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HUAWEI ME909u-521 LTE LGA Module
Hardware Guide

Mechanical Specifications

Issue 05 (2017-12-15)

Huawei Proprietary and Confidential

6.9 Assembly Processes

6.9.1 General Description of Assembly Processes



Tray modules are required at SMT lines, because LGA modules are placed on
ESD pallets.



Reflow ovens with at least seven temperature zones are recommended.



Use reflow ovens or rework stations for soldering, because LGA modules have
large solder pads and cannot be soldered manually.

6.9.2 Stencil Design

It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For
the stencil design. See the following figure:

Figure 6-7

Recommended stencil design of LGA module (Unit: mm)

The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.

Содержание ME909u-521

Страница 1: ...HUAWEI ME909u 521 LTE LGA Module Hardware Guide Issue 05 Date 2017 12 15 ...

Страница 2: ...T AS REQUIRED BY APPLICABLE LAWS NO WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE MADE IN RELATION TO THE ACCURACY RELIABILITY OR CONTENTS OF THIS MANUAL TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL INCIDENTAL INDIRECT OR CONSEQU...

Страница 3: ...igure 3 14 recommended circuit of USB interface and its notes 3 11 Updated RF antenna interface 4 4 1 Added Table 4 3 ME909u 521 module GPS main characteristics 5 4 2 Updated power consumption 5 5 Updated reliability features 5 6 Updated EMC and ESD features 6 7 3 Added heat dissipation solution 9 Updated circuit of typical interface 03 2015 04 25 2 2 Updated Function Overview 3 Updated definition...

Страница 4: ... DC power consumption of ME909u 521 5 5 Deleted electrical features of application interfaces of issue 02 6 5 Updated packaging of ME909u 521 module 6 6 Updated label of ME909u 521 module 6 7 2 Deleted Figure 6 4 thermal pads design of issue 02 6 8 Added Thermal Design Solution 04 2017 06 28 6 6 Updated label of ME909u 521 module 8 13 Deleted section 8 13 Regulatory Information in Issue 03 8 13 Ad...

Страница 5: ... 1 Overview 25 3 3 2 Power Supply VBAT Interface 25 3 3 3 Output Power Supply Interface 26 3 4 Signal Control Interface 27 3 4 1 Overview 27 3 4 2 Power on off POWER_ON_OFF Pin 28 3 4 3 RESIN_N Pin 29 3 4 4 WAKEUP_IN Signal 31 3 4 5 WAKEUP_OUT Signal 31 3 4 6 SLEEP_STATUS Signal 32 3 4 7 LED_MODE Signal 33 3 5 UART Interface 34 3 5 1 Overview 34 3 5 2 Circuit Recommended for the UART Interface 35 ...

Страница 6: ...s 51 4 5 2 Interference 54 4 5 3 Antenna Requirements 54 4 6 Co exsitence with 5 GHz WIFI Design Guide 55 4 6 1 Purpose 55 4 6 2 Co exsitence Design Main Point 55 5 Electrical and Reliability Features 58 5 1 About This Chapter 58 5 2 Absolute Ratings 58 5 3 Operating and Storage Temperatures 59 5 4 Power Supply Features 59 5 4 1 Input Power Supply 59 5 4 2 Power Consumption 60 5 5 Reliability Feat...

Страница 7: ...rea Treatment 80 6 10 5 Module Installation 80 6 10 6 Specifications of Rework 81 7 Certifications 82 7 1 About This Chapter 82 7 2 Certifications 82 8 Safety Information 83 8 1 Interference 83 8 2 Medical Device 83 8 3 Area with Inflammables and Explosives 83 8 4 Traffic Security 84 8 5 Airline Security 84 8 6 Safety of Children 84 8 7 Environment Protection 84 8 8 WEEE Approval 84 8 9 RoHS Appro...

Страница 8: ...AWEI ME909u 521 LTE LGA module This document helps hardware engineer to understand the interface specifications electrical features and related product information of the ME909u 521 module If customers want to design a board which is compatible between ME909u 521 module and other 30 mm x30 mm LGA modules such as MU609 please refer to HUAWEI 30 mm x 30 mm LGA Module Hardware Migration Guide There a...

Страница 9: ...ature Description Physical Dimensions Dimensions L W H 30 mm 30 mm 2 35 mm Weight about 5 g Operating Bands LTE FDD Band 1 Band 2 Band 3 Band 5 Band 7 Band 8 Band 20 all bands with diversity WCDMA HSDPA HSUPA HSPA Band 1 Band 2 Band 5 Band 8 all bands with diversity GSM GPRS EDGE 850 MHz 900 MHz 1800 MHz 1900 MHz GPS GLONASS L1 Operating Temperature Normal operating temperature 20 C to 70 C Extend...

