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EL-MF877-00                                                Page 1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: External Options

 

Marketing Name / Model 
[List multiple models if applicable.] 

OMEN by HP 15 Laptop PC

 

OMEN by HP Laptop 

OMEN by HP Laptop 15 

 

 

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for 
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on 
the plastic part. For any questions on plastic marking, please contac

HP’s Sustainability Contact

.    

1.0 Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cmMB 
 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button 
style batteries  BATTERY 

Li-Ion batteries.  Include all Li-Ion batteries if more 
than one is provided with the product (such as a 
detachable notebook keyboard battery, RTC coin cell, 
etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 “x” 

inside the

 “[ ]”): 

[4] screws 
[          ] snaps 
[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

           

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater 
than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  LCD 

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring 

            

           

Содержание OMEN 15

Страница 1: ...ing selective treatment 1 2 Enter the quantity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cmMB 1 Batteries excluding Li Ion batteries All types including standard alkaline coin or b...

Страница 2: ...ibers Components parts and materials containing radioactive substances 2 0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Description 1 Description 2 Description 3 Description 4 Description 5 3 0 Product Disassem...

Страница 3: ...lable at EL MF877 01 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations Disassembly process Step1 Remove log low assy Step2 Remove battery pack ...

Страница 4: ... MF877 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step3 Remove HDD assy Step4 Remove NGFF Step5 Remove Thermal module ...

Страница 5: ...Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step6 Remove MB and SD board PCB Step7 Remove LCD assy Step8 Remove Speakers DC IN cable ...

Страница 6: ...plate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step9 Remove Power Board and Thermal Sensor Board Step10 Remove bezel hinge cap assy Step11 Remove LCD panel ...

Страница 7: ...mplate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step12 Remove hinge r hinge l assy Step13 Remove LCD support bracket Step14 Remove EDP cable antenna cable ...

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