HPE ProLiant DX190r Gen10, Руководство по техническому обслуживанию и ремонту

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7
To ensure proper thermal cooling with NVIDIA Tesla P100 GPUs or NVIDIA Tesla V100 GPUs installed in the server.
The server must be installed in the Apollo DX2200 Gen10 Chassis or the Apollo DX2600 Gen10 Chassis. The
thermal bezel blanks must also be installed in specific drive bays. For more information, see
Installing drive blanks
and thermal bezel blanks for components with thermal limitations on page 35.
8
The last three bays are populated with bezel blanks.
9
The last six bays are populated with bezel blanks.
10
The last four bays are populated with removable blanks.
Thermal limitations for components in systems with the Enhanced
Processor Performance feature disabled
Processors
The following limitations are for the Intel Xeon Gold 6244 (G6244) processor:
• The processor does not support enhanced processor performance.
• LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo
DX2200 Gen10 Chassis series with three drives per node.
Description Chassis Fan configuration Number of drives
supported by the
server
Maximum inlet
ambient
temperature
Processor with
a TDP of 150
W, except
G6244 Apollo DX2200
Gen10 Chassis
(12 LFF
backplane)
Redundant and
nonredundant 5 to 6 drives
1
25°C (77°F)
5 to 6 drives
2
25°C (77°F)
0 to 4 drives
3
30°C (86°F)
Apollo DX2600
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Redundant and
nonredundant 0 to 10 drives
30°C (86°F)
Apollo DX2800
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Redundant and
nonredundant 0 to 24 drives
30°C (86°F)
Apollo DX2800
Gen10 Chassis
(16 NVMe
backplane)
Redundant and
nonredundant 0 to 8 drives
35°C (95°F)
Intel Xeon Gold
6244 (G6244)
processor Apollo DX2200
Gen10 Chassis Redundant and
nonredundant 5 to 6 drives
1
22°C (71.6°F)
5 to 6 drives
2
Not supported
Table Continued
Specifications 111