Страница 10: ...ep indicator pin SLEEP_STATUS Tunable Antenna control 4 GPIOs the firmware with this feature is in plan HSIC interface 3 SDIO interface 3 SPI interface 3 I2C interface 3 JTAG Joint Test Action Group Antenna interface MAIN AUX GPS ADC 3 x 2 Power supply Antenna interface WWAN primary antenna pad x 1 WWAN secondary antenna pad x 1 GPS antenna pad x 1 Data Services GPRS DL 85 6 kbit s UL 85 6 kbit s ...

Страница 11: ... RF performances comply with 3GPP specifications 2 This is only used for debugging 3 These interfaces are reserved for intelligent module in future 2 3 Circuit Block Diagram Figure 2 1 shows the circuit block diagram of the ME909u 521 module The major functional units of the ME909u 521 module contain the following parts Power Management Baseband Controller Multi chip Package MCP Memory RF Circuit ...

Страница 12: ... standard USIM Interface The USIM interface provides the interface for a USIM card External Power Supply DC 3 8 V is recommended Audio Interface The module supports one PCM interface RF Pad RF antenna interface Tunable ANT CTRL Since LTE bands cover wide frequency tunable ANT CTRL helps customers for tunable antenna design The firmware with this feature is in plan ADC Reserved for intelligent modu...

Страница 13: ...ibes the external application interfaces of the ME909u 521 module including LGA Interface Power Interface Signal Control Interface UART Interface USB Interface USIM Card Interface Audio Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interface Tunable Antenna Control 3 2 LGA Interface The ME909u 521 module uses a 145 pin LGA as its external interfa...

Страница 14: ...roprietary and Confidential Copyright Huawei Technologies Co Ltd 14 Figure 3 1 shows the sequence of pins on the 145 pin signal interface of the ME909u 521 module Figure 3 1 Sequence of LGA interface Top view Figure 3 2 shows the appearance of ME909u 521 module The left one is top view and the right one is bottom view ...

Страница 15: ...face Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 1 UART1_TX O UART1 transmit output VOH 1 35 1 8 1 8 VOL 0 0 45 2 UART1_RTS O UART1 Ready for receive VOH 1 35 1 8 1 8 VOL 0 0 45 3 UART1_CTS I UART1 Clear to Send VIH 1 17 1 8 2 1 VIL 0 3 0 63 4 UART1_RX I UART1 receive data input VIH 1 17 1 8 2 1 VIL 0 3 0 63 5 PCM_SYNC O PCM interface sync VOH 1 35 1 8 1 8 VOL 0 0 45 ...

Страница 16: ... 3 3 8 4 2 14 PS_HOLD I Power supply hold signal to PMU used for JTAG VIH 1 17 1 8 2 1 VIL 0 3 0 63 15 SLEEP_STAT US O Indicates sleep status of ME909u 521 module VOH 1 35 1 8 1 8 VOL 0 0 45 16 Reserved Reserved must keep this pin open 17 Reserved Reserved must keep this pin open 18 Reserved Reserved must keep this pin open 19 Reserved Reserved must keep this pin open 20 Reserved Reserved must kee...

Страница 17: ...transmit output VOH 1 35 1 8 1 8 VOL 0 0 45 29 UART2_RX I UART2 receive data input VIH 1 17 1 8 2 1 VIL 0 3 0 63 30 JTAG_TMS I JTAG test mode select VIH 1 17 1 8 2 1 VIL 0 3 0 63 31 NC Not connected please keep this pin open 32 VCC_EXT1 PO 1 8 V POWER output 1 75 1 8 1 85 33 NC Not connected please keep this pin open 34 USIM_VCC P Output power supply for USIM card 1 8 2 8 5 35 Reserved Reserved mu...

Страница 18: ... Reserved must keep this pin open 44 Reserved Reserved must keep this pin open 45 Reserved Reserved must keep this pin open 46 Reserved Reserved must keep this pin open 47 JTAG_SRST_ N I JTAG reset for debugging VIH 1 17 1 8 2 1 VIL 0 3 0 63 48 GND Ground 49 GND Ground 50 GND Ground 51 GPIO I O General Purpose I O pins The function of these pins has not been defined VOH 1 35 1 8 1 8 VOL 0 0 45 VIH...

Страница 19: ...rved Reserved must keep this pin open 64 Reserved Reserved must keep this pin open 65 Reserved Reserved must keep this pin open 66 Reserved Reserved must keep this pin open 67 Reserved Reserved must keep this pin open 68 Reserved Reserved must keep this pin open 69 Reserved Reserved must keep this pin open 70 Reserved Reserved must keep this pin open 71 WAKEUP_OU T O Module to wake up the host VOH...

Страница 20: ... 0 63 79 Reserved Reserved must keep this pin open 80 UART0_CTS I UART0 Clear to Send VIH 1 17 1 8 2 1 VIL 0 3 0 63 81 POWER_ON_ OFF I System power on or power off pulled up in module Do not pull up it any more on the customer board 1 8 82 NC Not connected please keep this pin open 83 NC Not connected please keep this pin open 84 NC Not connected please keep this pin open 85 USB_DM I O USB Data de...

