
(mg/m
3
)
0.3
0.1
0.1
0.1
0.0
1
1.0
0.
05
0.5
Maximum
(mg/m
3
)
1.0
0.5
0.3
0.5
0.0
3
3.0
0.
1
1.0
Humidit
y and
tempera
ture
Temp
eratur
e
Long-term
operating
temperatu
re
● Without hard disk: 0 °C to 45 °C
● With hard disk(s): 5 °C to 40 °C
Short-term
operating
temperatu
re
● Without hard disk: -5 °C to 55 °C
● With hard disk(s): 5 °C to 40 °C
Operating humidity ● Without hard disk: 5% RH to 95% RH, non-
condensing
● With hard disk(s): 5% RH to 90% RH, non-
condensing
HUAWEI USG6000E Series
Hardware Guide
A Appendix
Issue 08 (2022-04-20)
Copyright © Huawei Technologies Co., Ltd.
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