EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
refractory ceramic fibers
N/A
0
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1Phillips screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble U-Case
2. Disassemble Battery and HDD
3. Disassemble MB and Speaker
4. Disassemble LCD Module
5.
6.
7.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step 1.
a. Loosen 12x screws from the bottom of system
b. Take U-Case Out