Страница 21: ...n 93 JTAG_RTCK O JTAG return clock VOH 1 35 1 8 1 8 VOL 0 94 NC Not connected please keep this pin open 95 NC Not connected please keep this pin open 96 NC Not connected please keep this pin open 97 NC Not connected please keep this pin open 98 NC Not connected please keep this pin open 99 NC Not connected please keep this pin open 100 RESIN_N I Reset module this pin is pulled up on module VIH 1 1...

Страница 22: ...ined VOH 1 35 1 8 1 8 VOL 0 0 45 VIH 1 17 1 8 2 1 VIL 0 3 0 63 106 GND Ground 107 MAIN_ANT RF primary antenna pad 108 GND Ground 109 GPIO I O General Purpose I O pins The function of these pins has not been defined VOH 1 35 1 8 1 8 VOL 0 0 45 VIH 1 17 1 8 2 1 VIL 0 3 0 63 110 GND Ground 111 GPS_ANT GPS antenna pad 112 GND Ground 113 GPIO I O General Purpose I O pins The function of these pins has ...

Страница 23: ... thermal via 122 GND Thermal Ground Pad this pad need thermal via 123 GND Thermal Ground Pad this pad need thermal via 124 GND Thermal Ground Pad this pad need thermal via 125 GND Thermal Ground Pad this pad need thermal via 126 GND Thermal Ground Pad this pad need thermal via 127 GND Thermal Ground Pad this pad need thermal via 128 GND Thermal Ground Pad this pad need thermal via 129 GND Thermal ...

Страница 24: ... Thermal Ground Pad this pad need thermal via 136 GND Thermal Ground Pad this pad need thermal via 137 GND Thermal Ground Pad this pad need thermal via 138 GND Thermal Ground Pad this pad need thermal via 139 GND Thermal Ground Pad this pad need thermal via 140 GND Thermal Ground Pad this pad need thermal via 141 GND Thermal Ground Pad this pad need thermal via 142 GND Thermal Ground Pad this pad ...

Страница 25: ...ormation 3 3 Power Interface 3 3 1 Overview The power supply part of the ME909u 521 module contains VBAT pins for the power supply VCC_EXT1 pin for external power output with 1 8 V USIM_VCC pin for USIM card power output Table 3 2 lists the definitions of the pins on the power supply interface Table 3 2 Definitions of the pins on the power supply interface Pin No Pin Name Pad Type Description Para...

Страница 26: ...terface It is recommended that customers add the EMI ferrite bead FBMJ1608HS280NT manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is recommended to directly isolate DTE from DCE in the power circuit Figure 3 3 shows the recommended power circuit of ME909u 521 module Figure 3 3 Recommended power circuit of ME909u 521 module Module DCE VBAT VBAT 220 μF 220 μF 220 μF 220 μF 220 μF...

Страница 27: ...rol interface Table 3 3 Definitions of the pins on the signal control interface Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 11 WAKEUP_IN I Host to set the module into sleep or wake up the module from sleep VIH 1 17 1 8 2 1 VIL 0 3 0 63 15 SLEEP_STA TUS O Indicates sleep status of ME909u 521 module VOH 1 35 1 8 1 8 VOL 0 0 45 71 WAKEUP_O UT O Module to wake up the host...

Страница 28: ...er On Time Sequence After VBAT has been applied and is stable the POWER_ON_OFF signal is pulled down and then the module will boot up During power on timing sequence please make sure the VBAT is stable Figure 3 4 Power on timing sequence Table 3 4 Power on timing Parameter Comments Time Nominal values Units TPON POWER_ON_OFF turn on time 0 5 1 0 s TPD ON POWER_ON_OFF Valid to USB D high 12 s If th...

Страница 29: ...inal values Units TPOFF POWER_ON_OFF turn off time 3 0 5 0 s TPD OFF POWER_ON_OFF Valid to USB D low TPOFF 0 5 s If POWER_ON_OFF pin is fixed to be a low state such as connected to GND ME909u 521 will automatically start up once power is supplied Pull up resistor is never needed for this pin Figure 3 6 Connections of the POWER_ON_OFF pin 3 4 3 RESIN_N Pin The RESIN_N pin is used to reset the modul...

Страница 30: ...it be kept at a distance of 2 54 mm 100 mil at least from the PCB edge Furthermore you need to wrap the area adjacent to the signal wire with a ground wire Otherwise the module may be reset due to interference The ME909u 521 module supports hardware reset function If the software of the ME909u 521 module stops responding you can reset the hardware through the RESIN_N signal as shown in Figure 3 8 ...

