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EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: Notebooks and Tablet PCs

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP OMEN X by HP 15 Laptop 

 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contact 

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries   

           

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”):

 

[x] screws 
[          ] snaps 
[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  

15.6”

           

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

            

           

External electrical cables and cords 

 DC Cable for External Power Supply 

1           

Gas Discharge Lamps 

            

           

Содержание OMEN X 15

Страница 1: ...roduct which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 4 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries Li Ion batteries Include all Li Ion batteries if more than...

Страница 2: ...ver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Dis fasten BASE Screw 6 2 Remove BASE and remove Battery connector 3 Dis fasten SSD screw 2 4 Remove SSD 2 PCS and Ram 2PCS 5 Dis fasten Battery and speaker screw 7 6 Remove ...

Страница 3: ... Hinge BKT 2PCS Camera module 23 Remove Antenna module and Backlight DB 24 END 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations 3 21 Dis fasten BASE Screw 6 3 22 Remove BASE and remove Battery connector 3 23 Dis fasten SSD ...

Страница 4: ...late Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 24 Remove SSD 2 PCS and Ram 2PCS 3 25 Dis fasten Battery and speaker screw 7 3 26 Remove Battery and Speaker ...

Страница 5: ...Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 27 Dis fasten IO BKT and DC BKT screw 4 3 28 Remove IO BKT and DC BKT 3 29 Dis fasten Thermal model Screw 6 and Relase Thermal modle screw 7 ...

Страница 6: ...9 May 2018 HPI instructions for this template are available at EL MF877 01 3 30 Remove Thernal module and DC in Cable 3 31 Dis fasten PCB screw 7 and 2nd panel DB screw 2 3 32 Release KB FPC 2nd panel DB Antenna connector IR FFC LVDS FPC Power FFC and Remove MB PCB ...

Страница 7: ...ation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 33 Dis fasten Cu plate screw 1 Power screw 1 and IR DB screw 2 3 34 Remove Cu Plate and KB FPC 3 35 Remove 2nd DB with 2nd Panel FPC IR DB with IR FFC and Power DB ...

Страница 8: ...ion date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 36 TOP remove release dis fasten Hinge screw 6 and remove LCD part 3 37 Remove Bezel dis fasten hinge cap screw 2 and remove hing cap 2PCS 3 38 Dis fasten Hinge screw 6 ...

Страница 9: ...emplate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 39 Remove Panel Easy pull Adhesive 3 40 Remove Panel and Hinge 2PCS 3 41 Dis fasten hinge bkt screw 6 ...

Страница 10: ... Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 3 42 Remove LVDS FPC Backlight module Hinge BKT 2PCS Camera module 3 43 Remove Antenna module and Backlight DB 3 44 END ...

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