Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface. .
2. Remove the screw in red to remove the stand.
3. Remove the aluminum foil/the black tape and remove the key board.
4. Remove the pin.
5. Remove the screws.
6. Remove the mainframe
7. Remove the MYLAR and tape.
8. Remove the screws in the red to remove the main board and power board
9. Remove the connect pin
10. Remove the MYLAR
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