Страница 31: ...lt Table 3 3 shows the definition of the WAKEUP_IN signal Figure 3 9 Connections of the WAKEUP_IN pin The pull up resistor should not be greater than 22 kΩ 3 4 5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used to wake up the external devices Its drive current is no more than 2 mA Table 3 3 shows the definition of the WAKEUP_OUT signal The WAKEUP_OUT pin outputs a low level voltage by default When ...

Страница 32: ... recommended circuit of the WAKEUP_OUT pin Figure 3 11 Connections of the WAKEUP_OUT pin 3 4 6 SLEEP_STATUS Signal SLEEP_STATUS signal is used to indicate the sleep status of ME909u 521 module The external devices can get to know whether the module is in sleep mode by reading SLEEP_STATUS pin When SLEEP_STATUS pin is in high level ME909u 521 module is in wakeup state When SLEEP_STATUS pin is in lo...

Страница 33: ...ed circuit of the SLEEP_STATUS pin Figure 3 12 Connections of the SLEEP_STATUS pin 3 4 7 LED_MODE Signal If you need the LED function you need reserve circuit and refer to the following figure till the relative firmware is ready Figure 3 13 shows the recommended circuits of the LED_MODE pin According to LED feature you can adjust the LED brightness by adjusting the resistance of resistor R Figure ...

Страница 34: ...ce signals Table 3 6 UART interface signals Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 1 UART1_TX O UART1 transmit output VOH 1 35 1 8 1 8 VOL 0 0 45 2 UART1_RTS O UART1 Ready for receive VOH 1 35 1 8 1 8 VOL 0 0 45 3 UART1_CTS I UART1 Clear to Send VIH 1 17 1 8 2 1 VIL 0 3 0 63 4 UART1_RX I UART1 receive data input VIH 1 17 1 8 2 1 VIL 0 3 0 63 28 UART2_TX O UART2 t...

Страница 35: ... example it is recommended that you use the MAX218 chip The MAX218 s max baud is 120000 bit s with a 2 wire serial port It is recommended that customer set the pins related to UART interface as test points on the DTE board for debugging The level of RS 232 Transceivers must match that of the ME909u 521 module 3 6 USB Interface The ME909u 521 module is compliant with USB 2 0 High speed protocol The...

Страница 36: ...es Co Ltd 36 Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 86 USB_DP I O USB Data defined in the USB 2 0 Specification According to USB protocol for bus timing or electrical characteristics of ME909u 521 module USB signal please refer to the chapter 7 3 2 of Universal Serial Bus Specification 2 0 Figure 3 15 Recommended circuit of USB interface ...

Страница 37: ...SB signal trace because stubs generate reflection and affect the signal quality Route the USB signal trace on a complete reference plane GND and avoid crossing inter board gaps because inter board gaps cause a large reflow channel area and increase inductance and radiation In addition avoid signal traces on different layers The USB signal trace must be far away from core logical components because...

Страница 38: ...d Confidential Copyright Huawei Technologies Co Ltd 38 3 7 2 Circuit Recommended for the USIM Card Interface As the ME909u 521 module is not equipped with a USIM socket you need to place a USIM socket on the user interface board Figure 3 16 shows the circuit of the USIM card interface Figure 3 16 Circuit of the USIM card interface ...

Страница 39: ...pF capacitors are placed between the USIM_DATA and Ground pins the USIM_RESET and Ground pins and the USIM_CLK and Ground pins in parallel to filter interference from RF signals USIM_DATA is already pulled up internally It is recommended to take electrostatic discharge ESD protection measures near the USIM card socket The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF must be ...

Страница 40: ...terface to prevent electrostatic discharge and protect integrated circuit IC components The signal level of CODEC must match that of the ME909u 521 module 3 9 General Purpose I O Interface The ME909u 521 module provides GPIO pins for customers to use for controlling signals which are worked at 1 8 V CMOS logic levels Customers can use AT command to control the state of logic levels of GPIO output ...

Страница 41: ...er Min V Typ V Max V Comments 30 JTAG_TMS I JTAG test mode select VIH 1 17 1 8 2 1 VIL 0 3 0 63 36 JTAG_TRST_N I JTAG reset VIH 1 17 1 8 2 1 VIL 0 3 0 63 42 JTAG_TCK I JTAG clock input VIH 1 17 1 8 2 1 VIL 0 3 0 63 72 JTAG_TDO O JTAG test data output VOH 1 35 1 8 1 8 VOL 0 0 45 87 JTAG_TDI I JTAG test data input VIH 1 17 1 8 2 1 VIL 0 3 0 63 93 JTAG_RTCK O JTAG return clock VOH 1 35 1 8 1 8 VOL 0 ...

Страница 42: ... The 1 kΩ resistor and 4 7 nF capacitor must be placed as close as possible to ME909u 521 module Figure 3 18 ESD protection of JTAG_SRST_N 3 11 RF Antenna Interface The ME909u 521 module provides three antenna pads MAIN_ANT GPS_ANT and AUX_ANT for connecting the external antennas The RF pad difference is the most important difference between HUAWEI LGA modules please refer to HUAWEI 30 mm x 30 mm ...

Страница 43: ...al Copyright Huawei Technologies Co Ltd 43 Table 3 12 Definition of the antenna pads Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 107 MAIN_ANT RF primary antenna pad 111 GPS_ANT GPS antenna pad 115 AUX_ANT RF secondary antenna pad Figure 3 19 RF signal trace design about MAIN_ANT for reference the same for AUX GPS ...

Страница 44: ...ce the same for AUX GPS For the PCB designed by the user the impedance of all the RF signal tracks must be 50 Ω Generally the impedance depends on the medium factor track width and distance from the floor In order to reflect the rules of design the following figures indicate the complete structure of the microstrip and stripline with an impedance of 50 ohm as well as the reference design for stack...

Страница 45: ...pedance The RF MAIN pad dimension of ME909u 521 is 1 1 mm L x 0 9 mm W You can get the impedance with lower than 50 Ω calculated by the impedance simulation tool Since the target impedance is 50 Ω for RF trace the recommended solution is that to carve out the copper area of the second layer that projected by the RF MAIN pad at top layer How many layers should be carved out depend on the PCB permit...

Страница 46: ...909u 521 module provides some reserved pins All reserved pins cannot be used by the customer All of them must be leave unconnected Table 3 13 Reserved pin Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 9 10 16 20 27 35 43 46 60 70 73 75 79 91 92 102 and 104 Reserved Reserved must keep this pin open 3 13 NC Interface The ME909u 521 module has some NC pins All NC pins shou...

Страница 47: ...The module provides tunable antenna control pins The firmware with this feature is in plan The mapping of each band to ANT_TUNE outputs is configurable Table 3 15 List of tunable antenna control pins Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 21 ANT_TUNE0 O Tunable antenna control signal bit 0 VOH 1 35 1 8 1 8 VOL 0 0 45 22 ANT_TUNE1 O Tunable antenna control signal ...

Страница 48: ...Frequencies Table 4 1 shows the RF bands supported by ME909u 521 Table 4 1 RF bands of ME909u 521 Operating Band Tx Rx UMTS Band 1 1920 MHz 1980 MHz 2110 MHz 2170 MHz UMTS Band 2 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS Band 5 824 MHz 849 MHz 869 MHz 894 MHz UMTS Band 8 880 MHz 915 MHz 925 MHz 960 MHz GSM 850 824 MHz 849 MHz 869 MHz 894 MHz GSM 900 880 MHz 915 MHz 925 MHz 960 MHz GSM 1800 1710 MHz...

Страница 49: ...ble for testing L08 C014 350 of DRAKA COMTEQ or Rosenberger Cable length 29 cm The compensation for different frequency bands relates to the cable and the test environment The instrument compensation needs to be set according to the actual cable conditions 4 3 2 Test Standards Huawei modules meet 3GPP test standards Each module passes strict tests at the factory and thus the quality of the modules...

Страница 50: ...hroughput 95 10 MHz Bandwidth LTE Band 8 100 5 Throughput 95 10 MHz Bandwidth LTE Band 20 101 5 Throughput 95 10 MHz Bandwidth Table 4 3 ME909u 521 module GPS main characteristics Item Typical Value Receive Sensitivity Cold start 147 dBm Receive Sensitivity Hot start 157 dBm Receive Sensitivity Tracking mode 157 dBm TTFF 130 dBm Cold start 38s TTFF 130 dBm Hot start 2s The test values are the aver...

Страница 51: ... Power Reduction MPR and AMPR of LTE is according to 3GPP TS 36 521 1 4 5 Antenna Design Requirements 4 5 1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna The radiated power of an antenna is always lower than the input power due to the following antenna losses return loss material loss and coupling los...

Страница 52: ... antenna 10 dB In addition S11 is less important than the efficiency and S11 has not strong correlation to wireless performance S21 indicates the isolation between two antennas Isolation For a wireless device with multiple antennas the power of different antennas is coupled with each other Antenna isolation is used to measure the power coupling The power radiated by an antenna might be received by...

Страница 53: ...g performance is optimal We must notice that GPS signal is coming from the satellite in the outer space it means that the incident waves are over our head The following radiation patterns are recommended for the antenna of ME909u 521 module Primary Secondary antenna omnidirectional GPS antenna directional point to the space In addition the secondary antenna s pattern should be complementary with t...

Страница 54: ...erly controlled On the user board there are various interference sources such as the LCD CPU audio circuits and power supply All the interference sources emit interference signals that affect the normal operation of the module For example the module sensitivity can be decreased due to interference signals Therefore during the design you need to consider how to reduce the effects of interference so...

Страница 55: ...FI Design Guide 4 6 1 Purpose ME909u 521 module supports LTE Band 1 Band 2 Band 3 GSM 1800 and GSM 1900 and each of that band can generate the 2nd or 3rd harmonic with the frequency about 5 GHz so that will deteriorate 5 GHz WIFI receiver performance That is why Co exsitence design needed Operating Band Tx Frequency range MHz 2nd order harmonic Fre Range MHz 3nd order harmonic Fre Range MHz 5GHz W...

Страница 56: ...tering The recommend key electrical specification for LPF and RF front end circuit are respectively listed in Table 4 5 and Figure 4 1 Table 4 5 The recommend key electrical specification for LPF Parameter Frequency Unit MHz Typical Value Unit dB Insert loss 300 2690 0 4 Attenuation 4900 5950 35 Figure 4 1 The recommend RF front end circuit ME909u 521 LPF Matching Network Matching Network MAIN_ AN...

Страница 57: ...ons Issue 05 2017 12 15 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 57 The recommend isolation between ME909u 521 module and WIFI antenna is above 30 dB The recommend isolation between ME909u 521 antenna and WIFI antenna is above 30 dB ...

Страница 58: ...features of ME909u 521 module including Absolute Ratings Operating and Storage Temperatures Power Supply Features Reliability Features EMC and ESD Features 5 2 Absolute Ratings Table 5 1 lists the absolute ratings for the ME909u 521 module Using the ME909u 521 module beyond these conditions may result in permanent damage to the module Table 5 1 Absolute ratings for the ME909u 521 module Symbol Spe...

Страница 59: ...atures 20 70 C Extended temperatures 1 30 75 C Ambient temperature for storage 40 85 C 1 When the ME909u 521 module works in the range of 30 C to 20 C or 70 C to 75 C NOT all its RF performances comply with 3GPP specifications 5 4 Power Supply Features 5 4 1 Input Power Supply Table 5 3 lists the requirements for input power of the ME909u 521 module Table 5 3 Requirements for input power for the M...

Страница 60: ... 521 module is normal voltage 3 8 V and all of test values are measured at room temperature Table 5 5 Averaged power off DC power consumption of ME909u 521 Description Test Value µA Notes Configuration Typical Power off 80 VBAT is ON and the module does not work Table 5 6 Averaged standby DC power consumption of ME909u 521 WCDMA HSDPA LTE GSM Description Bands Test Value mA Notes Configuration Typ...

Страница 61: ...SPA WCDMA UMTS bands 110 Module is powered up DRX cycle 8 2 56s Module is registered on the network and no data is transmitted USB is in active GPRS EDGE GSM bands 94 Module is powered up MFRMS 5 1 175s Module is registered on the network and no data is transmitted USB is in active Radio Off All bands 92 Module is powered up RF is disabled USB is in active Table 5 7 Averaged Data Transmission DC p...

Страница 62: ...SDPA Band 1 IMT2100 250 0 dBm Tx Power 305 10 dBm Tx Power 760 23 5 dBm Tx Power Band 2 PCS 1900 245 0 dBm Tx Power 315 10 dBm Tx Power 700 23 5 dBm Tx Power Band 5 850 MHz 220 0 dBm Tx Power 270 10 dBm Tx Power 650 23 5 dBm Tx Power Band 8 900 MHz 215 0 dBm Tx Power 270 10 dBm Tx Power 610 23 5 dBm Tx Power LTE LTE Band 1 270 0 dBm Tx Power 310 10 dBm Tx Power 830 23 dBm Tx Power LTE Band 2 255 0...

Страница 63: ...x Power 260 10 dBm Tx Power 540 23 dBm Tx Power LTE Band 20 265 0 dBm Tx Power 380 10 dBm Tx Power 685 23 dBm Tx Power Table 5 8 Averaged DC power consumption of ME909u 521 GPRS EDGE Description Test Value mA PCL Configuration Typical GPRS 850 370 5 1 Up 1 Down 520 2 Up 1 Down 660 4 Up 1 Down 195 10 1 Up 1 Down 300 2 Up 1 Down 460 4 Up 1 Down GPRS 900 365 5 1 Up 1 Down 560 2 Up 1 Down 700 4 Up 1 D...

Страница 64: ... 335 2 Up 1 Down 430 4 Up 1 Down 120 10 1 Up 1 Down 150 2 Up 1 Down 190 4 Up 1 Down EDGE 850 230 8 1 Up 1 Down 320 2 Up 1 Down 425 4 Up 1 Down 135 15 1 Up 1 Down 180 2 Up 1 Down 255 4 Up 1 Down EDGE 900 235 8 1 Up 1 Down 320 2 Up 1 Down 445 4 Up 1 Down 140 15 1 Up 1 Down 185 2 Up 1 Down 270 4 Up 1 Down EDGE 1800 175 2 1 Up 1 Down 235 2 Up 1 Down 310 4 Up 1 Down 120 10 1 Up 1 Down 140 2 Up 1 Down 1...

Страница 65: ...ed in Table 2 1 Table 5 9 Averaged GPS operation DC power consumption of ME909u 521 Description Test Value mA Notes Configuration Typical GPS fixing 100 RF is disabled USB is in active The Rx power of GPS is 130 dBm GPS tracking 100 The above values are the average of some test samples 5 5 Reliability Features Table 5 10 lists the test conditions and results of the reliability of the ME909u 521 mo...

Страница 66: ...with service connected Test duration 30 cycles 1 h 1 h cycle JESD22 A105 B 3pcs group Visual inspection ok Function test ok RF specification ok Damp heat cycling High temperature 55º C Low temperature 25º C Humidity 95 3 Operation mode working with service connected Test duration 6 cycles 12 h 12 h cycle JESD22 A101 B 3 pcs group Visual inspection ok Function test ok RF specification ok Thermal sh...

Страница 67: ...3 shocks for each axial direction JESD B1 04 C 3 pcs group Visual inspection ok Function test ok RF specification ok Drop test 0 8 m in height Drop the module on the marble terrace with one surface facing downwards six surfaces should be tested Operation mode no power no package IEC6006 8 2 32 3 pcs group Visual inspection ok Function test ok RF specification ok Life High temperature operating lif...

Страница 68: ...eatures The following are the EMC design comments Attention should be paid to static control in the manufacture assembly packaging handling storage process to reduce electrostatic damage to HUAWEI module RSE Radiated Spurious Emission may exceed the limit defined by EN301489 if the antenna port is protected by TVS Transient Voltage Suppressor which is resolved by making some adjustment on RF match...

Страница 69: ...can be easily oxidized Their ground resistance must be less than 20 Ω The parts of the equipment devices and tools that touch the ESD sensitive components and moving parts that are close to the ESD sensitive components must be made of ESD materials and have sound ground connection The parts that are not made of ESD materials must be handled with ESD treatment such as painting the ESD coating or io...

Страница 70: ...ion Assembly Processes Specification of Rework 6 2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40 C and the relative humidity less than 90 in order to ensure the weldability within 12 months 6 3 Moisture Sensitivity The moisture sensitivity is level 3 After unpacking the module must be assembled within 168 hours under the environmen...

Страница 71: ...t Huawei Technologies Co Ltd 71 Table 6 1 Baking parameters Baking Temperature Baking Condition Baking Duration Remarks 125 C 5 C Relative humidity 60 8 hours Moving storing and processing the product must comply with IPC JEDEC J STD 033 6 4 Dimensions and Interfaces Figure 6 1 shows the dimensions in details Figure 6 1 Dimensions Unit mm ...

Страница 72: ...al Copyright Huawei Technologies Co Ltd 72 6 5 Packaging HUAWEI LGA module uses five layers ESD pallet anti vibration foam and vacuum packing into cartons The following figure shows the packaging Module quantity per tray 5 x 9 45 pcs tray Use vacuum packages five trays per carton module quantity per carton 5 x 45 225pcs carton ...

Страница 73: ...al and is able to endure the high temperature of 260 C Figure 6 2 ME909u 521 label The picture mentioned above is only for reference 6 7 Customer PCB Design 6 7 1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel immersion Gold ENIG Organic Solderability Preservative OSP may also be used ENIG preferred 6 7 2 PCB Pad Design To achieve assembly yields and solder joints of h...

Страница 74: ...proved The solder mask must be 100 µm 150 µm larger than the pad that is the single side of the solder mask must be 50 µm 75 µm larger than the pad The specific size depends on the processing capability of the PCB manufacturer 6 7 4 Requirements on PCB Layout To reduce deformation a thickness of at least 1 0 mm is recommended Other devices must be located more than 3 mm 5 mm recommended away from ...

Страница 75: ...other through via holes Increase the quantity of the PCB ground planes The ground planes should be as continuous as possible If a fan is deployed place the module at the cold air inlet Use heat sink thermal conductive material and product enclosure to enhance the heat dissipation of the module Use anodized heat sink on the shielding case or the customer PCB on bottom side for optimal heat dissipat...

Страница 76: ...ide of the customer PCB you should attach the thermal conductive material between the customer PCB and the heat sink as shown in Figure 6 5 and Figure 6 6 Preferably we recommend the heat sink be installed below the bottom side of the customer PCB Use more pin fins to enlarge heat dissipation area Figure 6 5 Adding heat sink to the module for optimal heat dissipation Module PCB Heat sink Conductiv...

Страница 77: ...perature zones are recommended Use reflow ovens or rework stations for soldering because LGA modules have large solder pads and cannot be soldered manually 6 9 2 Stencil Design It is recommended that the stencil for the LGA module be 0 15 mm in thickness For the stencil design See the following figure Figure 6 7 Recommended stencil design of LGA module Unit mm The stencil design has been qualified...

Страница 78: ...temperature of the LGA module see the following figure Figure 6 8 Reflow profile 240 300 180 217 165 120 60 0 s C 60s 100s 45s 80s 235 C Tmax 245 C Table 6 2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40 C 165 C Heating rate 0 5 C s 2 C s Soak zone 165 C 217 C t1 t2 60s 100s Reflow zone 217 C t3 t4 45s 80s Peak reflow temperature 235 C 245 C Cooling zone Cooling rate 2 C s ...

Страница 79: ...hat can t stand high temperature before rework If the device to be reworked is beyond the storage period bake the device according to Table 6 1 6 10 3 Removing of the Module The solder is molten and reflowed through heating during the module removing process The heating rate must be quick but controllable in order to melt all the solder joints simultaneously Pay attention to protect the module PCB...

Страница 80: ...rework 6 10 4 Welding Area Treatment Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder Step 2 Clean the pad and remove the flux residuals Step 3 Solder pre filling Before the module is installed on a board apply some solder paste to the pad of the module by using the rework fixture and stencil or apply some solder paste to the pad on the PCB by using a...

Страница 81: ... module is installed on the pad after applied with some solder A special rework device must be used for the rework 6 10 6 Specifications of Rework Temperature parameter of rework for either the removing or welding of the module the heating rate during the rework must be equal to or smaller than 3 C s and the peak temperature between 240 C 250 C The following parameters are recommended during the r...

Страница 82: ... 7 Certifications 7 1 About This Chapter This chapter gives a general description of certifications of ME909u 521 7 2 Certifications Table 7 1 shows certifications the ME909u 521 has been implemented For more demands please contact us for more details about this information Table 7 1 Product Certifications Certification Model name ME909u 521 CE GCF RoHS WEEE ...

Страница 83: ...lems consult your service provider Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker If you are using an electronic medical device consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device 8 3 Area with Inflammables a...

Страница 84: ...the rules and regulations of airline companies When boarding or approaching a plane power off your wireless device Otherwise the radio signal of the wireless device may interfere with the plane control signals 8 6 Safety of Children Do not allow children to use the wireless device without guidance Small and sharp components of the wireless device may cause danger to children or cause suffocation i...

Страница 85: ... not leave your wireless device and accessories in a place with a considerably low or high temperature Use only accessories of the wireless device approved by the manufacture Contact the authorized service center for any abnormity of the wireless device or accessories Do not dismantle the wireless device or accessories Otherwise the wireless device and accessories are not covered by the warranty T...

Страница 86: ...ss than the highest limit value specified in the related Harmonized Standard The frequency bands and transmitting power radiated and or conducted nominal limits applicable to this radio equipment are as follows GSM 900 37 dBm GSM 1800 34 dBm WCDMA 900 2100 25 7 dBm LTE Band 1 3 7 8 20 25 7 dBm Software Information Software updates will be released by the manufacturer to fix bugs or enhance functio...

Страница 87: ...ERVED RESERVED RESERVED RESERVED RESERVED RESERVED JTAG_RTCK JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS JTAG_TRST_N NC NC RESERVED NC NC NC NC NC NC NC NC NC NC PCM_CLK PCM_DIN PCM_DOUT PCM_SYNC RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED SIM_CLK SIM_DATA RESERVED SIM_RESET SIM_VCC RESERVED RESERVED RESERVED RESERVED RESERVED NC NC UART0_CTS UART0_RTS UART0_RX UART0_TX UART1_RX UART1_TX USB_DM ...

Страница 88: ... 8PSK 8 Phase Shift Keying AUX Auxiliary BER Bit Error Rate BLER Block Error Rate BIOS Basic Input Output System CCC China Compulsory Certification CE European Conformity CMOS Complementary Metal Oxide Semiconductor CTL Control CS Circuit Switched DC Direct Current DCE Data Communication Equipment DL Down Link DMA Direct Memory Access DTE Data Terminal Equipment EBU External Bus Unit EDGE Enhanced...

Страница 89: ...for Mobile Communication HBM Human Body Model HSDPA High Speed Downlink Packet Access HSPA Enhanced High Speed Packet Access HSUPA High Speed Up link Packet Access ISO International Standards Organization JTAG Joint Test Action Group LCP Liquid Crystal Polyester LDO Low Dropout LED Light Emitting Diode LGA Land Grid Array MCP Multi chip Package MDM Mobile Data Modem MO Mobile Originated MT Mobile ...

Страница 90: ...rt Message Service TBD To Be Determined TIS Total Isotropic Senstivity TRP Total Radiated Power TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver Transmitter UL Up Link UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VID Vendor IDentity VSWR Voltage Standing Wave Ratio WEEE Waste Electrica...

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